"Module"

#13413450

7 Mar 2026

The AGIBOT X2, a compact humanoid robot featuring 25 degrees of freedom (DoF) and a high-torque PowerFlow joint system, performs a synchronized dance routine to demonstrate its dynamic balance and embodied AI capabilities. It is powered by the NVIDIA Orin NX computing module and an integrated RGB-D depth camera for real-time spatial awareness. The Shanghai-based robotics firm showcases its Robot-as-a-Service (RaaS) platform during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413451

7 Mar 2026

The AGIBOT X2, a compact humanoid robot featuring 25 degrees of freedom (DoF) and a high-torque PowerFlow joint system, performs a synchronized dance routine to demonstrate its dynamic balance and embodied AI capabilities. It is powered by the NVIDIA Orin NX computing module and an integrated RGB-D depth camera for real-time spatial awareness. The Shanghai-based robotics firm showcases its Robot-as-a-Service (RaaS) platform during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413452

7 Mar 2026

The AGIBOT X2, a compact humanoid robot featuring 25 degrees of freedom (DoF) and a high-torque PowerFlow joint system, performs a synchronized dance routine to demonstrate its dynamic balance and embodied AI capabilities. It is powered by the NVIDIA Orin NX computing module and an integrated RGB-D depth camera for real-time spatial awareness. The Shanghai-based robotics firm showcases its Robot-as-a-Service (RaaS) platform during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413552

7 Mar 2026

A group of congress attendees observes the AGIBOT X2 (Lingxi X2), an agile bipedal humanoid robot standing 1.31 meters tall, as it demonstrates its 28 degrees of freedom (DoF) and multimodal AI capabilities, featuring an integrated interactive RGB camera and a VLM (Vision Language Model) powered by dual Rockchip RK3588 processors and an optional NVIDIA Orin NX module (157 TOPS) for real-time facial recognition and intent understanding during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413553

7 Mar 2026

The AGIBOT G1, powered by Unitree, is a 1.30-meter-tall humanoid robot dressed in a professional waiter's outfit. It demonstrates its high-performance bipedal balance by carrying a tray with glasses in each hand. The robot features a 360-degree LiDAR sensor and a depth camera for precise obstacle avoidance. It is powered by an 8-core high-performance CPU and an optional NVIDIA Jetson Orin module, which provides up to 275 TOPS to execute its WorkGPT embodied AI model during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413554

7 Mar 2026

The AGIBOT G1, powered by Unitree, is a 1.30-meter-tall humanoid robot dressed in a professional waiter's outfit. It demonstrates its high-performance bipedal balance by carrying a tray with glasses in each hand. The robot features a 360-degree LiDAR sensor and a depth camera for precise obstacle avoidance. It is powered by an 8-core high-performance CPU and an optional NVIDIA Jetson Orin module, which provides up to 275 TOPS to execute its WorkGPT embodied AI model during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13414159

7 Mar 2026

An ''exploded view'' display of the Huawei Mate XT Ultimate Design tri-foldable smartphone showcases its internal components and engineering at the Fira Gran Via in Barcelona, Spain, on March 5, 2026. The exhibit highlights the complex Tiangong hinge mechanism made of ultra-high strength steel. It features the dissection of the 10.2-inch flexible OLED display panel alongside the HiSilicon Kirin 9010 (7nm) octa-core processor and the layered structure of the 5,600mAh ultra-thin silicon-carbon battery system. Individual modules of the Ultra Aperture XMAGE camera system are visible, including the 50-megapixel main sensor with its 10-stop variable aperture mechanism and the 12-megapixel periscope telephoto lens with 5.5x optical zoom, demonstrating the precise arrangement required to maintain a 3.6mm unfolded thickness during the Mobile World Congress (MWC).

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#13406543

6 Mar 2026

A large crowd gathers at the TECNO booth during the final day of MWC 2026 to experience the Modular Magnetic Concept Phone. Attendees test the innovative Modular Magnetic Interconnection Technology, which allows for the instant attachment of hardware modules via a high-strength magnetic system. The demonstration features the Telephoto Lens and Action Camera modules, which transform the ultra-slim 4.9mm smartphone into a professional-grade imaging device. This concept reflects TECNO's vision for a future where mobile hardware is as adaptable as software, enabling users to reconfigure their device's physical capabilities on demand during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13406548

6 Mar 2026

A detailed view of the TECNO Modular Magnetic Concept Phone (MODA Edition) showcases at MWC 2026. The image highlights the revolutionary Modular Magnetic Interconnection Technology (MMIT), featuring the large-format Telephoto Lens Module docked onto the ultra-slim 4.9mm chassis. The module, which houses a dedicated high-resolution image sensor and a physical optical zoom assembly, transforms the minimalist smartphone into a high-performance imaging system. The sleek, industrial design of the hardware, with its exposed magnetic contact points and metallic finish, underscores the shift toward a customizable, modular future for mobile technology during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13406549

6 Mar 2026

A close-up view of the base unit of the TECNO Modular Magnetic Concept Phone (ATOM Edition) is on display at MWC 2026. The device showcases an industry-leading ultra-slim profile of just 4.9mm, achieved by relocating traditional internal components into external magnetic modules. The rear of the handset features a specialized Magnetic Interconnection surface with exposed contact points, allowing for seamless power and data transfer with various hardware attachments. Its minimalist silver finish and compact form factor represent a radical departure from traditional smartphone architecture, prioritizing a ''thin-and-light'' core that can be expanded on demand during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13404017

5 Mar 2026

Eurosam SAM missile system by MBDA and Thales Group at Paris Air Show 2025. The Eurosam Future Surface-to-Air Family of missiles or FSAF autonomous guided air shield interceptor system with vertical ground launched system MLT with use of Aster 15 or Aster 30 rockets, multi-function radar MRI and an Engagement Module ME on display during at Le Bourget Airport, near Paris, France on June 18, 2025

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#13404018

5 Mar 2026

Eurosam SAM missile system by MBDA and Thales Group at Paris Air Show 2025. The Eurosam Future Surface-to-Air Family of missiles or FSAF autonomous guided air shield interceptor system with vertical ground launched system MLT with use of Aster 15 or Aster 30 rockets, multi-function radar MRI and an Engagement Module ME on display during at Le Bourget Airport, near Paris, France on June 18, 2025

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#13404019

5 Mar 2026

Eurosam SAM missile system by MBDA and Thales Group at Paris Air Show 2025. The Eurosam Future Surface-to-Air Family of missiles or FSAF autonomous guided air shield interceptor system with vertical ground launched system MLT with use of Aster 15 or Aster 30 rockets, multi-function radar MRI and an Engagement Module ME on display during at Le Bourget Airport, near Paris, France on June 18, 2025

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#13404020

5 Mar 2026

Eurosam SAM missile system by MBDA and Thales Group at Paris Air Show 2025. The Eurosam Future Surface-to-Air Family of missiles or FSAF autonomous guided air shield interceptor system with vertical ground launched system MLT with use of Aster 15 or Aster 30 rockets, multi-function radar MRI and an Engagement Module ME on display during at Le Bourget Airport, near Paris, France on June 18, 2025

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#13404021

5 Mar 2026

Eurosam SAM missile system by MBDA and Thales Group at Paris Air Show 2025. The Eurosam Future Surface-to-Air Family of missiles or FSAF autonomous guided air shield interceptor system with vertical ground launched system MLT with use of Aster 15 or Aster 30 rockets, multi-function radar MRI and an Engagement Module ME on display during at Le Bourget Airport, near Paris, France on June 18, 2025

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#13404022

5 Mar 2026

Eurosam SAM missile system by MBDA and Thales Group at Paris Air Show 2025. The Eurosam Future Surface-to-Air Family of missiles or FSAF autonomous guided air shield interceptor system with vertical ground launched system MLT with use of Aster 15 or Aster 30 rockets, multi-function radar MRI and an Engagement Module ME on display during at Le Bourget Airport, near Paris, France on June 18, 2025

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