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Mobile World Congress

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026. (Photo by Joan Cros/NurPhoto)

Photo Details

Photo ID	#13413353
Date Taken	5 March 2026
Location	N/A
Photographer	Joan Cros/NurPhoto
Category	Science and Technology
Copyright	© 2026 NurPhoto - Joan Cros/NurPhoto

Related Keywords

No People Mobile World Congress MWC 2026 Barcelona technology trade show telecommunications mobile industry smartphone launch consumer electronics innovation artificial intelligence AI technology 5G 6G mobile devices tech exhibition global technology event digital economy connectivity future technology TECNO Spain Fira Gran Via Modular Phone TECNO ATOM TECNO MODA Magnetic Interconnection Snapdragon 8 Elite Gen 5 Modular Camera Telephoto Lens Action Camera Concept Phone Ultra-Slim 4.9mm Pogo Pins mmWave Connectivity

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