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Mobile World Congress 2026

A close-up view of the base unit of the TECNO Modular Magnetic Concept Phone (ATOM Edition) is on display at MWC 2026. The device showcases an industry-leading ultra-slim profile of just 4.9mm, achieved by relocating traditional internal components into external magnetic modules. The rear of the handset features a specialized Magnetic Interconnection surface with exposed contact points, allowing for seamless power and data transfer with various hardware attachments. Its minimalist silver finish and compact form factor represent a radical departure from traditional smartphone architecture, prioritizing a ''thin-and-light'' core that can be expanded on demand during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. (Photo by Joan Cros/NurPhoto)

Mobile World Congress MWC 2026 Barcelona technology trade show telecommunications mobile industry smartphone launch consumer electronics innovation artificial intelligence AI technology 5G 6G mobile devices tech exhibition global technology event digital economy connectivity future technology TECNO Modular Smartphone Ultra-Slim Phone 4.9mm Concept Phone Magnetic Interconnection ATOM Edition Minimalist Tech Hardware Innovation Future Device Barcelona Spain March 2026 TECNO Modular Magnetic Concept Phone ATOM Edition MWC 2026 ultra-slim profile 4.9mm magnetic modules internal components external modules Magnetic Interconnection contact points power transfer data transfer hardware attachments minimalist finish silver finish compact form factor smartphone architecture thin-and-light core expandable Mobile World Congress Joan Cros NurPhoto handset device industry-leading rear specialized surface seamless relocation traditional radical departure design.