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"external modules"
2 professional editorial images found
#13406549
6 Mar 2026
A close-up view of the base unit of the TECNO Modular Magnetic Concept Phone (ATOM Edition) is on display at MWC 2026. The device showcases an industry-leading ultra-slim profile of just 4.9mm, achieved by relocating traditional internal components into external magnetic modules. The rear of the handset features a specialized Magnetic Interconnection surface with exposed contact points, allowing for seamless power and data transfer with various hardware attachments. Its minimalist silver finish and compact form factor represent a radical departure from traditional smartphone architecture, prioritizing a ''thin-and-light'' core that can be expanded on demand during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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#13439929
13 Mar 2026
The humanoid robot Pepper interacts with attendees at the Fira Gran Via during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This version of the social robot features an upgraded hardware architecture powered by the Qualcomm Robotics RB5 Platform, which includes a specialized NPU (Neural Processing Unit) enabling on-device generative AI capabilities for natural language processing and emotional recognition. The robot utilizes a multimodal sensor array, including a custom 12-megapixel HDR depth camera for facial tracking and spatial awareness, working alongside a 2D 5-megapixel wide-angle camera and an Omnidirectional Microphone Array with AI Beamforming technology for multi-user voice localization. Connectivity is managed via a dedicated Wi-Fi 7 and 5G-Advanced module, allowing seamless cloud synchronization with external LLM (Large Language Model) agents to provide real-time, personalized information and advanced navigation across the bustling venue.
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