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Technology Trade Show

In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, the X82 5G M.2 Module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. It is exhibited in the Qualcomm pavilion during the Mobile World Congress 2025. (Photo by Joan Cros/NurPhoto)

Photo Details

Photo ID	#12685552
Date Taken	5 March 2025
Location	N/A
Photographer	Joan Cros/NurPhoto
Category	Science and Technology
Copyright	© 2026 NurPhoto - Joan Cros/NurPhoto

Related Keywords

Mobile World Congress MWC MWC25 AI Artificial intelligence connectivity telecom telecommunication telecommunications Mobile Event Mobile Fair congress tech technology open AI generative AI AGI generative artificial intelligence Qualcom chip 5G Barcelona Spain Qualcomm chipset components X82 5G M.2 Module technology high-speed connectivity advanced performance next-generation devices Qualcom pavilion Mobile World Congress 2025 exhibition Joan Cros NurPhoto close-up cutting-edge showcase high-performance connectivity module pavilion congress photo March exhibition innovation telecommunications wireless technology.

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