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Mobile World Congress
The Qualcomm corporate logo is prominently displayed at Booth 3E10 during the Fira Gran Via exhibition, marking the launch of the Snapdragon Wear Elite platform for personal AI wearables and the Qualcomm X105 5G Modem-RF System, the world's first 3GPP Release 19-ready solution. The showcase features the new FastConnect 8800 connectivity system with Wi-Fi 8 integration and a GigaMIMO 6G prototype demonstrating AI-native air interface sensing and distributed computing capabilities for the next decade of mobile infrastructure during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026. (Photo by Joan Cros/NurPhoto)
Photo Details
| Photo ID | #13413609 |
|---|---|
| Date Taken | |
| Location | N/A |
| Photographer | Joan Cros/NurPhoto |
| Category | Science and Technology |
| Copyright | © 2026 NurPhoto - Joan Cros/NurPhoto |
Related Keywords
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Mobile World Congress
MWC 2026
Barcelona
technology trade show
telecommunications
mobile industry
smartphone launch
consumer electronics
innovation
artificial intelligence
AI technology
5G
6G
mobile devices
tech exhibition
global technology event
digital economy
connectivity
future technology
Qualcomm
Snapdragon
Spain
Fira Gran Via
Logo
Snapdragon Wear Elite
Qualcomm X105
5G-Advanced
6G Prototype
Wi-Fi 8
FastConnect 8800
Agentic AI
Personal AI
Semiconductor
Hexagon NPU
Hall 3
3E10
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