"optical modules"

#13414159

7 Mar 2026

An ''exploded view'' display of the Huawei Mate XT Ultimate Design tri-foldable smartphone showcases its internal components and engineering at the Fira Gran Via in Barcelona, Spain, on March 5, 2026. The exhibit highlights the complex Tiangong hinge mechanism made of ultra-high strength steel. It features the dissection of the 10.2-inch flexible OLED display panel alongside the HiSilicon Kirin 9010 (7nm) octa-core processor and the layered structure of the 5,600mAh ultra-thin silicon-carbon battery system. Individual modules of the Ultra Aperture XMAGE camera system are visible, including the 50-megapixel main sensor with its 10-stop variable aperture mechanism and the 12-megapixel periscope telephoto lens with 5.5x optical zoom, demonstrating the precise arrangement required to maintain a 3.6mm unfolded thickness during the Mobile World Congress (MWC).

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#11353559

23 Jun 2024

VILLEPINTE, FRANCE - JUNE 21: Weapon-Mounted optical modules for assault rifles, on display at the Eurosatory Defense and Security expo, on June 21, 2024, in Paris-Nord Villepinte exhibition center, Seine-Saint-Denis, France. Eurosatory, held biennially in Paris-Nord Villepinte Exhibition Centre, is the largest international exhibition for the land and air-land defense and security industry.

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#13457265

16 Mar 2026

A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.

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#13457266

16 Mar 2026

A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.

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#13457267

16 Mar 2026

A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.

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#13457602

16 Mar 2026

The Indra Fulmar View VTOL, a high-performance tactical Unmanned Aerial System (UAS) with vertical take-off and landing technology from Wake Engineering, is displayed at the Indra Group pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. Designed for maritime and land-based Intelligence, Surveillance, and Reconnaissance (ISR) missions, the platform is powered by an on-board NVIDIA Jetson AGX Orin 64GB module, providing the edge computing power necessary for autonomous flight control and real-time AI video analytics. The aircraft features a dual-sensor payload in a gyro-stabilized gimbal, consisting of a 24-megapixel high-definition electro-optical camera and a high-sensitivity 640x512 thermal sensor for 24/7 operational capability. The demonstration highlights the integration of the system with Indra's TARSIS avionics family and its connectivity via 5G-Advanced and Satellite Non-Terrestrial Networks (NTN), allowing for secure, long-range control and high-bandwidth data transmission in contested environments.

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#13457611

16 Mar 2026

The Indra Fulmar View VTOL, a high-performance tactical Unmanned Aerial System (UAS) with vertical take-off and landing technology from Wake Engineering, is displayed at the Indra Group pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. Designed for maritime and land-based Intelligence, Surveillance, and Reconnaissance (ISR) missions, the platform is powered by an on-board NVIDIA Jetson AGX Orin 64GB module, providing the edge computing power necessary for autonomous flight control and real-time AI video analytics. The aircraft features a dual-sensor payload in a gyro-stabilized gimbal, consisting of a 24-megapixel high-definition electro-optical camera and a high-sensitivity 640x512 thermal sensor for 24/7 operational capability. The demonstration highlights the integration of the system with Indra's TARSIS avionics family and its connectivity via 5G-Advanced and Satellite Non-Terrestrial Networks (NTN), allowing for secure, long-range control and high-bandwidth data transmission in contested environments.

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#13439881

13 Mar 2026

The Xiaomi 17 Pro Max flagship smartphone is presented at the Fira Gran Via, showcasing its expansive 6.9-inch LTPO AMOLED main display with 3,500 nits peak brightness and a secondary 2.9-inch AMOLED rear screen integrated into the Leica camera module. The device is powered by the Qualcomm Snapdragon 8 Elite Gen 5 (3nm) processor with 16GB of LPDDR5X RAM and runs on HyperOS 3 (Android 16). The Leica-tuned triple camera system features a 50-megapixel Light Fusion 950L main sensor (f/1.67), a 50-megapixel periscope telephoto lens with 5x optical zoom and OIS, and a 50-megapixel ultra-wide lens, all supported by a class-leading 7,500mAh silicon-carbon battery with 100W wired charging during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413350

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413351

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413352

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413353

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413354

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13406548

6 Mar 2026

A detailed view of the TECNO Modular Magnetic Concept Phone (MODA Edition) showcases at MWC 2026. The image highlights the revolutionary Modular Magnetic Interconnection Technology (MMIT), featuring the large-format Telephoto Lens Module docked onto the ultra-slim 4.9mm chassis. The module, which houses a dedicated high-resolution image sensor and a physical optical zoom assembly, transforms the minimalist smartphone into a high-performance imaging system. The sleek, industrial design of the hardware, with its exposed magnetic contact points and metallic finish, underscores the shift toward a customizable, modular future for mobile technology during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#11432702

25 Jul 2024

Visitors are visiting the ''Laser Ranging Module'' at the ''Fifth World Photonic Congress 2024'' in Beijing, China, on July 25, 2024.

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#11088281

20 Mar 2024

The camera module on an iPhone 13 Pro Max is seen in this photo illustration in Warsaw, Poland on 20 March, 2024.

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