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"semiconductor."
1,849 professional editorial images found
#13489644
23 Mar 2026
The Synopsys logo is displayed on a smartphone screen against an abstract background of electronic circuits in Creteil, France, on March 23, 2026. Activist fund Elliott Investment Management acquires a multi-billion dollar stake in the American chip design software specialist.
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#13489645
23 Mar 2026
The Synopsys logo is displayed on a smartphone screen against an abstract background of electronic circuits in Creteil, France, on March 23, 2026. Activist fund Elliott Investment Management acquires a multi-billion dollar stake in the American chip design software specialist.
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#13489646
23 Mar 2026
The Synopsys logo is displayed on a smartphone screen in front of another company logo in the background, in Creteil, France, on March 23, 2026, as Elliott Investment Management acquires a multi-billion dollar stake in the American chip design software specialist.
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#13489647
23 Mar 2026
The Synopsys logo is displayed on a smartphone screen in front of another company logo in the background, in Creteil, France, on March 23, 2026, as Elliott Investment Management acquires a multi-billion dollar stake in the American chip design software specialist.
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#13489653
23 Mar 2026
The Synopsys logo is displayed on the screen of a smartphone placed on a reflective surface onto which an illustration of electronic circuits is projected, in Creteil, France, on March 23, 2026. Activist fund Elliott Investment Management acquires a multi-billion dollar stake in the American chip design software specialist.
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#13489654
23 Mar 2026
The Synopsys logo is displayed on the screen of a smartphone placed on a reflective surface onto which an illustration of electronic circuits is projected, in Creteil, France, on March 23, 2026. Activist fund Elliott Investment Management acquires a multi-billion dollar stake in the American chip design software specialist.
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#13489655
23 Mar 2026
The Synopsys logo is displayed on the screen of a smartphone placed on a reflective surface onto which an illustration of electronic circuits is projected, in Creteil, France, on March 23, 2026. Activist fund Elliott Investment Management acquires a multi-billion dollar stake in the American chip design software specialist.
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#13489656
23 Mar 2026
The Synopsys logo is displayed on the screen of a smartphone placed on a reflective surface onto which an illustration of electronic circuits is projected, in Creteil, France, on March 23, 2026. Activist fund Elliott Investment Management acquires a multi-billion dollar stake in the American chip design software specialist.
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#13439908
13 Mar 2026
The Snapdragon corporate logo is illuminated at the Qualcomm pavilion in Hall 3 of the Fira Gran Via, representing the launch of the Snapdragon 8 Elite Gen 5 (SM8850-AC) mobile platform during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The 3nm architecture processor features the new Oryon V3 CPU and an enhanced Hexagon NPU capable of delivering over 80 TOPS for on-device generative AI. The branding highlights the expansion of the Snapdragon ecosystem into automotive with the Snapdragon Cockpit Elite and computing with the Snapdragon X Elite Gen 2, which powers the latest Windows 11 Copilot+ PCs. The exhibit showcases seamless multimodal AI processing across smartphones, XR glasses, and connected vehicles, emphasizing the Qualcomm AI Stack and ultra-low latency 5G-Advanced connectivity through the Snapdragon X85 Modem-RF System.
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#13439910
13 Mar 2026
The Intel corporate logo is showcased at the Fira Gran Via booth, highlighting the company's role in the ''AI Everywhere'' era during the Mobile World Congress. The exhibit features the latest Intel Core Ultra 300 (Series 3) processors with integrated NPU 5.0, delivering over 50 TOPS for local generative AI processing. The display highlights the Intel Xeon 6 processors with P-cores and E-cores for optimized telecom workloads and the Intel vPro platform's new security features for AI-ready enterprise fleets. Visitors observe demonstrations of the OpenVINO 2026.0 toolkit for cross-architectural AI deployment and the Intel Gaudi 4 AI accelerator, designed to compete in the large-scale LLM training and inference market for sovereign cloud providers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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#13439911
13 Mar 2026
The Intel corporate logo is showcased at the Fira Gran Via booth, highlighting the company's role in the ''AI Everywhere'' era during the Mobile World Congress. The exhibit features the latest Intel Core Ultra 300 (Series 3) processors with integrated NPU 5.0, delivering over 50 TOPS for local generative AI processing. The display highlights the Intel Xeon 6 processors with P-cores and E-cores for optimized telecom workloads and the Intel vPro platform's new security features for AI-ready enterprise fleets. Visitors observe demonstrations of the OpenVINO 2026.0 toolkit for cross-architectural AI deployment and the Intel Gaudi 4 AI accelerator, designed to compete in the large-scale LLM training and inference market for sovereign cloud providers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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#13439923
13 Mar 2026
The MediaTek corporate logo is displayed at the Fira Gran Via booth with the slogan ''Complete End-to-End Solutions,'' highlighting the company's ''AI For Life'' ecosystem during the Mobile World Congress. The exhibit features the flagship Dimensity 9500 processor, built on a 3nm process with an All-Big-Core architecture (Cortex-X925 ultra core at 3.73 GHz) and the NPU 890 for advanced generative AI. The branding emphasizes MediaTek's leadership in connectivity, showcasing the Dimensity Auto MT2739 telematics platform with 3GPP Release 17/18 NR-NTN satellite support and the first wave of Wi-Fi 8 solutions using the Filogic 8000 series chipsets. The display highlights the convergence of edge-to-cloud intelligence, including Sovereign AI for automotive cockpits and RedCap (Reduced Capability) technology for mass-market 5G IoT devices during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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#13439927
13 Mar 2026
The MediaTek corporate logo features at the Fira Gran Via booth, representing the company's ''AI For Life: From Edge to Cloud'' strategy during the Mobile World Congress. The exhibit showcases the flagship Dimensity 9500 processor, built on TSMC's 3nm (N3P) process and featuring an All Big Core architecture with a Cortex-X925 ultra-core clocked at 3.73 GHz. The display highlights the new NPU 9.0 (Neural Processing Unit) delivering 100 TOPS of computing power for on-device generative video and agentic AI. The branding encompasses the Dimensity Auto MT2739 platform for satellite-connected vehicles and the first commercial Wi-Fi 8 solutions using the Filogic 8000 series, emphasizing MediaTek's leadership in high-speed, low-latency connectivity for smartphones, IoT, and next-generation data centers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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#13426903
10 Mar 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426905
10 Mar 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426908
10 Mar 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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