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"digital intercom"
40 professional editorial images found
#13413436
7 Mar 2026
The Juancloud Smart Video Lock X9, a next-generation electronic door security system featuring 3D Structured Light Facial Recognition and a built-in 4-megapixel (2K) wide-angle camera, is exhibited highlighting its multi-core AI processor for sub-1 second biometric verification and the V380 Pro app integration for remote access management and real-time video intercom during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#12226905
23 May 2025
The UniFi Intercom, an NFC smart intercom designed to reinforce building security and manufactured by the American company Ubiquity, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12226901
23 May 2025
The UniFi G3 Reader Pro and the AI Turret, a set of an NFC reader and intercom, and a vandal-proof 4k security camera manufactured by the American company Ubiquity, are exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12396997
22 May 2025
The UniFi Intercom, an NFC smart intercom designed to reinforce building security and manufactured by the American company Ubiquity, is exhibited at the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12396996
22 May 2025
The UniFi G3 Reader Pro and the AI Turret, a set of an NFC reader and intercom, and a vandal-proof 4k security camera manufactured by the American company Ubiquity, are exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#13457252
16 Mar 2026
The new Xiaomi 17 flagship smartphone is displayed alongside the Xiaomi Pad 8 Pro equipped with the Focus Keyboard at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The Xiaomi 17 features a 6.3-inch CrystalRes OLED display and a triple 50-megapixel Leica Summilux camera system, including a 60mm floating telephoto lens, powered by the Qualcomm Snapdragon 8 Elite Gen 5 processor and a 6,330mAh silicon-carbon battery. The Xiaomi Pad 8 Pro productivity suite highlights its 11.2-inch 3.2K resolution LCD screen with a 144Hz refresh rate, also running on the Snapdragon 8 Elite platform. Both devices operate under Xiaomi HyperOS 3, enabling seamless cross-device ''Workstation Mode'' and ''Interconnectivity'' features that allow the tablet to mirror the phone's interface with ultra-low latency. The setup is showcased with the Focus Keyboard's 1.3mm key travel and integrated mechanical trackpad, designed for professional mobile computing.
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#13457391
16 Mar 2026
An illuminated 3D sign featuring the lettering ''Ai Home,'' with the letter 'O' replaced by a stylized robot head icon, is displayed at the entrance of the Xiaomi Smart Living zone during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This installation serves as the centerpiece for the global launch of the Xiaomi HyperOS 3 integrated ecosystem, demonstrating the interconnection between smartphones, smart appliances, and the Xiaomi SU7 Ultra electric vehicle. The ''Ai Home'' concept showcased at the booth is powered by a central Xiaomi Home Hub 2, equipped with an Amlogic S905X4 quad-core processor and dedicated NPU for local AI processing. The exhibit features the integration of the Xiaomi 17 Ultra, with its Snapdragon 8 Elite Gen 5 chipset and 50-megapixel Sony IMX1089 camera system, as the primary controller for human-to-machine interactions. Visitors can observe the robot-head icon's eyes pulse with light to signify active Gemini-powered voice commands that manage a network of over 200 IoT devices, showcasing the transition from simple automation to proactive, intent-based home management.
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#13457502
16 Mar 2026
A detailed scale model of the Indra GSAT-300 multi-mission satellite is showcased at the Indra pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The satellite is designed for secure government and commercial communications and features an advanced Software Defined Radio (SDR) payload. It is equipped with a high-resolution multispectral optical instrument capable of 30-centimeter ground sampling distance. The system is powered by the Indra On-Board Processor (OBP) v4, based on a radiation-hardened dual-core LEON4 architecture, enabling real-time AI-based image processing and autonomous debris avoidance. The demonstration highlights Indra's contribution to the IRIS (Infrastructure for Resilience, Interconnectivity and Security by Satellite) constellation, utilizing Ka-band and optical laser links for ultra-secure, low-latency data transmission. The model showcases the satellite's modular design and its integration with 5G-Non-Terrestrial Networks (5G-NTN), providing seamless global connectivity for IoT and mission-critical applications in remote areas.
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#13457738
16 Mar 2026
A detailed view of the NVIDIA GB300 NVL72 liquid-cooled rack-scale system is displayed at the NVIDIA pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This computing unit integrates 72 NVIDIA GB300 Tensor Core GPUs and 36 NVIDIA Grace CPUs, interconnected via the fifth-generation NVLink interconnect to function as a single GPU. The system is powered by NVIDIA BlueField-3 DPUs and the ConnectX-8 SuperNIC, capable of delivering up to 800Gb/s of networking throughput. The rack features a direct-to-chip liquid cooling system designed to manage the thermal output of the 120kW power density. This configuration is optimized for training Large Language Models and real-time inference on trillion-parameter models, utilizing the Transformer Engine and support for the FP4 precision format. The display highlights the NVIDIA Quantum-3 InfiniBand switches at the top of the rack, facilitating ultra-low latency communication between multi-rack clusters.
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#13413350
7 Mar 2026
The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413351
7 Mar 2026
The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413352
7 Mar 2026
The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413353
7 Mar 2026
The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413354
7 Mar 2026
The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413397
7 Mar 2026
The TECNO corporate logo, displayed under the theme ''Pioneering the Connection of Intelligence'' at Booth 7A40, represents the global technology brand unveiling its AI-powered ecosystem, including the Camon 50 Ultra with the MediaTek Dimensity 7400 Ultimate chipset and the revolutionary Modular Magnetic concept phone with mmWave interconnection. It is pictured at the Fira Gran Via exhibition center during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413865
7 Mar 2026
The Nvidia corporate logo is featured at the Fira Gran Via during the Mobile World Congress in Barcelona, Spain, on March 5, 2026, marking the company's expansion into AI-native telecommunications with the Nvidia AI Aerial platform. The exhibit showcases the GB200 NVL72 liquid-cooled rack-scale system, which integrates 72 Blackwell GPUs and 36 Grace CPUs interconnected via fifth-generation NVLink to deliver up to 1.4 exaflops of AI performance for trillion-parameter models. Powered by the Blackwell architecture, the infrastructure demonstrates the convergence of 5G/6G radio workloads and generative AI services on a single unified GPU-accelerated platform.
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