"Action Camera modules"

#13406543

6 Mar 2026

A large crowd gathers at the TECNO booth during the final day of MWC 2026 to experience the Modular Magnetic Concept Phone. Attendees test the innovative Modular Magnetic Interconnection Technology, which allows for the instant attachment of hardware modules via a high-strength magnetic system. The demonstration features the Telephoto Lens and Action Camera modules, which transform the ultra-slim 4.9mm smartphone into a professional-grade imaging device. This concept reflects TECNO's vision for a future where mobile hardware is as adaptable as software, enabling users to reconfigure their device's physical capabilities on demand during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413350

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413351

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413352

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413353

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413354

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413449

7 Mar 2026

The AGIBOT X2, a compact humanoid robot featuring 25 degrees of freedom (DoF) and a high-torque PowerFlow joint system, performs a synchronized dance routine to demonstrate its dynamic balance and embodied AI capabilities. It is powered by the NVIDIA Orin NX computing module and an integrated RGB-D depth camera for real-time spatial awareness. The Shanghai-based robotics firm showcases its Robot-as-a-Service (RaaS) platform during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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