"Modular"

#13421972

8 Mar 2026

The Oklo Ink stock chart is displayed on a smartphone screen in this photo illustration, as the advanced nuclear-energy company works to develop small modular reactors aimed at supplying clean power for data centers and artificial-intelligence infrastructure in Brussels, Belgium, on March 8, 2026. (Photo Illustration by Jonathan Raa/NurPhoto)

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#13421973

8 Mar 2026

The Oklo Ink stock chart is displayed on a smartphone screen in this photo illustration, as the advanced nuclear-energy company works to develop small modular reactors aimed at supplying clean power for data centers and artificial-intelligence infrastructure in Brussels, Belgium, on March 8, 2026. (Photo Illustration by Jonathan Raa/NurPhoto)

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#13421974

8 Mar 2026

The Oklo Ink stock chart is displayed on a smartphone screen in this photo illustration, as the advanced nuclear-energy company works to develop small modular reactors aimed at supplying clean power for data centers and artificial-intelligence infrastructure in Brussels, Belgium, on March 8, 2026. (Photo Illustration by Jonathan Raa/NurPhoto)

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#13413350

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413351

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413352

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413353

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413354

7 Mar 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413397

7 Mar 2026

The TECNO corporate logo, displayed under the theme ''Pioneering the Connection of Intelligence'' at Booth 7A40, represents the global technology brand unveiling its AI-powered ecosystem, including the Camon 50 Ultra with the MediaTek Dimensity 7400 Ultimate chipset and the revolutionary Modular Magnetic concept phone with mmWave interconnection. It is pictured at the Fira Gran Via exhibition center during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413913

7 Mar 2026

The Honor Magic 8 Pro is equipped with the Professional Imaging Kit accessory at the Fira Gran Via, featuring a modular 2.35x telephoto extender lens that, combined with the device's native periscope, achieves an equivalent 200mm focal length with fluorite-level color accuracy. The system is powered by the Qualcomm Snapdragon 8 Elite Gen 5 platform and features a 200-megapixel Samsung ISOCELL HP9 telephoto sensor (1/1.4-inch) alongside a 50-megapixel main camera with CIPA 6.5 stabilization. The kit adds a magnetic ergonomic grip with a physical two-step shutter button, a zoom lever, and a 67mm universal thread for professional ND and polarizer filters, as the brand demonstrates advanced low-light ''Ultra Night'' cinematography during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13406548

6 Mar 2026

A detailed view of the TECNO Modular Magnetic Concept Phone (MODA Edition) showcases at MWC 2026. The image highlights the revolutionary Modular Magnetic Interconnection Technology (MMIT), featuring the large-format Telephoto Lens Module docked onto the ultra-slim 4.9mm chassis. The module, which houses a dedicated high-resolution image sensor and a physical optical zoom assembly, transforms the minimalist smartphone into a high-performance imaging system. The sleek, industrial design of the hardware, with its exposed magnetic contact points and metallic finish, underscores the shift toward a customizable, modular future for mobile technology during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13406549

6 Mar 2026

A close-up view of the base unit of the TECNO Modular Magnetic Concept Phone (ATOM Edition) is on display at MWC 2026. The device showcases an industry-leading ultra-slim profile of just 4.9mm, achieved by relocating traditional internal components into external magnetic modules. The rear of the handset features a specialized Magnetic Interconnection surface with exposed contact points, allowing for seamless power and data transfer with various hardware attachments. Its minimalist silver finish and compact form factor represent a radical departure from traditional smartphone architecture, prioritizing a ''thin-and-light'' core that can be expanded on demand during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13406543

6 Mar 2026

A large crowd gathers at the TECNO booth during the final day of MWC 2026 to experience the Modular Magnetic Concept Phone. Attendees test the innovative Modular Magnetic Interconnection Technology, which allows for the instant attachment of hardware modules via a high-strength magnetic system. The demonstration features the Telephoto Lens and Action Camera modules, which transform the ultra-slim 4.9mm smartphone into a professional-grade imaging device. This concept reflects TECNO's vision for a future where mobile hardware is as adaptable as software, enabling users to reconfigure their device's physical capabilities on demand during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13364313

23 Feb 2026

ZIELONKA, POLAND – FEBRUARY 19: A view of the PIAP MULES (Mobile Universal Logistics and Evacuation System) autonomous uncrewed ground vehicle (UGV) during a demonstration of unmanned weapon systems at the Military Institute of Armament Technology (WITU) training ground in Zielonka, Poland, on February 19, 2026.

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#13364212

23 Feb 2026

ZIELONKA, POLAND – FEBRUARY 19: A view of the PIAP HUNTeR, a heavy unmanned ground vehicle (UGV) equipped with a remote-controlled weapon station, is seen operating alongside a smaller autonomous robot, PIAP MULES (Mobile Universal Logistics and Evacuation System), during a demonstration of unmanned weapon systems at the Military Institute of Armament Technology training ground in Zielonka, Poland, on February 19, 2026.

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#13200746

16 Jan 2026

A modular house is on the edge of a snow-covered forest in Kyiv region, Ukraine, on January 15, 2026

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