"computational intelligence"

#13457248

16 Mar 2026

A detailed close-up shot focuses on the Leica Summilux camera system on the rear of the newly launched Xiaomi 17, showcased at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The primary camera features a 50-megapixel, 1-inch type Sony IMX1089 sensor with an equivalent focal length of 23mm and a variable aperture ranging from f/1.6 to f/4.0. It is accompanied by a 50-megapixel floating telephoto lens providing 3.2x optical zoom and a 75mm equivalent focal length with OIS, and a 50-megapixel ultra-wide angle lens with a 122-degree field of view and 14mm equivalent focal length. The system utilizes the AISp 2.0 imaging engine powered by the Qualcomm Snapdragon 8 Gen 5 processor and a dedicated 14-bit AD converter, designed to optimize color science, dynamic range, and Leica Authentic and Vibrant Look computational photography modes.

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#13457265

16 Mar 2026

A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.

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#13457266

16 Mar 2026

A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.

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#13457267

16 Mar 2026

A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.

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#13439891

13 Mar 2026

An attendee holds the Samsung Galaxy S26 Ultra at the Fira Gran Via, showcasing the redesigned quad-camera system featuring a 200-megapixel main sensor (f/1.4 aperture, 23mm) with OIS and a 50-megapixel periscope telephoto lens supporting 5x optical zoom (f/2.9 aperture). The flagship device is powered by the Qualcomm Snapdragon 8 Elite Gen 5 for Galaxy (3nm) processor and includes a 50-megapixel ultra-wide sensor (f/1.9) and a secondary 10-megapixel telephoto lens (3x optical). The rear panel highlights the new Satin Finish glass on a refined 7.9mm titanium-reinforced frame, while the device's ProVisual Engine and Galaxy AI manage real-time computational photography and 8K/30fps video recording during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439924

13 Mar 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439925

13 Mar 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13406444

6 Mar 2026

The Samsung Galaxy S26 series high-end smartphones by Samsung, including the Galaxy S26, S26+, and S26 Ultra, display with each model showing its name alongside ''Galaxy AI'' on the screen. They feature advanced AI-driven functionalities, next-generation imaging systems, and premium AMOLED displays. This highlights innovation in intelligent mobile technology, computational photography, and performance-focused Android devices across the flagship lineup during the Mobile World Congress (MWC) in Barcelona, Spain, on March 4, 2026.

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#13403031

4 Mar 2026

The logo of an AI data center, a facility optimized for high-performance computing, deep learning, and training large language models (LLMs), features powerful infrastructure, including advanced liquid cooling, NVIDIA H100 clusters, and high-bandwidth networking. These elements support the immense computational demands of Artificial Intelligence development and deployment. This is exhibited, highlighting the nexus of processing power and neural networks, during the Mobile World Congress (MWC) in Barcelona, Spain, on March 4, 2026.

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#13398526

4 Mar 2026

The Xiaomi 17 Ultra high-end smartphone by Xiaomi features a Leica camera kit with a Leica-engineered triple camera system. This system includes a 50-MP Summilux main sensor with a 1-inch Light Fusion 1050L sensor, a 200-MP periscope telephoto lens with continuous optical zoom and OIS, and a 50-MP ultra-wide lens. It also offers Leica color profiles and professional imaging modes for mobile photography and 8K/4K video capture. The device highlights advanced computational photography, premium optics, and multimedia innovation for content creators during the Mobile World Congress (MWC) in Barcelona, Spain, on March 3, 2026.

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#13398527

4 Mar 2026

The Xiaomi 17 Ultra high-end smartphone by Xiaomi features a Leica camera kit with a Leica-engineered triple camera system. This system includes a 50-MP Summilux main sensor with a 1-inch Light Fusion 1050L sensor, a 200-MP periscope telephoto lens with continuous optical zoom and OIS, and a 50-MP ultra-wide lens. It also offers Leica color profiles and professional imaging modes for mobile photography and 8K/4K video capture. The device highlights advanced computational photography, premium optics, and multimedia innovation for content creators during the Mobile World Congress (MWC) in Barcelona, Spain, on March 3, 2026.

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#13398528

4 Mar 2026

The Xiaomi 17 Ultra high-end smartphone by Xiaomi features a Leica camera kit with a Leica-engineered triple camera system. This system includes a 50-MP Summilux main sensor with a 1-inch Light Fusion 1050L sensor, a 200-MP periscope telephoto lens with continuous optical zoom and OIS, and a 50-MP ultra-wide lens. It also offers Leica color profiles and professional imaging modes for mobile photography and 8K/4K video capture. The device highlights advanced computational photography, premium optics, and multimedia innovation for content creators during the Mobile World Congress (MWC) in Barcelona, Spain, on March 3, 2026.

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#13398529

4 Mar 2026

The Xiaomi 17 Ultra high-end smartphone by Xiaomi features a Leica camera kit with a Leica-engineered triple camera system. This system includes a 50-MP Summilux main sensor with a 1-inch Light Fusion 1050L sensor, a 200-MP periscope telephoto lens with continuous optical zoom and OIS, and a 50-MP ultra-wide lens. It also offers Leica color profiles and professional imaging modes for mobile photography and 8K/4K video capture. The device highlights advanced computational photography, premium optics, and multimedia innovation for content creators during the Mobile World Congress (MWC) in Barcelona, Spain, on March 3, 2026.

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#13398530

4 Mar 2026

The Xiaomi 17 Pro Max rear display flagship smartphone by Xiaomi features advanced imaging systems with professional-grade optics, powerful Snapdragon-class processing, an expansive AMOLED display, and next-generation connectivity for premium performance and multimedia experiences. It highlights innovation in mobile technology, computational photography, and high-performance Android device engineering during the Mobile World Congress (MWC) in Barcelona, Spain, on March 3, 2026.

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#13398531

4 Mar 2026

A content creator films the Xiaomi 17 Pro Max flagship smartphone by Xiaomi, featuring advanced imaging systems with professional-grade optics, powerful Snapdragon-class processing, an expansive AMOLED display, and next-generation connectivity for premium performance and multimedia experiences. This highlights innovation in mobile technology, computational photography, and high-performance Android device engineering during the Mobile World Congress (MWC) in Barcelona, Spain, on March 3, 2026.

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#13398532

4 Mar 2026

The Xiaomi 17 Pro Max flagship smartphone by Xiaomi features advanced imaging systems with professional-grade optics, powerful Snapdragon-class processing, an expansive AMOLED display, and next-generation connectivity for premium performance and multimedia experiences. It highlights innovation in mobile technology, computational photography, and high-performance Android device engineering during the Mobile World Congress (MWC) in Barcelona, Spain, on March 3, 2026.

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