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Technology Trade Show

In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, the X82 5G LGA Module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. It is exhibited in the Qualcomm pavilion during the Mobile World Congress 2025. (Photo by Joan Cros/NurPhoto)

Photo Details

Photo ID	#12685551
Date Taken	5 March 2025
Location	N/A
Photographer	Joan Cros/NurPhoto
Category	Science and Technology
Copyright	© 2026 NurPhoto - Joan Cros/NurPhoto

Related Keywords

Mobile World Congress MWC MWC25 AI Artificial intelligence connectivity telecom telecommunication telecommunications Mobile Event Mobile Fair congress tech technology open AI generative AI AGI generative artificial intelligence Qualcom chip 5G Barcelona Spain Qualcomm chipset components X82 5G LGA Module cutting-edge technology high-speed connectivity advanced performance next-generation devices exhibition Qualcomm pavilion Mobile World Congress 2025 Joan Cros NurPhoto technology innovation connectivity performance devices telecommunications mobile wireless networking electronics hardware digital tech industry global event tech showcase

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