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Technology Trade Show

The Compal RML-NV2 Module chip, a chip by the Taiwanese company Compal and the semiconductor manufacturer MediaTek, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto)

Photo Details

Photo ID	#12397028
Date Taken	5 March 2025
Location	N/A
Photographer	Joan Cros/NurPhoto
Category	Science and Technology
Copyright	© 2026 NurPhoto - Joan Cros/NurPhoto

Related Keywords

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