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"AI Chip"
805 professional editorial images found
#13457391
16 Mar 2026
An illuminated 3D sign featuring the lettering ''Ai Home,'' with the letter 'O' replaced by a stylized robot head icon, is displayed at the entrance of the Xiaomi Smart Living zone during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This installation serves as the centerpiece for the global launch of the Xiaomi HyperOS 3 integrated ecosystem, demonstrating the interconnection between smartphones, smart appliances, and the Xiaomi SU7 Ultra electric vehicle. The ''Ai Home'' concept showcased at the booth is powered by a central Xiaomi Home Hub 2, equipped with an Amlogic S905X4 quad-core processor and dedicated NPU for local AI processing. The exhibit features the integration of the Xiaomi 17 Ultra, with its Snapdragon 8 Elite Gen 5 chipset and 50-megapixel Sony IMX1089 camera system, as the primary controller for human-to-machine interactions. Visitors can observe the robot-head icon's eyes pulse with light to signify active Gemini-powered voice commands that manage a network of over 200 IoT devices, showcasing the transition from simple automation to proactive, intent-based home management.
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#13457343
16 Mar 2026
A Google product specialist demonstrates the integrated capabilities of Gemini AI to a trade show delegate on a large transparent MicroLED display at the Android pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The interactive screen showcases Gemini Advanced 2.0, running on the Google DeepMind multimodal architecture, as it processes a complex real-time request involving live video analysis from a connected smartphone and multiple third-party API integrations. The hardware setup includes a Google Pixel Fold 3, powered by the Tensor G5 chip, with its dual 48-megapixel rear camera array stream, demonstrating the phone's on-device Nano AI model synchronizing with the cloud-based Gemini Ultra 2.0 model for low-latency visual Q&A. The demonstration highlights Google's ''AI for Everyone'' initiative, focusing on proactive agents, secure data processing, and seamless cross-device synchronization with Android 16 and ChromeOS.
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#13457608
16 Mar 2026
A close-up of the OPPO Air Glass 3 assisted reality eyewear featuring real-time AI translation capabilities at the OPPO exhibit during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. These lightweight smart glasses, weighing 50 grams, utilize a proprietary Resin Diffractive Waveguide with a refractive index of 1.70 to project a vibrant full-color display onto the lenses. The device is powered by an integrated Qualcomm Snapdragon AR1 Gen 2 platform, enabling on-device processing for the AndesGPT large language model to perform instant speech-to-text translation in over 20 languages. The glasses are equipped with a discrete high-fidelity microphone array and four ultra-thin speakers providing spatial audio feedback. While the glasses focus on the heads-up display, they are paired with an OPPO Find X8 Ultra smartphone, powered by the MediaTek Dimensity 9400 chipset and featuring a 50-megapixel Sony LYT-900 main camera sensor, which acts as the primary processing hub for complex contextual AI tasks and vision-based translation via the integrated Gemini Nano engine.
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#13457330
16 Mar 2026
The NTT (Nippon Telegraph and Telephone Corporation) logo is prominently displayed on a transparent MicroLED screen at the entrance of the company's pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. NTT's exhibit for 2026, themed ''IOWN for AI and Sustainability,'' highlights the global commercial readiness of the All-Photonics Network (APN). Live demonstrations feature the deployment of IOWN APN connections using NTT's optical line terminals powered by the in-house designed APN single-chip LSI, utilizing silicon photonics to achieve deterministic, ultra-low latency data transmission below 0.1ms. The stand also showcases the deployment of NTT's specialized large language model, ''tsuzumi,'' optimized for energy efficiency using IOWN's disaggregated computing architecture. It runs on a cluster of Fujitsu PRIMERGY servers equipped with NVIDIA H100 Tensor Core GPUs, demonstrating a 40% reduction in power consumption for AI training and inference compared to traditional data centers.
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#13457395
16 Mar 2026
The Huawei logo is prominently displayed alongside the 2026 theme ''Advancing All Intelligence'' on a massive 8K 3D-LED installation at the entrance of Hall 1 during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The exhibit marks the commercial scale-up of 5.5G (5G-Advanced) and the debut of the Huawei Xinghe network solution, which utilizes the Ascend 910C AI cluster for autonomous network driving at Level 4. The display highlights the integration of the Pangu Model 5.0, Huawei's specialized large language model for the telecommunications industry, running on the Kunpeng 930 ARM-based CPU architecture to optimize energy efficiency in data centers. Visitors can observe demonstrations of the Huawei Mate 80 Pro, powered by the Kirin 9100 chipset, featuring its 50-megapixel XMAGE ultra-aperture main camera and satellite-based AI messaging, as it interacts with the brand's ''All-Intelligence'' ecosystem to manage real-time holographic communication and smart factory digital twins.
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#13457396
16 Mar 2026
The Huawei logo is prominently displayed at the entrance of the company's exhibition space in Hall 1 during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. Under the theme ''Advancing Industrial All Intelligence,'' Huawei showcases its transition from 5G to 5G-Advanced (5.5G) and its new Xinghe AI Fabric 2.0 network solutions. The exhibit features the global debut of the Huawei Mate 70 Pro, powered by the Kirin 9020 (5nm) deca-core processor, which integrates a 50-megapixel main camera with a physical variable aperture (f/1.4-f/4.0) and a 48-megapixel periscope telephoto lens. Also on display is the Huawei Mate X6 foldable, utilizing the same Kirin 9020 chipset and a 7.93-inch foldable OLED display, demonstrating advanced AI Agent capabilities for autonomous document processing and real-time translation. The branding highlights Huawei's full-stack AI infrastructure, including the Atlas 950 SuperPoD and OceanStor A800 storage systems designed to support large-scale AI model training and the evolution towards Level 4 Autonomous Networks (AN L4).
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#13457460
16 Mar 2026
A close-up of the Huawei MatePad Pro 12.2 (2026 Edition), internally designated under the MXH series, running the latest HarmonyOS version 4.3.0 at the Huawei exhibition pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The premium tablet features a Tandem OLED PaperMatte display with a 2.8K resolution (2800 x 1840 pixels), an adaptive refresh rate of 144Hz, and a peak brightness of 2,000 nits. The device is powered by the Kirin T92 octa-core chipset, supported by 12GB of RAM and integrated with the Maleoon 920 GPU, optimized for professional creativity and AI-driven multitasking. Its sophisticated camera system includes a 13-megapixel main rear sensor (f/1.8 aperture with autofocus) and an 8-megapixel ultra-wide lens, while the HarmonyOS 4.3.0 interface showcases the new SuperHub 2.0 for seamless cross-device file transfers and enhanced NearLink connectivity for the M-Pencil (3rd Gen). The demonstration highlights the tablet's ultra-slim 5.5mm profile and its 10,100mAh battery capacity with 100W HUAWEI SuperCharge support, emphasizing PC-grade productivity in a mobile form factor.
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#13457461
16 Mar 2026
A close-up of the Huawei MatePad Pro 12.2 (2026 Edition), internally designated under the MXH series, running the latest HarmonyOS version 4.3.0 at the Huawei exhibition pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The premium tablet features a Tandem OLED PaperMatte display with a 2.8K resolution (2800 x 1840 pixels), an adaptive refresh rate of 144Hz, and a peak brightness of 2,000 nits. The device is powered by the Kirin T92 octa-core chipset, supported by 12GB of RAM and integrated with the Maleoon 920 GPU, optimized for professional creativity and AI-driven multitasking. Its sophisticated camera system includes a 13-megapixel main rear sensor (f/1.8 aperture with autofocus) and an 8-megapixel ultra-wide lens, while the HarmonyOS 4.3.0 interface showcases the new SuperHub 2.0 for seamless cross-device file transfers and enhanced NearLink connectivity for the M-Pencil (3rd Gen). The demonstration highlights the tablet's ultra-slim 5.5mm profile and its 10,100mAh battery capacity with 100W HUAWEI SuperCharge support, emphasizing PC-grade productivity in a mobile form factor.
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#13457462
16 Mar 2026
A close-up of the Huawei MatePad Pro 12.2 (2026 Edition), internally designated under the MXH series, running the latest HarmonyOS version 4.3.0 at the Huawei exhibition pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The premium tablet features a Tandem OLED PaperMatte display with a 2.8K resolution (2800 x 1840 pixels), an adaptive refresh rate of 144Hz, and a peak brightness of 2,000 nits. The device is powered by the Kirin T92 octa-core chipset, supported by 12GB of RAM and integrated with the Maleoon 920 GPU, optimized for professional creativity and AI-driven multitasking. Its sophisticated camera system includes a 13-megapixel main rear sensor (f/1.8 aperture with autofocus) and an 8-megapixel ultra-wide lens, while the HarmonyOS 4.3.0 interface showcases the new SuperHub 2.0 for seamless cross-device file transfers and enhanced NearLink connectivity for the M-Pencil (3rd Gen). The demonstration highlights the tablet's ultra-slim 5.5mm profile and its 10,100mAh battery capacity with 100W HUAWEI SuperCharge support, emphasizing PC-grade productivity in a mobile form factor.
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#13457464
16 Mar 2026
The Huawei logo is prominently displayed alongside the 2026 theme ''Advancing All Intelligence'' on a massive 8K 3D-LED installation at the entrance of Hall 1 during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The exhibit marks the commercial scale-up of 5.5G (5G-Advanced) and the debut of the Huawei Xinghe network solution, which utilizes the Ascend 910C AI cluster for autonomous network driving at Level 4. The display highlights the integration of the Pangu Model 5.0, Huawei's specialized large language model for the telecommunications industry, running on the Kunpeng 930 ARM-based CPU architecture to optimize energy efficiency in data centers. Visitors can observe demonstrations of the Huawei Mate 80 Pro, powered by the Kirin 9100 chipset, featuring its 50-megapixel XMAGE ultra-aperture main camera and satellite-based AI messaging, as it interacts with the brand's ''All-Intelligence'' ecosystem to manage real-time holographic communication and smart factory digital twins.
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#13457487
16 Mar 2026
International delegates and congressmen participate in a high-level briefing at the Ericsson pavilion in Hall 2 during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The visitors engage with a live demonstration of the Ericsson Radio 4485, a high-capacity massive MIMO unit powered by the latest Ericsson Silicon (ASIC) custom processor architecture, designed for 5G-Advanced and early 6G research. The presentation features the integration of AI-driven intent-based networking, utilizing Intel Xeon Scalable 5th Gen (Emerald Rapids) processors within the cloud-native infrastructure to enhance energy efficiency by up to 30%. A delegate uses a Sony Xperia 1 VII, equipped with a Snapdragon 8 Elite Gen 5 chipset and a 52-megapixel Exmor T for Mobile main sensor, to test real-time network slicing and 8K video uplink capabilities directly from the booth floor. The scene highlights Ericsson's involvement in the GSMA Open Gateway initiative, demonstrating the impact of programmable networks on industrial automation and global connectivity.
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#13457488
16 Mar 2026
A group of Asian delegates and congressmen walk past a display featuring the Android ''The Bot'' mascot at the Google and Android pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The display includes several multi-colored Android figurines, with the central mascot wearing the new Samsung XR headset, developed under Project Moohan, to demonstrate the integration of Android XR software. The headset is powered by the Qualcomm Snapdragon XR2+ Gen 3 chipset and features dual 4K Micro-OLED displays. Next to the mascots, a demo unit of the Samsung Galaxy S26 Ultra, featuring the Snapdragon 8 Elite Gen 5 processor and a 200-megapixel HP2 main camera sensor, is visible, showing connectivity between the smartphone and the XR wearables via the Gemini Nano AI assistant. The scene captures the atmosphere of the congress as international tech leaders explore Google's ''AI-first'' vision for the Android ecosystem.
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#13457489
16 Mar 2026
A visitor uses a Google Pixel 10 Pro smartphone while posing next to the Android ''The Bot'' mascot at the Google and Android pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The smartphone features a Google Tensor G5 processor and a triple camera array with a 50-megapixel main sensor. The Android figurine is wearing a Samsung XR headset, developed under Project Moohan, equipped with a Qualcomm Snapdragon XR2+ Gen 3 chipset and dual Micro-OLED displays. The demonstration showcases the integration of Android XR software and Google's Gemini Nano AI model across the smartphone and wearable spatial computing ecosystem.
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#13457738
16 Mar 2026
A detailed view of the NVIDIA GB300 NVL72 liquid-cooled rack-scale system is displayed at the NVIDIA pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This computing unit integrates 72 NVIDIA GB300 Tensor Core GPUs and 36 NVIDIA Grace CPUs, interconnected via the fifth-generation NVLink interconnect to function as a single GPU. The system is powered by NVIDIA BlueField-3 DPUs and the ConnectX-8 SuperNIC, capable of delivering up to 800Gb/s of networking throughput. The rack features a direct-to-chip liquid cooling system designed to manage the thermal output of the 120kW power density. This configuration is optimized for training Large Language Models and real-time inference on trillion-parameter models, utilizing the Transformer Engine and support for the FP4 precision format. The display highlights the NVIDIA Quantum-3 InfiniBand switches at the top of the rack, facilitating ultra-low latency communication between multi-rack clusters.
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#13439967
13 Mar 2026
The Xiaomi Mijia Fresh Air Conditioner Pro Dual-Outlet Vertical 3HP showcases at the Xiaomi ''Human x Car x Home'' pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This premium floor-standing unit features a revolutionary dual-outlet design with a 160-degree ultra-wide angle air supply and a massive fresh air volume of 245 m3/h, capable of purifying a 40-square-meter room in just 24 minutes. The system is powered by the Lingyun Intelligent Control Engine and integrated with Xiaomi HyperOS Connect, utilizing a dedicated AI energy-saving chip to reduce power consumption by up to 40% compared to traditional 3HP models. The hardware includes a HEPA 4-layer filtration system with a 99% antibacterial rate and a high-performance full DC inverter compressor that supports extreme temperature operations from -32?C to 60?C. The display highlights its ''Star Satin Silver'' metallic finish and integrated centrifugal turbo fan technology, which maintains indoor CO2 levels at optimal levels.
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#13439924
13 Mar 2026
A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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