Editorial photo #12227019 Science and Technology

Mobile World Congress Barcelona 2025

The Compal RML-NV2 Module chip, a chip by the Taiwanese company Compal and the semiconductor manufacturer MediaTek, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto)

Photo details

Photo ID: #12227019
Date taken: 5 March 2025
Location: —
Photographer: Joan Cros/NurPhoto
Category: Science and Technology

Related keywords

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