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Technology Trade Show

Several MediaTek chips from MediaTek Dimensity Auto Solutions, a range of new automotive solutions for car cockpits by the Taiwanese semiconductor manufacturer, are exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto)

Photo Details

Photo ID	#12397018
Date Taken	5 March 2025
Location	N/A
Photographer	Joan Cros/NurPhoto
Category	Science and Technology
Copyright	© 2026 NurPhoto - Joan Cros/NurPhoto

Related Keywords

Mobile World Congress MWC MWC25 AI Artificial intelligence connectivity telecom telecommunication telecommunications Mobile Event Mobile Fair congress tech technology open AI generative AI AGI generative artificial intelligence smartphone Barcelona Spain MediaTek chips MediaTek Dimensity Auto Solutions automotive solutions car cockpits Taiwanese semiconductor manufacturer Mobile World Congress 2025 exhibition Joan Cros NurPhoto semiconductor technology automotive industry innovation electronics car technology automotive chips semiconductor solutions Dimensity series automotive electronics smart cars vehicle technology digital cockpits automotive innovation tech exhibition global tech event semiconductor industry advanced automotive solutions.

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