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Technology Trade Show

In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, including the X82 5G M.2 module and the LGA module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. These components are exhibited in the Qualcomm pavilion during the Mobile World Congress 2025. (Photo by Joan Cros/NurPhoto)

Photo Details

Photo ID	#12685550
Date Taken	5 March 2025
Location	N/A
Photographer	Joan Cros/NurPhoto
Category	Science and Technology
Copyright	© 2026 NurPhoto - Joan Cros/NurPhoto

Related Keywords

Mobile World Congress MWC MWC25 AI Artificial intelligence connectivity telecom telecommunication telecommunications Mobile Event Mobile Fair congress tech technology open AI generative AI AGI generative artificial intelligence Qualcom chip 5G Qualcomm chipset components X82 5G M.2 module LGA module technology high-speed connectivity advanced performance next-generation devices exhibition Qualcom pavilion Mobile World Congress 2025 Barcelona Spain Joan Cros NurPhoto close-up cutting-edge high-speed connectivity performance module devices pavilion congress March Qualcomm chipset technology exhibition advanced technology connectivity module.

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