"AI chips"

#13439924

13 March 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439925

13 March 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439932

13 March 2026

The Meta corporate logo is featured at the Fira Gran Via booth, highlighting the company's ''AI-First'' hardware ecosystem during the Mobile World Congress. The exhibit showcases the Ray-Ban Meta Display (Gen 3) smart glasses, which feature a 12-megapixel ultra-wide camera for multimodal AI environment analysis and a micro-LED heads-up display etched into the right lens. The hardware is powered by the Qualcomm Snapdragon AR1 Gen 2 platform, enabling real-time language translation and ''Look and Ask'' visual search via the Llama 4 model. The display also features the Meta Quest 4 (codenamed ''Pismo High''), which utilizes the Snapdragon XR2 Gen 3 chipset and dual 24-megapixel 4K passthrough cameras for high-fidelity mixed reality experiences. The booth demonstrates the Neural Band (EMG) wearable for gesture-based control and the prototype Orion AR glasses with a 70-degree field of view and silicon carbide lenses during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439923

13 March 2026

The MediaTek corporate logo is displayed at the Fira Gran Via booth with the slogan ''Complete End-to-End Solutions,'' highlighting the company's ''AI For Life'' ecosystem during the Mobile World Congress. The exhibit features the flagship Dimensity 9500 processor, built on a 3nm process with an All-Big-Core architecture (Cortex-X925 ultra core at 3.73 GHz) and the NPU 890 for advanced generative AI. The branding emphasizes MediaTek's leadership in connectivity, showcasing the Dimensity Auto MT2739 telematics platform with 3GPP Release 17/18 NR-NTN satellite support and the first wave of Wi-Fi 8 solutions using the Filogic 8000 series chipsets. The display highlights the convergence of edge-to-cloud intelligence, including Sovereign AI for automotive cockpits and RedCap (Reduced Capability) technology for mass-market 5G IoT devices during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439914

13 March 2026

An On-Delivery autonomous delivery robot navigates the Nokia booth at the Fira Gran Via, demonstrating integrated 5G-Advanced logistics solutions during the Mobile World Congress. The robot is equipped with a 360-degree LiDAR system and a specialized 12-megapixel HDR wide-angle camera for obstacle recognition and semantic segmentation. Powered by the NVIDIA Jetson Orin Nano AI edge module and connected via a Nokia Industrial 5G router with the ReefShark chipset, the vehicle showcases real-time path planning and autonomous navigation through crowded environments. The demonstration highlights the Nokia Digital Automation Cloud (DAC) platform, which manages the robot's fleet telemetry and mission-critical low-latency communication with a response time of less than 5ms during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13413363

7 March 2026

The Ulefone corporate logo, showcased at Booth 7E46 under the theme ''AI Empower Your Armor'', represents the rugged technology leader unveiling its Armor 29 Ultra flagship featuring a 1-inch Sony IMX989 sensor and the MediaTek Dimensity 9300+ chipset, alongside the revolutionary RugOne Xsnap 7 Pro with its detachable magnetic action camera. This is pictured at the Fira Gran Via exhibition center during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413397

7 March 2026

The TECNO corporate logo, displayed under the theme ''Pioneering the Connection of Intelligence'' at Booth 7A40, represents the global technology brand unveiling its AI-powered ecosystem, including the Camon 50 Ultra with the MediaTek Dimensity 7400 Ultimate chipset and the revolutionary Modular Magnetic concept phone with mmWave interconnection. It is pictured at the Fira Gran Via exhibition center during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413631

7 March 2026

All colors of the Nubia Neo 5 Max, a gaming-focused phablet featuring a massive 7.5-inch 1.5K LCD display, are showcased at the Fira Gran Via exhibition, powered by the MediaTek Dimensity 7080 chipset with 8GB of RAM and 256GB of internal storage, highlighting its extraordinary 7,100mAh battery and a 50-megapixel main AI camera system with a secondary depth sensor, alongside capacitive shoulder triggers and a dual-layer Vapor Chamber cooling system designed for extended mobile gaming sessions during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413636

7 March 2026

The Nubia Neo 5 Max, a gaming-focused phablet, features a 7.5-inch 1.5K LCD display and is powered by the MediaTek Dimensity 7080 chipset with 8GB of RAM and 256GB of internal storage. It highlights a 7,100mAh battery and a 50-megapixel main AI camera system with a secondary depth sensor. The device includes capacitive shoulder triggers and a dual-layer Vapor Chamber cooling system designed for extended mobile gaming sessions. This is showcased at the Fira Gran Via exhibition during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413568

7 March 2026

The RedMagic Astra gaming tablet is showcased at the Fira Gran Via exhibition in Barcelona, Spain, on March 5, 2026. It features a compact 9.06-inch 2.4K OLED display with a 165Hz refresh rate and 1,600 nits peak brightness. The tablet is powered by the Qualcomm Snapdragon 8 Elite (3nm) chipset and the dedicated RedCore R3 Pro gaming co-processor. It highlights a 13-layer ICE-X cooling system with an internal 20,000 RPM turbofan and a 13-megapixel rear camera with AI enhancements. The brand demonstrates high-frame-rate mobile gaming performance during the Mobile World Congress (MWC).

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#13413569

7 March 2026

The RedMagic Astra gaming tablet is showcased at the Fira Gran Via exhibition in Barcelona, Spain, on March 5, 2026. It features a compact 9.06-inch 2.4K OLED display with a 165Hz refresh rate and 1,600 nits peak brightness. The tablet is powered by the Qualcomm Snapdragon 8 Elite (3nm) chipset and the dedicated RedCore R3 Pro gaming co-processor. It highlights a 13-layer ICE-X cooling system with an internal 20,000 RPM turbofan and a 13-megapixel rear camera with AI enhancements. The brand demonstrates high-frame-rate mobile gaming performance during the Mobile World Congress (MWC).

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#13413639

7 March 2026

The Nubia Neo 5 Max, a gaming-focused phablet, features a massive 7.5-inch 1.5K LCD display. It is showcased at the Fira Gran Via exhibition in Barcelona, Spain, on March 5, 2026. The device is powered by the MediaTek Dimensity 7080 chipset with 8GB of RAM and 256GB of internal storage. It highlights an extraordinary 7,100mAh battery and a 50-megapixel main AI camera system with a secondary depth sensor. The phablet also includes capacitive shoulder triggers and a dual-layer Vapor Chamber cooling system designed for extended mobile gaming sessions during the Mobile World Congress (MWC).

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#13413393

7 March 2026

The Ulefone Armor 26 Ultra, a high-performance rugged smartphone featuring a 200-megapixel Samsung ISOCELL HP3 main sensor and the MediaTek Dimensity 8020 5G chipset, is pictured among sharp rocks to showcase its MIL-STD-810H military-grade durability and IP68/IP69K water resistance. It highlights its massive 15,600mAh battery and integrated 121dB thunder speaker during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413978

7 March 2026

The Huawei Mate X7 foldable smartphone is presented at the Fira Gran Via, featuring an 8-inch LTPO OLED internal display with 2,500 nits and a 6.49-inch quad-curved cover screen protected by second-generation Kunlun Glass. The device is powered by the HiSilicon Kirin 9030 Pro chipset (6nm) with 16GB of RAM and runs on HarmonyOS 6.0. It highlights its advanced XMAGE triple camera system with a 50-megapixel RYYB main sensor featuring a 10-stop variable aperture (f/1.4-f/4.0), a 50-megapixel periscope telephoto lens with 3.5x optical zoom and macro capabilities, and a 40-megapixel ultra-wide lens. The flagship includes a 5,600mAh silicon-carbon battery and supports dual-mode satellite connectivity for calling and messaging during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413979

7 March 2026

The Huawei Mate X7 foldable smartphone is presented at the Fira Gran Via, featuring an 8-inch LTPO OLED internal display with 2,500 nits and a 6.49-inch quad-curved cover screen protected by second-generation Kunlun Glass. The device is powered by the HiSilicon Kirin 9030 Pro chipset (6nm) with 16GB of RAM and runs on HarmonyOS 6.0. It highlights its advanced XMAGE triple camera system with a 50-megapixel RYYB main sensor featuring a 10-stop variable aperture (f/1.4-f/4.0), a 50-megapixel periscope telephoto lens with 3.5x optical zoom and macro capabilities, and a 40-megapixel ultra-wide lens. The flagship includes a 5,600mAh silicon-carbon battery and supports dual-mode satellite connectivity for calling and messaging during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413980

7 March 2026

The Huawei Mate X7 foldable smartphone is presented at the Fira Gran Via, featuring an 8-inch LTPO OLED internal display with 2,500 nits and a 6.49-inch quad-curved cover screen protected by second-generation Kunlun Glass. The device is powered by the HiSilicon Kirin 9030 Pro chipset (6nm) with 16GB of RAM and runs on HarmonyOS 6.0. It highlights its advanced XMAGE triple camera system with a 50-megapixel RYYB main sensor featuring a 10-stop variable aperture (f/1.4-f/4.0), a 50-megapixel periscope telephoto lens with 3.5x optical zoom and macro capabilities, and a 40-megapixel ultra-wide lens. The flagship includes a 5,600mAh silicon-carbon battery and supports dual-mode satellite connectivity for calling and messaging during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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