"processor architecture"

#13457487

16 Mar 2026

International delegates and congressmen participate in a high-level briefing at the Ericsson pavilion in Hall 2 during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The visitors engage with a live demonstration of the Ericsson Radio 4485, a high-capacity massive MIMO unit powered by the latest Ericsson Silicon (ASIC) custom processor architecture, designed for 5G-Advanced and early 6G research. The presentation features the integration of AI-driven intent-based networking, utilizing Intel Xeon Scalable 5th Gen (Emerald Rapids) processors within the cloud-native infrastructure to enhance energy efficiency by up to 30%. A delegate uses a Sony Xperia 1 VII, equipped with a Snapdragon 8 Elite Gen 5 chipset and a 52-megapixel Exmor T for Mobile main sensor, to test real-time network slicing and 8K video uplink capabilities directly from the booth floor. The scene highlights Ericsson's involvement in the GSMA Open Gateway initiative, demonstrating the impact of programmable networks on industrial automation and global connectivity.

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#13457466

16 Mar 2026

The Google Cloud logo is illuminated on a large-scale Gobo-projection and back-lit OLED signage at the entrance of the Google Cloud Zone in Hall 2 during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. For the 2026 edition, the branding emphasizes Google's commitment to ''AI-Native Telco'' infrastructure, showcasing the integration of Gemini 1.5 Pro and Gemini 1.5 Flash models within the Vertex AI platform for network automation. The exhibit features the latest Google Distributed Cloud (GDC) hardware powered by the TPU v6 (Tensor Processing Unit) architecture, specifically designed to run high-speed generative AI agents at the network edge. The display is showcased alongside the Google Pixel 10 Pro, which serves as an interface for managing cloud-based network digital twins, utilizing its Google Tensor G5 processor and 50-megapixel triple camera system (featuring the Samsung GNK main sensor) to perform real-time visual audits of server racks and fiber connections directly through the Google Cloud console.

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#13457502

16 Mar 2026

A detailed scale model of the Indra GSAT-300 multi-mission satellite is showcased at the Indra pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The satellite is designed for secure government and commercial communications and features an advanced Software Defined Radio (SDR) payload. It is equipped with a high-resolution multispectral optical instrument capable of 30-centimeter ground sampling distance. The system is powered by the Indra On-Board Processor (OBP) v4, based on a radiation-hardened dual-core LEON4 architecture, enabling real-time AI-based image processing and autonomous debris avoidance. The demonstration highlights Indra's contribution to the IRIS (Infrastructure for Resilience, Interconnectivity and Security by Satellite) constellation, utilizing Ka-band and optical laser links for ultra-secure, low-latency data transmission. The model showcases the satellite's modular design and its integration with 5G-Non-Terrestrial Networks (5G-NTN), providing seamless global connectivity for IoT and mission-critical applications in remote areas.

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#13457704

16 Mar 2026

A high-fidelity scale model of a next-generation Low Earth Orbit (LEO) multi-mission satellite is displayed at the Space Communications zone during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This unit represents advancements in 5G-Advanced Non-Terrestrial Networks (5G-NTN), designed to provide seamless direct-to-cell connectivity and high-speed backhaul for remote areas. The platform is powered by a radiation-hardened dual-core LEON4 on-board processor combined with a specialized FPGA-based Neural Processing Unit for edge AI data filtering. The satellite features a modular payload including a high-resolution multispectral optical sensor with a 30-centimeter ground sampling distance, supported by a 50-megapixel CMOS imaging system for earth observation. Its communication suite utilizes a Software Defined Radio architecture capable of handling Ka-band and Q/V-band frequencies, integrated with optical laser links for ultra-secure inter-satellite data relay. The demonstration highlights the convergence of terrestrial and space-based infrastructure, enabling global IoT coverage and emergency telecommunications via standard smartphone devices.

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#13457501

16 Mar 2026

A wide view of the Fujitsu exhibition stand in Hall 2 under the 2026 theme ''Intelligence in Motion'' during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The pavilion highlights Fujitsu's focus on sustainable AI infrastructure, featuring the public debut of the FUJITSU-MONAKA processor, a next-generation 2nm Arm-based CPU designed for high-performance AI inference with ultra-low power consumption. The exhibit showcases the Fujitsu Kozuchi AI platform, including its new Multi-AI Agent collaboration technology and sovereign AI solutions for data centers. Technical demonstrations include a scaled Quantum Computing replica integrated with high-performance computing for material discovery, and the 1Finity open networking portfolio, which utilizes NVIDIA-backed AI-RAN solutions to optimize 5G-Advanced and 6G-ready architectures. Visitors interact with the ''Amalgamation AI'' visual system, which uses specialized Vision Language Models for real-time industrial monitoring, all running on PRIMERGY servers equipped with Liquid Cooling technology to reduce the GPU carbon footprint by up to 50%.

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#13439908

13 Mar 2026

The Snapdragon corporate logo is illuminated at the Qualcomm pavilion in Hall 3 of the Fira Gran Via, representing the launch of the Snapdragon 8 Elite Gen 5 (SM8850-AC) mobile platform during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The 3nm architecture processor features the new Oryon V3 CPU and an enhanced Hexagon NPU capable of delivering over 80 TOPS for on-device generative AI. The branding highlights the expansion of the Snapdragon ecosystem into automotive with the Snapdragon Cockpit Elite and computing with the Snapdragon X Elite Gen 2, which powers the latest Windows 11 Copilot+ PCs. The exhibit showcases seamless multimodal AI processing across smartphones, XR glasses, and connected vehicles, emphasizing the Qualcomm AI Stack and ultra-low latency 5G-Advanced connectivity through the Snapdragon X85 Modem-RF System.

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#13439923

13 Mar 2026

The MediaTek corporate logo is displayed at the Fira Gran Via booth with the slogan ''Complete End-to-End Solutions,'' highlighting the company's ''AI For Life'' ecosystem during the Mobile World Congress. The exhibit features the flagship Dimensity 9500 processor, built on a 3nm process with an All-Big-Core architecture (Cortex-X925 ultra core at 3.73 GHz) and the NPU 890 for advanced generative AI. The branding emphasizes MediaTek's leadership in connectivity, showcasing the Dimensity Auto MT2739 telematics platform with 3GPP Release 17/18 NR-NTN satellite support and the first wave of Wi-Fi 8 solutions using the Filogic 8000 series chipsets. The display highlights the convergence of edge-to-cloud intelligence, including Sovereign AI for automotive cockpits and RedCap (Reduced Capability) technology for mass-market 5G IoT devices during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439927

13 Mar 2026

The MediaTek corporate logo features at the Fira Gran Via booth, representing the company's ''AI For Life: From Edge to Cloud'' strategy during the Mobile World Congress. The exhibit showcases the flagship Dimensity 9500 processor, built on TSMC's 3nm (N3P) process and featuring an All Big Core architecture with a Cortex-X925 ultra-core clocked at 3.73 GHz. The display highlights the new NPU 9.0 (Neural Processing Unit) delivering 100 TOPS of computing power for on-device generative video and agentic AI. The branding encompasses the Dimensity Auto MT2739 platform for satellite-connected vehicles and the first commercial Wi-Fi 8 solutions using the Filogic 8000 series, emphasizing MediaTek's leadership in high-speed, low-latency connectivity for smartphones, IoT, and next-generation data centers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439924

13 Mar 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439925

13 Mar 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439960

13 Mar 2026

The NTT (Nippon Telegraph and Telephone) logo is prominently displayed at the joint exhibit featuring NTT, NTT DOCOMO, and NTT DATA during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. Under the 2026 theme ''Photonics Unlocks an Intelligent Power-Optimized Future,'' the pavilion showcases the commercial evolution of the IOWN (Innovative Optical and Wireless Network) architecture. Key technical demonstrations include the All-Photonics Network (APN) and Photonics-Electronics Convergence (PEC) devices designed to reduce power consumption in AI data centers by up to 100x. The exhibit features hardware powered by the Qualcomm Snapdragon X105 NTN processor for satellite-to-terrestrial 5G integration and the NVIDIA Blackwell-based accelerated computing nodes for the ''GPU over APN'' solution, which enables high-speed, low-latency AI inference across distributed sites. The stand also highlights NTT DOCOMO's 6G ''Network for AI'' concept, utilizing real-time haptic feedback and autonomous robot control.

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#13435620

12 Mar 2026

The Intility logo and company signage appear on the company headquarters building facade in Oslo, Norway, on May 11, 2024. Intility is a Norwegian IT company and provider of IT operations services.

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#13435757

12 Mar 2026

The One.com logo signage is on the office building facade in Malmoe, Sweden, on May 12, 2024. One.com is a European provider of web services specializing in hosting, domains, and email solutions for individuals and small and medium-sized enterprises.

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#13413580

7 Mar 2026

The Nubia M153, an AI-native smartphone developed by ZTE in collaboration with ByteDance, is showcased at the Fira Gran Via in Barcelona, Spain, on March 5, 2026. It features its OS-level Doubao AI Assistant capable of cross-app task execution, powered by the Qualcomm Snapdragon 8 Elite (Snapdragon 8 Gen 4/5 architecture) processor with 16GB of RAM and 512GB of storage. It highlights its 50-megapixel triple camera system and a high-density 6,000mAh battery designed for intensive agentic AI workloads during the Mobile World Congress (MWC).

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#13413582

7 Mar 2026

The Nubia M153, an AI-native smartphone developed by ZTE in collaboration with ByteDance, is showcased at the Fira Gran Via in Barcelona, Spain, on March 5, 2026. It features its OS-level Doubao AI Assistant capable of cross-app task execution, powered by the Qualcomm Snapdragon 8 Elite (Snapdragon 8 Gen 4/5 architecture) processor with 16GB of RAM and 512GB of storage. It highlights its 50-megapixel triple camera system and a high-density 6,000mAh battery designed for intensive agentic AI workloads during the Mobile World Congress (MWC).

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#13031449

27 Nov 2025

A traveler focuses intently on a smartphone displaying a navigation application in Venice, Italy, on November 16, 2025.

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