"data intelligence"

#13439917

13 March 2026

A live demonstration of the Vadiio Generative AI platform performs a semantic search for a ''person carrying a child'' across multiple security feeds at the Fira Gran Via. The system analyzes 4K video streams from Nokia i-Pro smart cameras equipped with 20-megapixel sensors, utilizing the NVIDIA Blackwell B200 GPU architecture for real-time natural language processing (NLP) of visual data. Powered by Intel Xeon 6 processors with vRAN Boost, the interface showcases how generative AI replaces traditional manual scrubbing with instant metadata filtering. The setup highlights the Nokia ReefShark SoC for ultra-low latency data backhaul and the Nokia AVA (Adaptive Virtual Assistant) framework, enabling complex object and behavioral recognition within a secure Sovereign AI environment during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439921

13 March 2026

The Cisco corporate logo features prominently at the Fira Gran Via, highlighting the company's focus on AI-native networking and cybersecurity during the Mobile World Congress. The exhibit showcases the Cisco Silicon One G200 and G202 processors, which power the next generation of high-density switches for AI back-end networks with up to 51.2 Tbps of switching capacity. The display highlights the integration of Cisco Hypershield and Splunk analytics for AI-driven threat detection and automated network management. Visitors explore the Cisco ThousandEyes platform for end-to-end visibility in 5G-Advanced and Wi-Fi 7 environments, while the pavilion emphasizes sustainable data center solutions using Liquid Cooling and Cisco UCS servers equipped with the latest Intel Xeon 6 processors during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439922

13 March 2026

A photorealistic 3D hologram of a remote participant is projected onto a specialized display at the Cisco pavilion in Hall 3 of the Fira Gran Via, showcasing the evolution of the Webex Hologram platform during the Mobile World Congress. The system utilizes a multi-camera array consisting of 12-megapixel Sony IMX sensors to capture volumetric data, which is then processed by NVIDIA RTX 6000 Ada Generation GPUs to ensure lifelike textures and motion. The demonstration is powered by Cisco Silicon One architecture and Intel Xeon 6 processors at the edge to maintain sub-10ms latency, essential for synchronous holographic communication. The display features Light Field technology on a transparent OLED panel, allowing attendees to interact with the digital twin as if they are in the same physical space, highlighting the convergence of 5G-Advanced bandwidth and AI-driven spatial computing during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439924

13 March 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439925

13 March 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439927

13 March 2026

The MediaTek corporate logo features at the Fira Gran Via booth, representing the company's ''AI For Life: From Edge to Cloud'' strategy during the Mobile World Congress. The exhibit showcases the flagship Dimensity 9500 processor, built on TSMC's 3nm (N3P) process and featuring an All Big Core architecture with a Cortex-X925 ultra-core clocked at 3.73 GHz. The display highlights the new NPU 9.0 (Neural Processing Unit) delivering 100 TOPS of computing power for on-device generative video and agentic AI. The branding encompasses the Dimensity Auto MT2739 platform for satellite-connected vehicles and the first commercial Wi-Fi 8 solutions using the Filogic 8000 series, emphasizing MediaTek's leadership in high-speed, low-latency connectivity for smartphones, IoT, and next-generation data centers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439930

13 March 2026

The Starlink corporate logo, part of the SpaceX ecosystem, is seen against a clear blue sky at the Fira Gran Via in Barcelona, Spain, on March 5, 2026. It represents the global expansion of the Starlink Gen2 satellite constellation during the Mobile World Congress. The exhibit showcases the new Starlink Standard Kit (V4) and the Flat High Performance terminal, powered by a custom quad-core ARM-based Starlink SoC designed for low-power beamforming and phased-array antenna management. The branding highlights the commercial launch of Direct-to-Cell services, utilizing the LTE/5G-Advanced spectrum to provide emergency messaging and data connectivity directly to unmodified smartphones through eNodeB satellite payloads. Visitors explore the integration of the Starlink Mobility platform with Wi-Fi 7 routers, offering download speeds exceeding 300 Mbps and latencies below 25ms for remote industrial and maritime applications.

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#13439931

13 March 2026

The SpaceX corporate logo is displayed at the Fira Gran Via outdoor exhibit, marking the launch of Starlink Mobile (Direct-to-Cell) services during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The display features the Starlink V2 satellite payloads, which utilize a massive phased array antenna and MIMO technology to deliver 5G speeds of up to 150 Mbps directly to unmodified smartphones. The hardware showcase includes the Starlink Standard V4 terminal, powered by a custom SpaceX-designed quad-core ARM SoC for electronic beamforming, alongside the Gen 3 Tri-band Wi-Fi 6 router supporting up to 235 devices. The exhibit highlights the integration of 3GPP Release-19 NR-NTN standards for seamless handovers between terrestrial and satellite networks, providing critical voice and data connectivity through eNodeB payloads in orbit for emergency services and remote industrial operations.

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#13439936

13 March 2026

The official 6G logo is displayed at the Qualcomm booth in Hall 3 of the Fira Gran Via, marking the company's leadership in AI-native wireless research during the Mobile World Congress. The exhibit features an end-to-end 6G prototype system utilizing Giga-MIMO technology with 2,048 antenna elements to maximize spectral efficiency in the 7 GHz and 13 GHz bands. Powered by the Qualcomm X105 5G-Advanced Modem-RF system as a foundational bridge, the demonstration highlights sub-band full duplex and probabilistic shaping techniques to achieve peak data rates exceeding 14.8 Gbps. The display showcases how 6G integrates sensing and communication to enable Digital Twins and autonomous vehicle orchestration, supported by Intel Xeon 6 edge servers and Qualcomm's specialized NPU-driven air interface that adapts to real-world RF environments in real-time during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439937

13 March 2026

The official 6G logo is displayed at the Qualcomm booth in Hall 3 of the Fira Gran Via, marking the company's leadership in AI-native wireless research during the Mobile World Congress. The exhibit features an end-to-end 6G prototype system utilizing Giga-MIMO technology with 2,048 antenna elements to maximize spectral efficiency in the 7 GHz and 13 GHz bands. Powered by the Qualcomm X105 5G-Advanced Modem-RF system as a foundational bridge, the demonstration highlights sub-band full duplex and probabilistic shaping techniques to achieve peak data rates exceeding 14.8 Gbps. The display showcases how 6G integrates sensing and communication to enable Digital Twins and autonomous vehicle orchestration, supported by Intel Xeon 6 edge servers and Qualcomm's specialized NPU-driven air interface that adapts to real-world RF environments in real-time during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439956

13 March 2026

In Barcelona, Spain, on March 5, 2026, a detailed view of a 5G-connected smart ambulance backpack designed for first responders is featured at the GSMA Foundry pavilion. The tactical medical kit integrates a rugged Panasonic Toughbook G3 tablet, which serves as the central command hub powered by the Qualcomm Snapdragon 8 Gen 5 processor. The system is equipped with a 50-megapixel ultra-wide camera with low-light optimization for remote teleconsultation and real-time triage. The tablet's interface displays live telemetry from integrated IoT smart sensors, including a wearable ECG patch, a wireless pulse oximeter, and a 256x192 thermal imaging sensor for locating victims in low-visibility environments. Utilizing 5G-Advanced network slicing for prioritized data transmission, the kit allows paramedics to synchronize vital signs and high-definition video feeds directly with hospital emergency rooms during the Mobile World Congress (MWC).

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#13439958

13 March 2026

A scale model of the Starlink V2 (Gen 2) satellite is on display at the T-Mobile (Deutsche Telekom) exhibition booth during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The mockup represents the next-generation low-Earth orbit (LEO) spacecraft designed for Direct-to-Cell connectivity, featuring massive phased array antennas and custom-designed silicon. This hardware allows unmodified 5G smartphones, powered by modems like the Qualcomm Snapdragon X80 or the Snapdragon X105 NTN, to connect directly to the satellite network for text, voice, and data services. The Starlink V2 satellites used in the T-Mobile partnership integrate eNodeB technology in space, effectively acting as cell towers in orbit to eliminate coverage ''dead zones'' across Europe and the US. The model highlights the deployable solar arrays and the advanced radio frequency (RF) system designed to support high-density traffic and emergency 5G-Advanced services.

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#13439928

13 March 2026

The Cisco corporate logo is seen at the Fira Gran Via, highlighting the company's focus on AI-ready infrastructure and integrated cybersecurity solutions during the Mobile World Congress. The exhibit showcases the Cisco Silicon One G200 and G202 processors, which power high-density Ethernet switches with up to 51.2 Tbps of switching capacity to minimize latency in AI training clusters. The display features the integration of Cisco Hypershield and the Splunk observability platform, utilizing the NVIDIA BlueField-3 DPU for hardware-accelerated security and real-time threat detection. Visitors explore the Cisco UCS (Unified Computing System) servers equipped with Intel Xeon 6 processors, demonstrating liquid-cooling technologies and energy-efficient operations for the next generation of 5G-Advanced core networks during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13436163

12 March 2026

Attendees observe a presentation on Samsung SDI's UPS (Uninterruptible Power Supply) solutions for AI data centers at the InterBattery 2026 exhibition in Seoul, South Korea, on March 12, 2026.

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#13436164

12 March 2026

Attendees observe a presentation on Samsung SDI's UPS (Uninterruptible Power Supply) solutions for AI data centers at the InterBattery 2026 exhibition in Seoul, South Korea, on March 12, 2026.

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#13436176

12 March 2026

Samsung SDI displays its lineup of NCA and LFP battery cells integrated with SBI (Samsung Battery Intelligence) AI software at the InterBattery 2026 exhibition in Seoul, South Korea, on March 12, 2026.

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