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"processor"
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#12446652
5 Jun 2025
Holios supercomputer, the fastest supercomputer in Poland and its processors is seen Academic Computer Center CYFRONET AGH which provides academics and researchers with the fastest supercomputer in Poland and one of the fastest in the world as participants of EUIndTech2025 conference visit on June 4, 2025 in Krakow, Poland. EUIndTech2025 brings together stakeholders from research organizations, industry, NGOs and policymakers to discuss state-of-the-art technologies, challenges and trends.
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#12446631
5 Jun 2025
Holios supercomputer, the fastest supercomputer in Poland and its electrical switchboard is seen Academic Computer Center CYFRONET AGH which provides academics and researchers with the fastest supercomputer in Poland and one of the fastest in the world as participants of EUIndTech2025 conference visit on June 4, 2025 in Krakow, Poland. EUIndTech2025 brings together stakeholders from research organizations, industry, NGOs and policymakers to discuss state-of-the-art technologies, challenges and trends.
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#12446627
5 Jun 2025
Holios supercomputer, the fastest supercomputer in Poland and its cooling system is seen Academic Computer Center CYFRONET AGH which provides academics and researchers with the fastest supercomputer in Poland and one of the fastest in the world as participants of EUIndTech2025 conference visit on June 4, 2025 in Krakow, Poland. EUIndTech2025 brings together stakeholders from research organizations, industry, NGOs and policymakers to discuss state-of-the-art technologies, challenges and trends.
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#12227013
23 May 2025
A woman from MediaTek shows two congressmen the difference between their new MediaTek Dimensity 9400 chip on an Android device and Apple's A-series chip on an iPhone during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12227024
23 May 2025
An image of MediaTek's flagship chip, the MediaTek Dimensity 9400, an all-big core CPU designed for AI-equipped smartphones by the Taiwanese semiconductor manufacturer, is displayed during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12226829
23 May 2025
The Qualcomm Incorporated logo, the American multinational corporation that creates semiconductors, software, and services related to wireless technology and the creator of the suite of system on a chip (SoC) semiconductor products for mobile devices Snapdragon, appears on their pavilion during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12226832
23 May 2025
The Qualcomm Incorporated logo, the American multinational corporation that creates semiconductors, software, and services related to wireless technology and the creator of the suite of system on a chip (SoC) semiconductor products for mobile devices Snapdragon, appears on their pavilion during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12226834
23 May 2025
The Qualcomm Incorporated logo, the American multinational corporation that creates semiconductors, software, and services related to wireless technology and the creator of the suite of system on a chip (SoC) semiconductor products for mobile devices Snapdragon, appears on their pavilion during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12227017
23 May 2025
A tri-folding screen is exhibited at the MediaTek pavilion as the Taiwanese company's new flagship chip, Dimensity 9400, includes support for scaling content across extended screens at the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397023
22 May 2025
A woman from MediaTek shows two congressmen the difference between their new MediaTek Dimensity 9400 chip on an Android device and Apple's A-series chip on an iPhone during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397031
22 May 2025
An image of MediaTek's flagship chip, the MediaTek Dimensity 9400, an all-big core CPI designed for AI-equipped smartphones by the Taiwanese semiconductor manufacturer, is displayed during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397040
22 May 2025
The HTC Vive, a virtual reality, augmented reality, and mixed reality headset by the Chinese company powered by Snapdragon, is exhibited in black at the Qualcomm pavilion during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397041
22 May 2025
The HTC Vive, a virtual reality, augmented reality, and mixed reality headset by the Chinese company powered by Snapdragon, is exhibited in black at the Qualcomm pavilion during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12396980
22 May 2025
The Intel logo is displayed during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12290099
21 Apr 2025
The Nvidia logo with a person holding a phone in their hand is seen in Knurow, Poland, on April 20, 2025. (Photo Illustration by Klaudia Radecka/NurPhoto)
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#12238799
7 Apr 2025
LAS VEGAS, USA - JANUARY 08: The ROG G700 Gaming Desktop (left), Tryx case (center), and GeForce RTX graphics card (right), powered by Intel Core Ultra Series 2 processors, are showcased at CES 2025, highlighting next-gen gaming power and performance, in Las Vegas, Nevada, USA, on January 8 2025.
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