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"mobile engineering"
583 professional editorial images found
#13406572
6 March 2026
The Huawei Mate XT Ultimate Design is showcased at the Huawei pavilion during MWC 2026, demonstrating its unique Z-shaped tri-fold mechanism. The device is fully unfolded into its 10.2-inch tablet mode, featuring a nearly bezel-less 3K OLED display. With a record-breaking thickness of just 3.6mm when open, the Mate XT utilizes a dual-hinge system--one folding inward and one outward--to transition between a 6.4-inch smartphone, a 7.9-inch dual-screen, and a full productivity workstation. The hardware is finished in premium red vegan leather with gold ''Star Diamond'' accents around the XMAGE camera array, representing the pinnacle of luxury foldable engineering during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13406573
6 March 2026
The Huawei Mate XT Ultimate Design is showcased at the Huawei pavilion during MWC 2026, demonstrating its unique Z-shaped tri-fold mechanism. The device is fully unfolded into its 10.2-inch tablet mode, featuring a nearly bezel-less 3K OLED display. With a record-breaking thickness of just 3.6mm when open, the Mate XT utilizes a dual-hinge system--one folding inward and one outward--to transition between a 6.4-inch smartphone, a 7.9-inch dual-screen, and a full productivity workstation. The hardware is finished in premium red vegan leather with gold ''Star Diamond'' accents around the XMAGE camera array, representing the pinnacle of luxury foldable engineering during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13406574
6 March 2026
The Huawei Mate XT Ultimate Design is showcased at the Huawei pavilion during MWC 2026, demonstrating its unique Z-shaped tri-fold mechanism. The device is fully unfolded into its 10.2-inch tablet mode, featuring a nearly bezel-less 3K OLED display. With a record-breaking thickness of just 3.6mm when open, the Mate XT utilizes a dual-hinge system--one folding inward and one outward--to transition between a 6.4-inch smartphone, a 7.9-inch dual-screen, and a full productivity workstation. The hardware is finished in premium red vegan leather with gold ''Star Diamond'' accents around the XMAGE camera array, representing the pinnacle of luxury foldable engineering during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13405031
5 March 2026
In this photo illustration in Athens, Greece, on March 5, 2026, a close-up of a printed circuit board (PCB) is seen, while the Qualcomm logo is displayed on a screen in the background. Qualcomm is one of the biggest semiconductor companies making chipsets.
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#13403059
4 March 2026
The Honor Humanoid Robot, the first consumer-grade android developed by the Chinese technology company Honor Device Co., Ltd. as part of its ''Alpha Plan'' for embodied AI, is exhibited at MWC 2026 in Barcelona, where it interacts with a circle of congress delegates who observe its fluid, human-like joint movements and touch-sensitive surfaces during the Mobile World Congress (MWC) in Barcelona, Spain, on March 4, 2026.
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#13403060
4 March 2026
The Honor Humanoid Robot, the first consumer-grade android developed by the Chinese technology company Honor Device Co., Ltd. as part of its ''Alpha Plan'' for embodied AI, is exhibited at MWC 2026 in Barcelona, where it interacts with a circle of congress delegates who observe its fluid, human-like joint movements and touch-sensitive surfaces during the Mobile World Congress (MWC) in Barcelona, Spain, on March 4, 2026.
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#13403062
4 March 2026
The Honor Humanoid Robot, the first consumer-grade android developed by the Chinese technology company Honor Device Co., Ltd. as part of its ''Alpha Plan'' for embodied AI, is exhibited at MWC 2026 in Barcelona, where it interacts with a circle of congress delegates who observe its fluid, human-like joint movements and touch-sensitive surfaces during the Mobile World Congress (MWC) in Barcelona, Spain, on March 4, 2026.
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#13403063
4 March 2026
The Honor Humanoid Robot, the first consumer-grade android developed by the Chinese technology company Honor Device Co., Ltd. as part of its ''Alpha Plan'' for embodied AI, is exhibited at MWC 2026 in Barcelona, where it interacts with a circle of congress delegates who observe its fluid, human-like joint movements and touch-sensitive surfaces during the Mobile World Congress (MWC) in Barcelona, Spain, on March 4, 2026.
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#13403070
4 March 2026
The Themis humanoid robot by Westwood Robotics, integrated with Dassault Systemes' 3DEXPERIENCE platform for industrial AI and virtual twin simulation, is exhibited performing a high-precision analysis of a beer to monitor liquid quality and foam stability. This demonstrates how complex sensory tasks are first optimized in a virtual environment before real-world deployment during the Mobile World Congress (MWC) in Barcelona, Spain, on March 4, 2026.
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#13400110
4 March 2026
A technician adjusts a robot as other robotic units lie on the floor during the Mobile World Congress (MWC) 2026 in Barcelona, Spain, on March 2, 2026.
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#13400098
4 March 2026
A visitor looks at the IBM Quantum System Two during the Mobile World Congress (MWC) 2026 in Barcelona, Spain, on March 3, 2026.
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#13400114
4 March 2026
A visitor looks at the IBM Quantum System Two during the Mobile World Congress (MWC) 2026 in Barcelona, Spain, on March 3, 2026.
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#13401002
4 March 2026
Tim Berners-Lee, creator of the HTTP protocol and the World Wide Web, attends the Talent Arena during the Mobile World Congress in Barcelona, Spain, on March 3, 2026.
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#13401003
4 March 2026
Tim Berners-Lee, creator of the HTTP protocol and the World Wide Web, attends the Talent Arena during the Mobile World Congress in Barcelona, Spain, on March 3, 2026.
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#13401004
4 March 2026
Tim Berners-Lee, creator of the HTTP protocol and the World Wide Web, attends the Talent Arena during the Mobile World Congress in Barcelona, Spain, on March 3, 2026.
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#13401005
4 March 2026
Tim Berners-Lee, creator of the HTTP protocol and the World Wide Web, attends the Talent Arena during the Mobile World Congress in Barcelona, Spain, on March 3, 2026.
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