"CMOS technology"

#13457704

16 Mar 2026

A high-fidelity scale model of a next-generation Low Earth Orbit (LEO) multi-mission satellite is displayed at the Space Communications zone during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This unit represents advancements in 5G-Advanced Non-Terrestrial Networks (5G-NTN), designed to provide seamless direct-to-cell connectivity and high-speed backhaul for remote areas. The platform is powered by a radiation-hardened dual-core LEON4 on-board processor combined with a specialized FPGA-based Neural Processing Unit for edge AI data filtering. The satellite features a modular payload including a high-resolution multispectral optical sensor with a 30-centimeter ground sampling distance, supported by a 50-megapixel CMOS imaging system for earth observation. Its communication suite utilizes a Software Defined Radio architecture capable of handling Ka-band and Q/V-band frequencies, integrated with optical laser links for ultra-secure inter-satellite data relay. The demonstration highlights the convergence of terrestrial and space-based infrastructure, enabling global IoT coverage and emergency telecommunications via standard smartphone devices.

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#13413764

7 Mar 2026

The Antigravity A1 360-degree drone and Vision Goggles FPV headset demonstrate a dual 1/1.28-inch CMOS sensor system capable of 8K resolution video at 30 fps and 55-megapixel still images with invisible drone technology at the Fira Gran Via exhibition. The ecosystem is powered by the Qualcomm Snapdragon AR1 Gen 1 platform within the goggles and uses the OmniLink 360 transmission system for ultra-low latency head-tracking. It highlights its dual 2.5K Micro-OLED displays with pancake optics and the intuitive Grip motion controller for point-to-fly navigation during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413769

7 Mar 2026

The Antigravity A1 360-degree drone and Vision Goggles FPV headset demonstrate a dual 1/1.28-inch CMOS sensor system capable of 8K resolution video at 30 fps and 55-megapixel still images with invisible drone technology at the Fira Gran Via exhibition. The ecosystem is powered by the Qualcomm Snapdragon AR1 Gen 1 platform within the goggles and uses the OmniLink 360 transmission system for ultra-low latency head-tracking. It highlights its dual 2.5K Micro-OLED displays with pancake optics and the intuitive Grip motion controller for point-to-fly navigation during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#12708057

2 Sep 2025

The chip manufacturing basic materials, CMOS wafer (left) and GaAs wafer (right), are exhibited by Chengdu Ruidiwei Technology Co., Ltd. at the 11th World Radar Expo in Hefei, Anhui Province, China, on May 17, 2025.

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