"AI features"

#13439889

13 March 2026

An attendee holds the Samsung Galaxy S26 Ultra flagship smartphone at the Fira Gran Via. The device showcases a 6.9-inch Dynamic AMOLED 2X ''Privacy Display'' with a 3120 x 1440 resolution and a 120Hz refresh rate. Powered by the Qualcomm Snapdragon 8 Elite Gen 5 for Galaxy processor with 16GB of LPDDR5X RAM, the smartphone features a professional quad-camera array led by a 200-megapixel main sensor (f/1.4 aperture) and a 50-megapixel periscope telephoto lens with 5x optical zoom and f/2.9 aperture. Running on Android 16 with One UI 8.5, the device integrates advanced Galaxy AI features and a 5,000mAh battery supporting 60W Super Fast Charging 3.0 during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439890

13 March 2026

An attendee holds the Samsung Galaxy S26 Ultra flagship smartphone at the Fira Gran Via. The device showcases a 6.9-inch Dynamic AMOLED 2X ''Privacy Display'' with a 3120 x 1440 resolution and a 120Hz refresh rate. Powered by the Qualcomm Snapdragon 8 Elite Gen 5 for Galaxy processor with 16GB of LPDDR5X RAM, the smartphone features a professional quad-camera array led by a 200-megapixel main sensor (f/1.4 aperture) and a 50-megapixel periscope telephoto lens with 5x optical zoom and f/2.9 aperture. Running on Android 16 with One UI 8.5, the device integrates advanced Galaxy AI features and a 5,000mAh battery supporting 60W Super Fast Charging 3.0 during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439910

13 March 2026

The Intel corporate logo is showcased at the Fira Gran Via booth, highlighting the company's role in the ''AI Everywhere'' era during the Mobile World Congress. The exhibit features the latest Intel Core Ultra 300 (Series 3) processors with integrated NPU 5.0, delivering over 50 TOPS for local generative AI processing. The display highlights the Intel Xeon 6 processors with P-cores and E-cores for optimized telecom workloads and the Intel vPro platform's new security features for AI-ready enterprise fleets. Visitors observe demonstrations of the OpenVINO 2026.0 toolkit for cross-architectural AI deployment and the Intel Gaudi 4 AI accelerator, designed to compete in the large-scale LLM training and inference market for sovereign cloud providers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439911

13 March 2026

The Intel corporate logo is showcased at the Fira Gran Via booth, highlighting the company's role in the ''AI Everywhere'' era during the Mobile World Congress. The exhibit features the latest Intel Core Ultra 300 (Series 3) processors with integrated NPU 5.0, delivering over 50 TOPS for local generative AI processing. The display highlights the Intel Xeon 6 processors with P-cores and E-cores for optimized telecom workloads and the Intel vPro platform's new security features for AI-ready enterprise fleets. Visitors observe demonstrations of the OpenVINO 2026.0 toolkit for cross-architectural AI deployment and the Intel Gaudi 4 AI accelerator, designed to compete in the large-scale LLM training and inference market for sovereign cloud providers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439927

13 March 2026

The MediaTek corporate logo features at the Fira Gran Via booth, representing the company's ''AI For Life: From Edge to Cloud'' strategy during the Mobile World Congress. The exhibit showcases the flagship Dimensity 9500 processor, built on TSMC's 3nm (N3P) process and featuring an All Big Core architecture with a Cortex-X925 ultra-core clocked at 3.73 GHz. The display highlights the new NPU 9.0 (Neural Processing Unit) delivering 100 TOPS of computing power for on-device generative video and agentic AI. The branding encompasses the Dimensity Auto MT2739 platform for satellite-connected vehicles and the first commercial Wi-Fi 8 solutions using the Filogic 8000 series, emphasizing MediaTek's leadership in high-speed, low-latency connectivity for smartphones, IoT, and next-generation data centers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439896

13 March 2026

The AI Data Center (AIDC) logo is showcased at the SK Telecom pavilion in Hall 3 of the Fira Gran Via, representing the backbone of the company's ''AI Pyramid Strategy'' during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The exhibit features the latest SAPEON X330 AI semiconductors and NVIDIA H200 Tensor Core GPUs integrated into a high-density server architecture. The display highlights SKT's proprietary Immersion Cooling technology and the AI Cloud Management Platform (CMP) designed to optimize large language model (LLM) workloads like the A.X K1. The infrastructure serves as the foundation for GPU-as-a-Service (GaaS) and sovereign AI solutions, enabling low-latency processing for 5G-Advanced and future 6G network applications.

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#13439921

13 March 2026

The Cisco corporate logo features prominently at the Fira Gran Via, highlighting the company's focus on AI-native networking and cybersecurity during the Mobile World Congress. The exhibit showcases the Cisco Silicon One G200 and G202 processors, which power the next generation of high-density switches for AI back-end networks with up to 51.2 Tbps of switching capacity. The display highlights the integration of Cisco Hypershield and Splunk analytics for AI-driven threat detection and automated network management. Visitors explore the Cisco ThousandEyes platform for end-to-end visibility in 5G-Advanced and Wi-Fi 7 environments, while the pavilion emphasizes sustainable data center solutions using Liquid Cooling and Cisco UCS servers equipped with the latest Intel Xeon 6 processors during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439888

13 March 2026

A close-up of the Samsung Agentic AI branding at the MWC 2026 booth symbolizes a shift from reactive tools to autonomous AI agents that anticipate user intent without explicit commands. The logo is showcased alongside the Galaxy S26 Ultra, which features a 200-megapixel main sensor with wider apertures and the HiSilicon-integrated NPU (or Samsung's proprietary NPU) capable of processing multimodal AI tasks locally. The ''Agentic'' vision is supported by the Snapdragon 8 Elite platform's Hexagon processor, enabling complex decision-making for personalized health insights and proactive device management across the HarmonyOS-integrated (or Android 16-based) Galaxy ecosystem during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439923

13 March 2026

The MediaTek corporate logo is displayed at the Fira Gran Via booth with the slogan ''Complete End-to-End Solutions,'' highlighting the company's ''AI For Life'' ecosystem during the Mobile World Congress. The exhibit features the flagship Dimensity 9500 processor, built on a 3nm process with an All-Big-Core architecture (Cortex-X925 ultra core at 3.73 GHz) and the NPU 890 for advanced generative AI. The branding emphasizes MediaTek's leadership in connectivity, showcasing the Dimensity Auto MT2739 telematics platform with 3GPP Release 17/18 NR-NTN satellite support and the first wave of Wi-Fi 8 solutions using the Filogic 8000 series chipsets. The display highlights the convergence of edge-to-cloud intelligence, including Sovereign AI for automotive cockpits and RedCap (Reduced Capability) technology for mass-market 5G IoT devices during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439924

13 March 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439925

13 March 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439932

13 March 2026

The Meta corporate logo is featured at the Fira Gran Via booth, highlighting the company's ''AI-First'' hardware ecosystem during the Mobile World Congress. The exhibit showcases the Ray-Ban Meta Display (Gen 3) smart glasses, which feature a 12-megapixel ultra-wide camera for multimodal AI environment analysis and a micro-LED heads-up display etched into the right lens. The hardware is powered by the Qualcomm Snapdragon AR1 Gen 2 platform, enabling real-time language translation and ''Look and Ask'' visual search via the Llama 4 model. The display also features the Meta Quest 4 (codenamed ''Pismo High''), which utilizes the Snapdragon XR2 Gen 3 chipset and dual 24-megapixel 4K passthrough cameras for high-fidelity mixed reality experiences. The booth demonstrates the Neural Band (EMG) wearable for gesture-based control and the prototype Orion AR glasses with a 70-degree field of view and silicon carbide lenses during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439936

13 March 2026

The official 6G logo is displayed at the Qualcomm booth in Hall 3 of the Fira Gran Via, marking the company's leadership in AI-native wireless research during the Mobile World Congress. The exhibit features an end-to-end 6G prototype system utilizing Giga-MIMO technology with 2,048 antenna elements to maximize spectral efficiency in the 7 GHz and 13 GHz bands. Powered by the Qualcomm X105 5G-Advanced Modem-RF system as a foundational bridge, the demonstration highlights sub-band full duplex and probabilistic shaping techniques to achieve peak data rates exceeding 14.8 Gbps. The display showcases how 6G integrates sensing and communication to enable Digital Twins and autonomous vehicle orchestration, supported by Intel Xeon 6 edge servers and Qualcomm's specialized NPU-driven air interface that adapts to real-world RF environments in real-time during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439937

13 March 2026

The official 6G logo is displayed at the Qualcomm booth in Hall 3 of the Fira Gran Via, marking the company's leadership in AI-native wireless research during the Mobile World Congress. The exhibit features an end-to-end 6G prototype system utilizing Giga-MIMO technology with 2,048 antenna elements to maximize spectral efficiency in the 7 GHz and 13 GHz bands. Powered by the Qualcomm X105 5G-Advanced Modem-RF system as a foundational bridge, the demonstration highlights sub-band full duplex and probabilistic shaping techniques to achieve peak data rates exceeding 14.8 Gbps. The display showcases how 6G integrates sensing and communication to enable Digital Twins and autonomous vehicle orchestration, supported by Intel Xeon 6 edge servers and Qualcomm's specialized NPU-driven air interface that adapts to real-world RF environments in real-time during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439897

13 March 2026

The Microsoft Copilot logo is displayed at the Fira Gran Via during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The platform evolves into a proactive Agentic AI ecosystem, and the branding highlights the integration of Work IQ and Agent Mode across Microsoft 365 apps, powered by foundational models like GPT-5 and Azure OpenAI Foundry. The exhibit showcases the synergy between the software and the latest Copilot+ PC hardware, including devices equipped with the Snapdragon X Plus (8-core) processor and the AMD Ryzen AI 400 series, both featuring dedicated Neural Processing Units (NPUs) capable of 45 to 50 TOPS for on-device AI tasks. The display also features the Surface Pro 12-inch, which integrates a 10-megapixel Ultra HD rear camera and a Full HD front-facing Studio Camera with AI-enhanced Windows Studio Effects, all operating under the unified Copilot intelligence layer.

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#13439909

13 March 2026

The current Intel corporate logo uses its modern, minimalist ''intel'' typeface, rendered in the distinctive ''Intel Blue.'' This visual identity, introduced as part of the ''One Intel'' brand refresh, features a clean, sans-serif font without the traditional surrounding circle or ''swoosh.'' The simplified design emphasizes connectivity, innovation, and a forward-looking technological vision. As a staple at events like MWC 2026, this branding represents Intel's expansion from a ''CPU company'' into an integrated data, AI, and connectivity leader, symbolizing its central role in the digital infrastructure during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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