"High-speed data"

#13457705

16 Mar 2026

A specialized hybrid satellite smartphone, featuring a prominent integrated rectangular high-gain antenna, is demonstrated for mission-critical communications at the Satellite Pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This ruggedized terminal is powered by the Qualcomm Snapdragon 8 Gen 3 mobile platform, integrated with the Snapdragon X75 5G Modem-RF System, which supports 3GPP Release-17 Non-Terrestrial Network (NTN) standards for satellite-to-phone connectivity. The device is equipped with a 50-megapixel primary camera sensor (f/1.9 aperture) and a secondary 8-megapixel thermal imaging sensor for industrial inspections in remote areas. The elongated rectangular antenna is specifically designed to facilitate dual-band communication with L-band and S-band satellite constellations, ensuring stable voice and high-speed data transmission even in environments without terrestrial cellular coverage. The demonstration highlights the device's IP68 water resistance and its ability to act as a portable Wi-Fi hotspot via satellite for other tactical devices in the field.

Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.

#13457704

16 Mar 2026

A high-fidelity scale model of a next-generation Low Earth Orbit (LEO) multi-mission satellite is displayed at the Space Communications zone during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This unit represents advancements in 5G-Advanced Non-Terrestrial Networks (5G-NTN), designed to provide seamless direct-to-cell connectivity and high-speed backhaul for remote areas. The platform is powered by a radiation-hardened dual-core LEON4 on-board processor combined with a specialized FPGA-based Neural Processing Unit for edge AI data filtering. The satellite features a modular payload including a high-resolution multispectral optical sensor with a 30-centimeter ground sampling distance, supported by a 50-megapixel CMOS imaging system for earth observation. Its communication suite utilizes a Software Defined Radio architecture capable of handling Ka-band and Q/V-band frequencies, integrated with optical laser links for ultra-secure inter-satellite data relay. The demonstration highlights the convergence of terrestrial and space-based infrastructure, enabling global IoT coverage and emergency telecommunications via standard smartphone devices.

Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.

#13457466

16 Mar 2026

The Google Cloud logo is illuminated on a large-scale Gobo-projection and back-lit OLED signage at the entrance of the Google Cloud Zone in Hall 2 during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. For the 2026 edition, the branding emphasizes Google's commitment to ''AI-Native Telco'' infrastructure, showcasing the integration of Gemini 1.5 Pro and Gemini 1.5 Flash models within the Vertex AI platform for network automation. The exhibit features the latest Google Distributed Cloud (GDC) hardware powered by the TPU v6 (Tensor Processing Unit) architecture, specifically designed to run high-speed generative AI agents at the network edge. The display is showcased alongside the Google Pixel 10 Pro, which serves as an interface for managing cloud-based network digital twins, utilizing its Google Tensor G5 processor and 50-megapixel triple camera system (featuring the Samsung GNK main sensor) to perform real-time visual audits of server racks and fiber connections directly through the Google Cloud console.

Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.

#13439916

13 Mar 2026

A digital interface at the Nokia booth displays the Vaidio Generative AI video analytics platform, which monitors multiple security feeds at the Fira Gran Via during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The system integrates live streams from Nokia i-Pro smart cameras featuring 20-megapixel sensors and 4K resolution, processed through the NVIDIA Blackwell B200 GPU architecture located at the network edge. Powered by Intel Xeon 6 processors with vRAN Boost technology, the software utilizes Semantic Vision models to identify and track objects across disparate camera angles in real-time. The exhibit demonstrates the synergy between the Nokia ReefShark SoC for high-speed data backhaul and Vaidio's autonomous reasoning engine, which enables natural language querying of visual metadata to enhance public safety and crowd management.

Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.

#13439960

13 Mar 2026

The NTT (Nippon Telegraph and Telephone) logo is prominently displayed at the joint exhibit featuring NTT, NTT DOCOMO, and NTT DATA during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. Under the 2026 theme ''Photonics Unlocks an Intelligent Power-Optimized Future,'' the pavilion showcases the commercial evolution of the IOWN (Innovative Optical and Wireless Network) architecture. Key technical demonstrations include the All-Photonics Network (APN) and Photonics-Electronics Convergence (PEC) devices designed to reduce power consumption in AI data centers by up to 100x. The exhibit features hardware powered by the Qualcomm Snapdragon X105 NTN processor for satellite-to-terrestrial 5G integration and the NVIDIA Blackwell-based accelerated computing nodes for the ''GPU over APN'' solution, which enables high-speed, low-latency AI inference across distributed sites. The stand also highlights NTT DOCOMO's 6G ''Network for AI'' concept, utilizing real-time haptic feedback and autonomous robot control.

Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.

#13439927

13 Mar 2026

The MediaTek corporate logo features at the Fira Gran Via booth, representing the company's ''AI For Life: From Edge to Cloud'' strategy during the Mobile World Congress. The exhibit showcases the flagship Dimensity 9500 processor, built on TSMC's 3nm (N3P) process and featuring an All Big Core architecture with a Cortex-X925 ultra-core clocked at 3.73 GHz. The display highlights the new NPU 9.0 (Neural Processing Unit) delivering 100 TOPS of computing power for on-device generative video and agentic AI. The branding encompasses the Dimensity Auto MT2739 platform for satellite-connected vehicles and the first commercial Wi-Fi 8 solutions using the Filogic 8000 series, emphasizing MediaTek's leadership in high-speed, low-latency connectivity for smartphones, IoT, and next-generation data centers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.

#13406517

6 Mar 2026

A next-generation hybrid telecommunications antenna is showcased at a premier technology exhibit, featuring a prominent illuminated Wi-Fi symbol in cyan LED at its apex. This hardware represents the latest in 5G-Advanced and Wi-Fi 7 convergence, designed to provide seamless high-speed data handovers in high-density environments such as smart stadiums and corporate campuses. The sleek, cylindrical industrial design includes integrated cooling vents and status-indicator lighting, highlighting the shift toward aesthetically integrated and energy-efficient network infrastructure during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.

#13406490

6 Mar 2026

The Marvell Technology stock chart is displayed on a smartphone screen in this photo illustration. The U.S. chipmaker draws investor attention as demand for artificial-intelligence infrastructure and data-center networking chips grows, with semiconductor firms benefiting from rising investment in AI computing and cloud services. This photo is taken in Brussels, Belgium, on March 5, 2026.

Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.

#13406491

6 Mar 2026

The Marvell Technology stock chart is displayed on a smartphone screen in this photo illustration. The U.S. chipmaker draws investor attention as demand for artificial-intelligence infrastructure and data-center networking chips grows, with semiconductor firms benefiting from rising investment in AI computing and cloud services. This photo is taken in Brussels, Belgium, on March 5, 2026.

Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.

#13406492

6 Mar 2026

The Marvell Technology stock chart is displayed on a smartphone screen in this photo illustration. The U.S. chipmaker draws investor attention as demand for artificial-intelligence infrastructure and data-center networking chips grows, with semiconductor firms benefiting from rising investment in AI computing and cloud services. This photo is taken in Brussels, Belgium, on March 5, 2026.

Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.

#13406493

6 Mar 2026

The Marvell Technology logo is displayed on a smartphone screen in this photo illustration. The U.S. chipmaker draws investor attention as demand for artificial-intelligence infrastructure and data-center networking chips grows, with semiconductor firms benefiting from rising investment in AI computing and cloud services in Brussels, Belgium, on March 5, 2026.

Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.

#13406494

6 Mar 2026

The Marvell Technology logo is displayed on a smartphone screen in this photo illustration. The U.S. chipmaker draws investor attention as demand for artificial-intelligence infrastructure and data-center networking chips grows, with semiconductor firms benefiting from rising investment in AI computing and cloud services in Brussels, Belgium, on March 5, 2026.

Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.

#13406495

6 Mar 2026

The Marvell Technology logo is displayed on a smartphone screen in this photo illustration. The U.S. chipmaker draws investor attention as demand for artificial-intelligence infrastructure and data-center networking chips grows, with semiconductor firms benefiting from rising investment in AI computing and cloud services in Brussels, Belgium, on March 5, 2026.

Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.

#13406496

6 Mar 2026

The Marvell Technology logo is displayed on a smartphone screen in this photo illustration. The U.S. chipmaker draws investor attention as demand for artificial-intelligence infrastructure and data-center networking chips grows, with semiconductor firms benefiting from rising investment in AI computing and cloud services in Brussels, Belgium, on March 5, 2026.

Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.

#13406497

6 Mar 2026

The Marvell Technology logo is displayed on a smartphone screen in this photo illustration. The U.S. chipmaker draws investor attention as demand for artificial-intelligence infrastructure and data-center networking chips grows, with semiconductor firms benefiting from rising investment in AI computing and cloud services in Brussels, Belgium, on March 5, 2026.

Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.

#13406498

6 Mar 2026

The Marvell Technology logo is displayed on a smartphone screen in this photo illustration. The U.S. chipmaker draws investor attention as demand for artificial-intelligence infrastructure and data-center networking chips grows, with semiconductor firms benefiting from rising investment in AI computing and cloud services in Brussels, Belgium, on March 5, 2026.

Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.