"chipsets"

#13439923

13 Mar 2026

The MediaTek corporate logo is displayed at the Fira Gran Via booth with the slogan ''Complete End-to-End Solutions,'' highlighting the company's ''AI For Life'' ecosystem during the Mobile World Congress. The exhibit features the flagship Dimensity 9500 processor, built on a 3nm process with an All-Big-Core architecture (Cortex-X925 ultra core at 3.73 GHz) and the NPU 890 for advanced generative AI. The branding emphasizes MediaTek's leadership in connectivity, showcasing the Dimensity Auto MT2739 telematics platform with 3GPP Release 17/18 NR-NTN satellite support and the first wave of Wi-Fi 8 solutions using the Filogic 8000 series chipsets. The display highlights the convergence of edge-to-cloud intelligence, including Sovereign AI for automotive cockpits and RedCap (Reduced Capability) technology for mass-market 5G IoT devices during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13405031

5 Mar 2026

In this photo illustration in Athens, Greece, on March 5, 2026, a close-up of a printed circuit board (PCB) is seen, while the Qualcomm logo is displayed on a screen in the background. Qualcomm is one of the biggest semiconductor companies making chipsets.

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#13405028

5 Mar 2026

In this photo illustration, a close-up of a printed circuit board (PCB) is seen, while the AMD logo is displayed on a screen in the background. AMD develops CPUs and GPUs for many computing markets in Athens, Greece, on March 5, 2026.

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#13395753

3 Mar 2026

In Barcelona, Spain, on March 2, 2026, the Qualcomm exhibition stand highlights its vision for 6G technology during the Mobile World Congress (MWC). The U.S. semiconductor and telecommunications company presents next-generation wireless research, advanced chipsets, and AI-driven connectivity solutions aimed at shaping the future of ultra-fast, low-latency mobile networks at the annual global technology event.

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#13395754

3 Mar 2026

In Barcelona, Spain, on March 2, 2026, the Qualcomm exhibition stand highlights its vision for 6G technology during the Mobile World Congress (MWC). The U.S. semiconductor and telecommunications company presents next-generation wireless research, advanced chipsets, and AI-driven connectivity solutions aimed at shaping the future of ultra-fast, low-latency mobile networks at the annual global technology event.

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#12801383

27 Sep 2025

In Creteil, France, on September 26, 2025, the Snapdragon logo appears on a smartphone with an abstract silver illustration in the background. Qualcomm, the publisher of Snapdragon chips, is a major and influential player in the field of mobile innovation and the semiconductor industry for artificial intelligence (AI).

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#12801415

27 Sep 2025

In Creteil, France, on September 26, 2025, the Qualcomm logo appears on a smartphone reflecting an abstract silver illustration. Qualcomm, the publisher of Snapdragon chips, is a major and influential player in the field of mobile innovation and the semiconductor industry for artificial intelligence (AI).

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#12685515

28 Aug 2025

The Snapdragon logo, the brand name for the American company Qualcomm's integrated circuit products, is displayed on a large-scale representation of one of their microchips during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.

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#12685517

28 Aug 2025

The Snapdragon logo, the brand name for the American company Qualcomm's integrated circuit products, is displayed on a large-scale representation of one of their microchips during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.

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#12397025

23 May 2025

A tri-folding screen is exhibited at the MediaTek pavilion as the Taiwanese company's new flagship chip, Dimensity 9400, includes support for scaling content across extended screens at the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.

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#13457391

16 Mar 2026

An illuminated 3D sign featuring the lettering ''Ai Home,'' with the letter 'O' replaced by a stylized robot head icon, is displayed at the entrance of the Xiaomi Smart Living zone during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This installation serves as the centerpiece for the global launch of the Xiaomi HyperOS 3 integrated ecosystem, demonstrating the interconnection between smartphones, smart appliances, and the Xiaomi SU7 Ultra electric vehicle. The ''Ai Home'' concept showcased at the booth is powered by a central Xiaomi Home Hub 2, equipped with an Amlogic S905X4 quad-core processor and dedicated NPU for local AI processing. The exhibit features the integration of the Xiaomi 17 Ultra, with its Snapdragon 8 Elite Gen 5 chipset and 50-megapixel Sony IMX1089 camera system, as the primary controller for human-to-machine interactions. Visitors can observe the robot-head icon's eyes pulse with light to signify active Gemini-powered voice commands that manage a network of over 200 IoT devices, showcasing the transition from simple automation to proactive, intent-based home management.

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#13457395

16 Mar 2026

The Huawei logo is prominently displayed alongside the 2026 theme ''Advancing All Intelligence'' on a massive 8K 3D-LED installation at the entrance of Hall 1 during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The exhibit marks the commercial scale-up of 5.5G (5G-Advanced) and the debut of the Huawei Xinghe network solution, which utilizes the Ascend 910C AI cluster for autonomous network driving at Level 4. The display highlights the integration of the Pangu Model 5.0, Huawei's specialized large language model for the telecommunications industry, running on the Kunpeng 930 ARM-based CPU architecture to optimize energy efficiency in data centers. Visitors can observe demonstrations of the Huawei Mate 80 Pro, powered by the Kirin 9100 chipset, featuring its 50-megapixel XMAGE ultra-aperture main camera and satellite-based AI messaging, as it interacts with the brand's ''All-Intelligence'' ecosystem to manage real-time holographic communication and smart factory digital twins.

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#13457396

16 Mar 2026

The Huawei logo is prominently displayed at the entrance of the company's exhibition space in Hall 1 during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. Under the theme ''Advancing Industrial All Intelligence,'' Huawei showcases its transition from 5G to 5G-Advanced (5.5G) and its new Xinghe AI Fabric 2.0 network solutions. The exhibit features the global debut of the Huawei Mate 70 Pro, powered by the Kirin 9020 (5nm) deca-core processor, which integrates a 50-megapixel main camera with a physical variable aperture (f/1.4-f/4.0) and a 48-megapixel periscope telephoto lens. Also on display is the Huawei Mate X6 foldable, utilizing the same Kirin 9020 chipset and a 7.93-inch foldable OLED display, demonstrating advanced AI Agent capabilities for autonomous document processing and real-time translation. The branding highlights Huawei's full-stack AI infrastructure, including the Atlas 950 SuperPoD and OceanStor A800 storage systems designed to support large-scale AI model training and the evolution towards Level 4 Autonomous Networks (AN L4).

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#13457460

16 Mar 2026

A close-up of the Huawei MatePad Pro 12.2 (2026 Edition), internally designated under the MXH series, running the latest HarmonyOS version 4.3.0 at the Huawei exhibition pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The premium tablet features a Tandem OLED PaperMatte display with a 2.8K resolution (2800 x 1840 pixels), an adaptive refresh rate of 144Hz, and a peak brightness of 2,000 nits. The device is powered by the Kirin T92 octa-core chipset, supported by 12GB of RAM and integrated with the Maleoon 920 GPU, optimized for professional creativity and AI-driven multitasking. Its sophisticated camera system includes a 13-megapixel main rear sensor (f/1.8 aperture with autofocus) and an 8-megapixel ultra-wide lens, while the HarmonyOS 4.3.0 interface showcases the new SuperHub 2.0 for seamless cross-device file transfers and enhanced NearLink connectivity for the M-Pencil (3rd Gen). The demonstration highlights the tablet's ultra-slim 5.5mm profile and its 10,100mAh battery capacity with 100W HUAWEI SuperCharge support, emphasizing PC-grade productivity in a mobile form factor.

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#13457461

16 Mar 2026

A close-up of the Huawei MatePad Pro 12.2 (2026 Edition), internally designated under the MXH series, running the latest HarmonyOS version 4.3.0 at the Huawei exhibition pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The premium tablet features a Tandem OLED PaperMatte display with a 2.8K resolution (2800 x 1840 pixels), an adaptive refresh rate of 144Hz, and a peak brightness of 2,000 nits. The device is powered by the Kirin T92 octa-core chipset, supported by 12GB of RAM and integrated with the Maleoon 920 GPU, optimized for professional creativity and AI-driven multitasking. Its sophisticated camera system includes a 13-megapixel main rear sensor (f/1.8 aperture with autofocus) and an 8-megapixel ultra-wide lens, while the HarmonyOS 4.3.0 interface showcases the new SuperHub 2.0 for seamless cross-device file transfers and enhanced NearLink connectivity for the M-Pencil (3rd Gen). The demonstration highlights the tablet's ultra-slim 5.5mm profile and its 10,100mAh battery capacity with 100W HUAWEI SuperCharge support, emphasizing PC-grade productivity in a mobile form factor.

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#13457462

16 Mar 2026

A close-up of the Huawei MatePad Pro 12.2 (2026 Edition), internally designated under the MXH series, running the latest HarmonyOS version 4.3.0 at the Huawei exhibition pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The premium tablet features a Tandem OLED PaperMatte display with a 2.8K resolution (2800 x 1840 pixels), an adaptive refresh rate of 144Hz, and a peak brightness of 2,000 nits. The device is powered by the Kirin T92 octa-core chipset, supported by 12GB of RAM and integrated with the Maleoon 920 GPU, optimized for professional creativity and AI-driven multitasking. Its sophisticated camera system includes a 13-megapixel main rear sensor (f/1.8 aperture with autofocus) and an 8-megapixel ultra-wide lens, while the HarmonyOS 4.3.0 interface showcases the new SuperHub 2.0 for seamless cross-device file transfers and enhanced NearLink connectivity for the M-Pencil (3rd Gen). The demonstration highlights the tablet's ultra-slim 5.5mm profile and its 10,100mAh battery capacity with 100W HUAWEI SuperCharge support, emphasizing PC-grade productivity in a mobile form factor.

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