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Technology Trade Show

The Quectel RG225G, a 5G RedCap MediaTek-based module chip developed by the Taiwanese semiconductor company together with the Canadian Quectel Wireless Solutions, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto)

Photo Details

Photo ID	#12397026
Date Taken	5 March 2025
Location	N/A
Photographer	Joan Cros/NurPhoto
Category	Science and Technology
Copyright	© 2025 NurPhoto - Joan Cros/NurPhoto

Related Keywords

Mobile World Congress MWC MWC25 AI Artificial intelligence connectivity telecom telecommunication telecommunications Mobile Event Mobile Fair congress tech technology open AI generative AI AGI generative artificial intelligence chip microchip qualcom Barcelona Spain Quectel RG225G 5G RedCap MediaTek module chip Taiwanese semiconductor Canadian Quectel Wireless Solutions Mobile World Congress 2025 Joan Cros NurPhoto exhibition technology innovation telecommunications wireless solutions semiconductor industry connectivity mobile technology network data transfer high-speed internet global event trade show tech industry collaboration international partnership advanced technology mobile communications tech showcase.

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