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"module chip"
27 professional editorial images found
#13439914
13 Mar 2026
An On-Delivery autonomous delivery robot navigates the Nokia booth at the Fira Gran Via, demonstrating integrated 5G-Advanced logistics solutions during the Mobile World Congress. The robot is equipped with a 360-degree LiDAR system and a specialized 12-megapixel HDR wide-angle camera for obstacle recognition and semantic segmentation. Powered by the NVIDIA Jetson Orin Nano AI edge module and connected via a Nokia Industrial 5G router with the ReefShark chipset, the vehicle showcases real-time path planning and autonomous navigation through crowded environments. The demonstration highlights the Nokia Digital Automation Cloud (DAC) platform, which manages the robot's fleet telemetry and mission-critical low-latency communication with a response time of less than 5ms during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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#12901911
24 Oct 2025
The sensor module chip of Next Chip company product is displayed at FIX 2025 at EXCO in Daegu, South Korea, on October 24, 2025. The 2025 Future Innovation Tech Expo (FIX 2025) takes place from Wednesday, October 22 to Saturday, October 25 at EXCO in Daegu, South Korea. Under the theme ''The Future Has Already Begun: All on AI,'' the event spotlights cutting-edge advancements across mobility, robotics, ICT, and startups.
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#12685550
28 Aug 2025
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, including the X82 5G M.2 module and the LGA module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. These components are exhibited in the Qualcomm pavilion during the Mobile World Congress 2025.
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#12685551
28 Aug 2025
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, the X82 5G LGA Module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. It is exhibited in the Qualcomm pavilion during the Mobile World Congress 2025.
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#12685552
28 Aug 2025
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, the X82 5G M.2 Module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. It is exhibited in the Qualcomm pavilion during the Mobile World Congress 2025.
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#12685584
28 Aug 2025
The MEiglink SRM819W module features advanced wireless connectivity technology designed for high-performance applications in IoT and smart devices. It is exhibited in the Qualcomm pavilion during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12227019
23 May 2025
The Compal RML-NV2 Module chip, a chip by the Taiwanese company Compal and the semiconductor manufacturer MediaTek, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12227018
23 May 2025
The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed for 5G IoT applications, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12227015
23 May 2025
The Quectel RG225G, a 5G RedCap MediaTek-based module chip developed by the Taiwanese semiconductor company together with the Canadian Quectel Wireless Solutions, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397028
22 May 2025
The Compal RML-NV2 Module chip, a chip by the Taiwanese company Compal and the semiconductor manufacturer MediaTek, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397027
22 May 2025
The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed for 5G IoT applications, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397026
22 May 2025
The Quectel RG225G, a 5G RedCap MediaTek-based module chip developed by the Taiwanese semiconductor company together with the Canadian Quectel Wireless Solutions, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#10377682
16 Aug 2023
GUIYANG, CHINA - AUGUST 16, 2023 - A staff member displays a 1-inch four-color module display in Guiyang, Guizhou province, China, Aug. 16, 2023.
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#12994888
16 Nov 2025
The Onsemi logo is displayed on a mobile phone with the company branding visible in the background, in this photo illustration in Brussels, Belgium, on November 16, 2025.
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#12994889
16 Nov 2025
The Onsemi logo is displayed on a mobile phone with the company branding visible in the background, in this photo illustration in Brussels, Belgium, on November 16, 2025.
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#12994890
16 Nov 2025
The Onsemi logo is displayed on a mobile phone with the company branding visible in the background, in this photo illustration in Brussels, Belgium, on November 16, 2025.
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