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"hardware modules"
37 professional editorial images found
#13406543
6 Mar 2026
A large crowd gathers at the TECNO booth during the final day of MWC 2026 to experience the Modular Magnetic Concept Phone. Attendees test the innovative Modular Magnetic Interconnection Technology, which allows for the instant attachment of hardware modules via a high-strength magnetic system. The demonstration features the Telephoto Lens and Action Camera modules, which transform the ultra-slim 4.9mm smartphone into a professional-grade imaging device. This concept reflects TECNO's vision for a future where mobile hardware is as adaptable as software, enabling users to reconfigure their device's physical capabilities on demand during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13406549
6 Mar 2026
A close-up view of the base unit of the TECNO Modular Magnetic Concept Phone (ATOM Edition) is on display at MWC 2026. The device showcases an industry-leading ultra-slim profile of just 4.9mm, achieved by relocating traditional internal components into external magnetic modules. The rear of the handset features a specialized Magnetic Interconnection surface with exposed contact points, allowing for seamless power and data transfer with various hardware attachments. Its minimalist silver finish and compact form factor represent a radical departure from traditional smartphone architecture, prioritizing a ''thin-and-light'' core that can be expanded on demand during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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#12238797
7 Apr 2025
LAS VEGAS, USA - JANUARY 08: A detailed look at a PC computer equipped with an Intel Core processor, Intel Arc graphics processing units, and CORSAIR Dominator Titanium DDR5 Memory on display at the Consumer Electronics Show (CES) 2025, in Las Vegas, Nevada, USA, on January 8 2025.
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#11115169
2 Apr 2024
MeiG Smart Technologies is exhibiting its Smart POS Solutions modules at the Mobile World Congress 2024 in Barcelona, Spain, on April 2, 2024. These modules are designed to be integrated into a variety of everyday devices, including points of sale.
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#11115170
2 Apr 2024
MeiG Smart Technologies is exhibiting its Smart POS Solutions modules at the Mobile World Congress 2024 in Barcelona, Spain, on April 2, 2024. These modules are designed to be integrated into a variety of everyday devices, including points of sale.
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#11114745
2 Apr 2024
A worker is producing PCBA modules for smart electricity meters at a production workshop of an intelligent company in Huzhou, China, on April 2, 2024.
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#11114748
2 Apr 2024
A worker is producing PCBA modules for smart electricity meters at a production workshop of an intelligent company in Huzhou, China, on April 2, 2024.
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#10904495
11 Jan 2024
A worker is placing lighting components on crystal displays and modules on a production line at a semiconductor production workshop in Gao'an, Jiangxi Province, China, on January 10, 2024.
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#10904496
11 Jan 2024
A worker is placing lighting components on crystal displays and modules on a production line at a semiconductor production workshop in Gao'an, Jiangxi Province, China, on January 10, 2024.
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#10904497
11 Jan 2024
A worker is placing rubber frames on crystal displays and modules on a production line at a semiconductor production workshop in Gao'an, Jiangxi Province, China, on January 10, 2024.
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#10904499
11 Jan 2024
A worker is checking crystal displays and modules under light on a production line at a semiconductor production workshop in Gao'an, Jiangxi Province, China, on January 10, 2024.
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#10904500
11 Jan 2024
A worker is checking crystal displays and modules on a production line at a semiconductor production workshop in Gao'an, Jiangxi Province, China, on January 10, 2024.
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#10904501
11 Jan 2024
Workers are rushing to make liquid crystal displays and modules on the production line at a semiconductor production workshop in Gao'an City, Jiangxi Province, China, on January 10, 2024.
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#13457265
16 Mar 2026
A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.
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#13457266
16 Mar 2026
A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.
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#13457267
16 Mar 2026
A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.
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