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MWC Shanghai

The world's first solid-state active cooling chip, which is waterproof, is being pictured at the 2024 Mobile World Congress (MWC Shanghai) in Shanghai, China, on June 26, 2024. (Photo by Costfoto/NurPhoto)

Photo Details

Photo ID	#11362751
Date Taken	26 June 2024
Location	N/A
Photographer	Costfoto/NurPhoto
Category	Science and Technology
Copyright	© 2026 NurPhoto - Costfoto/NurPhoto

Related Keywords

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