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Technology Trade Show

An image of MediaTek's flagship chip, the MediaTek Dimensity 9400, an all-big core CPI designed for AI-equipped smartphones by the Taiwanese semiconductor manufacturer, is displayed during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto)

Photo Details

Photo ID	#12397031
Date Taken	5 March 2025
Location	N/A
Photographer	Joan Cros/NurPhoto
Category	Science and Technology
Copyright	© 2026 NurPhoto - Joan Cros/NurPhoto

Related Keywords

Mobile World Congress MWC MWC25 AI Artificial intelligence connectivity telecom telecommunication telecommunications Mobile Event Mobile Fair congress tech technology open AI generative AI AGI generative artificial intelligence chip microchip qualcom MediaTek flagship chip Dimensity 9400 all-big core CPI AI-equipped smartphones Taiwanese semiconductor manufacturer Mobile World Congress 2025 Barcelona Spain Joan Cros NurPhoto semiconductor technology innovation mobile devices smartphone technology artificial intelligence chip design computing power mobile processors next-generation chips hardware development tech exhibition mobile industry smart devices electronics digital innovation processor architecture chip performance mobile technology trends tech advancements.

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