"Telephoto Lens Module"

#13457265

16 Mar 2026

A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.

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#13457266

16 Mar 2026

A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.

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#13457267

16 Mar 2026

A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.

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#13439881

13 Mar 2026

The Xiaomi 17 Pro Max flagship smartphone is presented at the Fira Gran Via, showcasing its expansive 6.9-inch LTPO AMOLED main display with 3,500 nits peak brightness and a secondary 2.9-inch AMOLED rear screen integrated into the Leica camera module. The device is powered by the Qualcomm Snapdragon 8 Elite Gen 5 (3nm) processor with 16GB of LPDDR5X RAM and runs on HyperOS 3 (Android 16). The Leica-tuned triple camera system features a 50-megapixel Light Fusion 950L main sensor (f/1.67), a 50-megapixel periscope telephoto lens with 5x optical zoom and OIS, and a 50-megapixel ultra-wide lens, all supported by a class-leading 7,500mAh silicon-carbon battery with 100W wired charging during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413350

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413351

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413352

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413353

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413354

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13414159

7 Mar 2026

An ''exploded view'' display of the Huawei Mate XT Ultimate Design tri-foldable smartphone showcases its internal components and engineering at the Fira Gran Via in Barcelona, Spain, on March 5, 2026. The exhibit highlights the complex Tiangong hinge mechanism made of ultra-high strength steel. It features the dissection of the 10.2-inch flexible OLED display panel alongside the HiSilicon Kirin 9010 (7nm) octa-core processor and the layered structure of the 5,600mAh ultra-thin silicon-carbon battery system. Individual modules of the Ultra Aperture XMAGE camera system are visible, including the 50-megapixel main sensor with its 10-stop variable aperture mechanism and the 12-megapixel periscope telephoto lens with 5.5x optical zoom, demonstrating the precise arrangement required to maintain a 3.6mm unfolded thickness during the Mobile World Congress (MWC).

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#13406548

6 Mar 2026

A detailed view of the TECNO Modular Magnetic Concept Phone (MODA Edition) showcases at MWC 2026. The image highlights the revolutionary Modular Magnetic Interconnection Technology (MMIT), featuring the large-format Telephoto Lens Module docked onto the ultra-slim 4.9mm chassis. The module, which houses a dedicated high-resolution image sensor and a physical optical zoom assembly, transforms the minimalist smartphone into a high-performance imaging system. The sleek, industrial design of the hardware, with its exposed magnetic contact points and metallic finish, underscores the shift toward a customizable, modular future for mobile technology during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13406543

6 Mar 2026

A large crowd gathers at the TECNO booth during the final day of MWC 2026 to experience the Modular Magnetic Concept Phone. Attendees test the innovative Modular Magnetic Interconnection Technology, which allows for the instant attachment of hardware modules via a high-strength magnetic system. The demonstration features the Telephoto Lens and Action Camera modules, which transform the ultra-slim 4.9mm smartphone into a professional-grade imaging device. This concept reflects TECNO's vision for a future where mobile hardware is as adaptable as software, enabling users to reconfigure their device's physical capabilities on demand during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#11088281

20 Mar 2024

The camera module on an iPhone 13 Pro Max is seen in this photo illustration in Warsaw, Poland on 20 March, 2024.

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#13413913

7 Mar 2026

The Honor Magic 8 Pro is equipped with the Professional Imaging Kit accessory at the Fira Gran Via, featuring a modular 2.35x telephoto extender lens that, combined with the device's native periscope, achieves an equivalent 200mm focal length with fluorite-level color accuracy. The system is powered by the Qualcomm Snapdragon 8 Elite Gen 5 platform and features a 200-megapixel Samsung ISOCELL HP9 telephoto sensor (1/1.4-inch) alongside a 50-megapixel main camera with CIPA 6.5 stabilization. The kit adds a magnetic ergonomic grip with a physical two-step shutter button, a zoom lever, and a 67mm universal thread for professional ND and polarizer filters, as the brand demonstrates advanced low-light ''Ultra Night'' cinematography during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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