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#13485433

22 Mar 2026

A runner with balloons attached to his vest passes Holy Cross Church on Krakowskie Przedmiescie during the 20th Warsaw Half Marathon in Warsaw, Poland, on March 22, 2026. The jubilee 20th edition is the largest in the event's history, with the 25,000-entry limit selling out before race day as participants follow the certified 21.097 km course through central Warsaw.

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#13485440

22 Mar 2026

A route notice reading ''Trasa, 20. Polmaraton Warszawski'' is attached to a pole as blurred runners pass in the background in Warsaw, Poland, on March 22, 2026. The 20th edition of the event was the largest in its history, with the 25,000-entry limit selling out before race day as participants followed the certified 21.097 km course through central Warsaw.

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#13470137

19 Mar 2026

Mathieu Lefevre, Minister attached to the Minister for Ecological Transition, Biodiversity and International Negotiations on Climate and Nature, responsible for Ecological Transition, arrives for a meeting of the French Government on energy prices at the Hotel Matignon in Paris, France, on March 19, 2026.

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#13457250

16 Mar 2026

A view of the new Xiaomi Pad 8 Pro featuring the Xiaomi Focus Keyboard attachment is showcased at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The high-end tablet is equipped with an 11.2-inch 3.2K resolution (3200 x 2136) LCD display with a 144Hz adaptive refresh rate and a 3:2 aspect ratio. It is powered by the Qualcomm Snapdragon 8 Elite (3nm) processor and runs on Xiaomi HyperOS 3, which includes a PC-level workstation mode. The device features a 50-megapixel main rear camera and a 32-megapixel front-facing sensor. The Focus Keyboard includes a floating design with a high-precision metal hinge, backlit keys with 1.3mm travel, and a large mechanical trackpad. The system is supported by a 9,200mAh battery with 67W HyperCharge.

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#13457251

16 Mar 2026

A view of the new Xiaomi Pad 8 Pro featuring the Xiaomi Focus Keyboard attachment is showcased at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The high-end tablet is equipped with an 11.2-inch 3.2K resolution (3200 x 2136) LCD display with a 144Hz adaptive refresh rate and a 3:2 aspect ratio. It is powered by the Qualcomm Snapdragon 8 Elite (3nm) processor and runs on Xiaomi HyperOS 3, which includes a PC-level workstation mode. The device features a 50-megapixel main rear camera and a 32-megapixel front-facing sensor. The Focus Keyboard includes a floating design with a high-precision metal hinge, backlit keys with 1.3mm travel, and a large mechanical trackpad. The system is supported by a 9,200mAh battery with 67W HyperCharge.

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#13457325

16 Mar 2026

Two television journalists film a hands-on review of the new Xiaomi 17 Ultra flagship smartphone at the Xiaomi ''Human x Car x Home'' pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The reporter on the left holds and gestures with the white Xiaomi 17 Ultra, highlighting its Leica Summilux camera system, which features a 50-megapixel 1-inch type Sony IMX1089 main sensor and a 200-megapixel periscope telephoto lens with APO certification. The second journalist, acting as the cameraperson, uses a professional Sony FX6 cinema camera equipped with a Sony FE 24-70mm f/2.8 GM II lens, mounted on a DJI Ronin 4D-style stabilizer, with a Sennheiser EW-DP wireless microphone system attached. The background display showcases the Xiaomi HyperOS 3 interface on a large screen, emphasizing the device's Qualcomm Snapdragon 8 Elite Gen 5 (3nm) processor and AI imaging capabilities, as they produce content for a tech news outlet.

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#13422452

9 Mar 2026

A giant handmade puppet head is carried above the crowd, attached to a wide strip of magenta fabric, as protesters march between skyscrapers during the Non Una Di Meno rally in Milan, Italy, on March 8, 2026.

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#13420662

8 Mar 2026

A Wizz Air Malta Airbus A321neo, registration 9H-WAD, stands on the apron with mobile stairs attached as the aircraft is prepared for departure at Katowice Airport in Pyrzowice, on February 21, 2026.

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#13420663

8 Mar 2026

An Air Dolomiti Embraer ERJ-190, registration I-JENG, stands on the apron with mobile stairs attached while a ground handling worker prepares the aircraft for departure at Katowice Airport in Pyrzowice, on February 21, 2026.

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#13413350

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413351

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413352

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413353

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413354

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13406543

6 Mar 2026

A large crowd gathers at the TECNO booth during the final day of MWC 2026 to experience the Modular Magnetic Concept Phone. Attendees test the innovative Modular Magnetic Interconnection Technology, which allows for the instant attachment of hardware modules via a high-strength magnetic system. The demonstration features the Telephoto Lens and Action Camera modules, which transform the ultra-slim 4.9mm smartphone into a professional-grade imaging device. This concept reflects TECNO's vision for a future where mobile hardware is as adaptable as software, enabling users to reconfigure their device's physical capabilities on demand during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13406549

6 Mar 2026

A close-up view of the base unit of the TECNO Modular Magnetic Concept Phone (ATOM Edition) is on display at MWC 2026. The device showcases an industry-leading ultra-slim profile of just 4.9mm, achieved by relocating traditional internal components into external magnetic modules. The rear of the handset features a specialized Magnetic Interconnection surface with exposed contact points, allowing for seamless power and data transfer with various hardware attachments. Its minimalist silver finish and compact form factor represent a radical departure from traditional smartphone architecture, prioritizing a ''thin-and-light'' core that can be expanded on demand during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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