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Technology Trade Show

The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed for 5G IoT applications, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto)

Photo Details

Photo ID	#12397027
Date Taken	5 March 2025
Location	N/A
Photographer	Joan Cros/NurPhoto
Category	Science and Technology
Copyright	© 2026 NurPhoto - Joan Cros/NurPhoto

Related Keywords

Mobile World Congress MWC MWC25 AI Artificial intelligence connectivity telecom telecommunication telecommunications Mobile Event Mobile Fair congress tech technology open AI generative AI AGI generative artificial intelligence chip microchip qualcom Barcelona Spain Fibocom FG332 3GPP R17 module chip Chinese company Taiwanese semiconductor manufacturer MediaTek 5G ioT applications Mobile World Congress 2025 Joan Cros NurPhoto exhibition technology telecommunications innovation connectivity wireless communication future tech global event tech industry digital transformation smart devices network solutions tech showcase mobile technology international conference tech advancements industry trends digital ecosystem tech development.

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