"Modular Camera"

#13457502

16 Mar 2026

A detailed scale model of the Indra GSAT-300 multi-mission satellite is showcased at the Indra pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The satellite is designed for secure government and commercial communications and features an advanced Software Defined Radio (SDR) payload. It is equipped with a high-resolution multispectral optical instrument capable of 30-centimeter ground sampling distance. The system is powered by the Indra On-Board Processor (OBP) v4, based on a radiation-hardened dual-core LEON4 architecture, enabling real-time AI-based image processing and autonomous debris avoidance. The demonstration highlights Indra's contribution to the IRIS (Infrastructure for Resilience, Interconnectivity and Security by Satellite) constellation, utilizing Ka-band and optical laser links for ultra-secure, low-latency data transmission. The model showcases the satellite's modular design and its integration with 5G-Non-Terrestrial Networks (5G-NTN), providing seamless global connectivity for IoT and mission-critical applications in remote areas.

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#13457704

16 Mar 2026

A high-fidelity scale model of a next-generation Low Earth Orbit (LEO) multi-mission satellite is displayed at the Space Communications zone during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This unit represents advancements in 5G-Advanced Non-Terrestrial Networks (5G-NTN), designed to provide seamless direct-to-cell connectivity and high-speed backhaul for remote areas. The platform is powered by a radiation-hardened dual-core LEON4 on-board processor combined with a specialized FPGA-based Neural Processing Unit for edge AI data filtering. The satellite features a modular payload including a high-resolution multispectral optical sensor with a 30-centimeter ground sampling distance, supported by a 50-megapixel CMOS imaging system for earth observation. Its communication suite utilizes a Software Defined Radio architecture capable of handling Ka-band and Q/V-band frequencies, integrated with optical laser links for ultra-secure inter-satellite data relay. The demonstration highlights the convergence of terrestrial and space-based infrastructure, enabling global IoT coverage and emergency telecommunications via standard smartphone devices.

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#13413350

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413351

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413352

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413353

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413354

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413913

7 Mar 2026

The Honor Magic 8 Pro is equipped with the Professional Imaging Kit accessory at the Fira Gran Via, featuring a modular 2.35x telephoto extender lens that, combined with the device's native periscope, achieves an equivalent 200mm focal length with fluorite-level color accuracy. The system is powered by the Qualcomm Snapdragon 8 Elite Gen 5 platform and features a 200-megapixel Samsung ISOCELL HP9 telephoto sensor (1/1.4-inch) alongside a 50-megapixel main camera with CIPA 6.5 stabilization. The kit adds a magnetic ergonomic grip with a physical two-step shutter button, a zoom lever, and a 67mm universal thread for professional ND and polarizer filters, as the brand demonstrates advanced low-light ''Ultra Night'' cinematography during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13406543

6 Mar 2026

A large crowd gathers at the TECNO booth during the final day of MWC 2026 to experience the Modular Magnetic Concept Phone. Attendees test the innovative Modular Magnetic Interconnection Technology, which allows for the instant attachment of hardware modules via a high-strength magnetic system. The demonstration features the Telephoto Lens and Action Camera modules, which transform the ultra-slim 4.9mm smartphone into a professional-grade imaging device. This concept reflects TECNO's vision for a future where mobile hardware is as adaptable as software, enabling users to reconfigure their device's physical capabilities on demand during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13364313

23 Feb 2026

ZIELONKA, POLAND – FEBRUARY 19: A view of the PIAP MULES (Mobile Universal Logistics and Evacuation System) autonomous uncrewed ground vehicle (UGV) during a demonstration of unmanned weapon systems at the Military Institute of Armament Technology (WITU) training ground in Zielonka, Poland, on February 19, 2026.

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#13364212

23 Feb 2026

ZIELONKA, POLAND – FEBRUARY 19: A view of the PIAP HUNTeR, a heavy unmanned ground vehicle (UGV) equipped with a remote-controlled weapon station, is seen operating alongside a smaller autonomous robot, PIAP MULES (Mobile Universal Logistics and Evacuation System), during a demonstration of unmanned weapon systems at the Military Institute of Armament Technology training ground in Zielonka, Poland, on February 19, 2026.

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#12341796

7 May 2025

Attendees engage in business meetings and media activity at the Risen Energy booth during Smarter E Europe 2025 in Munich, Bavaria, Upper Bavaria, Germany, on May 7, 2025. The company highlights its latest solar and energy storage solutions under the theme ''The Power of Rising Value.''

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