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"Sensor module"
41 professional editorial images found
#13413554
7 Mar 2026
The AGIBOT G1, powered by Unitree, is a 1.30-meter-tall humanoid robot dressed in a professional waiter's outfit. It demonstrates its high-performance bipedal balance by carrying a tray with glasses in each hand. The robot features a 360-degree LiDAR sensor and a depth camera for precise obstacle avoidance. It is powered by an 8-core high-performance CPU and an optional NVIDIA Jetson Orin module, which provides up to 275 TOPS to execute its WorkGPT embodied AI model during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13414159
7 Mar 2026
An ''exploded view'' display of the Huawei Mate XT Ultimate Design tri-foldable smartphone showcases its internal components and engineering at the Fira Gran Via in Barcelona, Spain, on March 5, 2026. The exhibit highlights the complex Tiangong hinge mechanism made of ultra-high strength steel. It features the dissection of the 10.2-inch flexible OLED display panel alongside the HiSilicon Kirin 9010 (7nm) octa-core processor and the layered structure of the 5,600mAh ultra-thin silicon-carbon battery system. Individual modules of the Ultra Aperture XMAGE camera system are visible, including the 50-megapixel main sensor with its 10-stop variable aperture mechanism and the 12-megapixel periscope telephoto lens with 5.5x optical zoom, demonstrating the precise arrangement required to maintain a 3.6mm unfolded thickness during the Mobile World Congress (MWC).
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#13406548
6 Mar 2026
A detailed view of the TECNO Modular Magnetic Concept Phone (MODA Edition) showcases at MWC 2026. The image highlights the revolutionary Modular Magnetic Interconnection Technology (MMIT), featuring the large-format Telephoto Lens Module docked onto the ultra-slim 4.9mm chassis. The module, which houses a dedicated high-resolution image sensor and a physical optical zoom assembly, transforms the minimalist smartphone into a high-performance imaging system. The sleek, industrial design of the hardware, with its exposed magnetic contact points and metallic finish, underscores the shift toward a customizable, modular future for mobile technology during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#12994888
16 Nov 2025
The Onsemi logo is displayed on a mobile phone with the company branding visible in the background, in this photo illustration in Brussels, Belgium, on November 16, 2025.
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#12994889
16 Nov 2025
The Onsemi logo is displayed on a mobile phone with the company branding visible in the background, in this photo illustration in Brussels, Belgium, on November 16, 2025.
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#12994890
16 Nov 2025
The Onsemi logo is displayed on a mobile phone with the company branding visible in the background, in this photo illustration in Brussels, Belgium, on November 16, 2025.
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#12994891
16 Nov 2025
The Onsemi logo is displayed on a mobile phone with a visual digital background in this photo illustration in Brussels, Belgium, on November 16, 2025.
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#12994892
16 Nov 2025
The Onsemi logo is displayed on a mobile phone with the company branding visible in the background, in this photo illustration in Brussels, Belgium, on November 16, 2025.
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#12994893
16 Nov 2025
The Onsemi logo is displayed on a mobile phone with a visual digital background in this photo illustration in Brussels, Belgium, on November 16, 2025.
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#12994894
16 Nov 2025
The Onsemi logo is displayed on a mobile phone with a financial stock graph visible in the background, in this photo illustration in Brussels, Belgium, on November 16, 2025.
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#12994895
16 Nov 2025
The Onsemi logo is displayed on a mobile phone with a visual digital background in this photo illustration in Brussels, Belgium, on November 16, 2025.
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#12994896
16 Nov 2025
The Onsemi logo is displayed on a mobile phone with a financial stock graph visible in the background, in this photo illustration in Brussels, Belgium, on November 16, 2025.
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#12994897
16 Nov 2025
The Onsemi logo is displayed on a mobile phone with a financial stock graph visible in the background, in this photo illustration in Brussels, Belgium, on November 16, 2025.
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#12901911
24 Oct 2025
The sensor module chip of Next Chip company product is displayed at FIX 2025 at EXCO in Daegu, South Korea, on October 24, 2025. The 2025 Future Innovation Tech Expo (FIX 2025) takes place from Wednesday, October 22 to Saturday, October 25 at EXCO in Daegu, South Korea. Under the theme ''The Future Has Already Begun: All on AI,'' the event spotlights cutting-edge advancements across mobility, robotics, ICT, and startups.
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#13457704
16 Mar 2026
A high-fidelity scale model of a next-generation Low Earth Orbit (LEO) multi-mission satellite is displayed at the Space Communications zone during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This unit represents advancements in 5G-Advanced Non-Terrestrial Networks (5G-NTN), designed to provide seamless direct-to-cell connectivity and high-speed backhaul for remote areas. The platform is powered by a radiation-hardened dual-core LEON4 on-board processor combined with a specialized FPGA-based Neural Processing Unit for edge AI data filtering. The satellite features a modular payload including a high-resolution multispectral optical sensor with a 30-centimeter ground sampling distance, supported by a 50-megapixel CMOS imaging system for earth observation. Its communication suite utilizes a Software Defined Radio architecture capable of handling Ka-band and Q/V-band frequencies, integrated with optical laser links for ultra-secure inter-satellite data relay. The demonstration highlights the convergence of terrestrial and space-based infrastructure, enabling global IoT coverage and emergency telecommunications via standard smartphone devices.
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#13439915
13 Mar 2026
A digital display at the Nokia booth showcases the Vadiio Generative AI dashboard, visualizing real-time traffic light synchronization and On-Delivery autonomous route optimization at the Fira Gran Via. The system is powered by the NVIDIA Blackwell HGX B200 server architecture at the edge, processing multimodal data through Nokia's AVA (Adaptive Virtual Assistant) autonomous operations software. The interface demonstrates how generative AI models, running on Intel Xeon 6 processors with vRAN Boost, analyze live video feeds from 48-megapixel smart city sensors to adjust delivery paths and signal timings. The demonstration highlights the integration of the ReefShark SoC for ultra-low latency data transmission, ensuring that On-Delivery robots, equipped with NVIDIA Jetson Orin modules, receive path updates in less than 10ms to avoid congestion during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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