Click image to zoom
Mobile World Congress
A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. (Photo by Joan Cros/NurPhoto)
Photo Details
| Photo ID | #13439924 |
|---|---|
| Date Taken | |
| Location | N/A |
| Photographer | Joan Cros/NurPhoto |
| Category | Science and Technology |
| Copyright | © 2026 NurPhoto - Joan Cros/NurPhoto |
Related Keywords
Mobile World Congress
MWC 2026
Barcelona
technology trade show
telecommunications
mobile industry
smartphone launch
consumer electronics
innovation
artificial intelligence
AI technology
5G
6G
mobile devices
tech exhibition
global technology event
digital economy
connectivity
future technology
MediaTek
Dimensity 9500
Dimensity AI Telephoto
Spain
Fira Gran Via
200MP ISOCELL HP5
Periscope Lens
NPU 890
Imagiq 10
AI Super Resolution
Generative AI Photography
Optical Zoom
Smartphone Tech
Cortex-X925
Computational Photography
100x Zoom
Hall 3
Tech Demo
Mobile Imaging
2026 NurPhoto. All rights reserved.
This image is the property of NurPhoto and is protected under international copyright laws.
Similar Photos
View All
