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MWC Shanghai

Exhibitors are demonstrating the world's first solid-state active cooling chip at the 2024 Mobile World Congress (MWC Shanghai) in Shanghai, China, on June 26, 2024. (Photo by Costfoto/NurPhoto)

Photo Details

Photo ID	#11362750
Date Taken	26 June 2024
Location	N/A
Photographer	Costfoto/NurPhoto
Category	Science and Technology
Copyright	© 2026 NurPhoto - Costfoto/NurPhoto

Related Keywords

MWC Shanghai Shanghai China June 26 2024 Exhibitors World's first solid-state active cooling chip 2024 Mobile World Congress MWC Shanghai Costfoto NurPhoto technology innovation electronics cooling technology mobile devices semiconductor engineering tech exhibition tech showcase cutting-edge advancements thermal management hardware cooling solutions tech industry mobile technology future tech chip development electronic devices tech trends new technology thermal regulation.

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