"Digital Core"

#13439898

13 March 2026

The Accenture corporate logo is featured at the reception desk of its major pavilion in Hall 4 of the Fira Gran Via, serving as the GSMA's Exclusive Connected Industries Knowledge Partner during the Mobile World Congress. The stand showcases the company's focus on ''Agentic AI'' and Sovereign AI solutions, following its 2026 acquisition of advanced network AI technology to accelerate autonomous operations for telecommunications. The exhibition space facilitates demonstrations of Generative AI-driven B2B growth and predictive network management tools, powered by collaborative frameworks with Mistral AI and Anthropic. As a leader in the ''IQ Era,'' Accenture's presence emphasizes the convergence of 5G-Advanced connectivity with autonomous agentic commerce and AI-ready manufacturing ecosystems during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439899

13 March 2026

The Accenture corporate logo is featured at the reception desk of its major pavilion in Hall 4 of the Fira Gran Via, serving as the GSMA's Exclusive Connected Industries Knowledge Partner during the Mobile World Congress. The stand showcases the company's focus on ''Agentic AI'' and Sovereign AI solutions, following its 2026 acquisition of advanced network AI technology to accelerate autonomous operations for telecommunications. The exhibition space facilitates demonstrations of Generative AI-driven B2B growth and predictive network management tools, powered by collaborative frameworks with Mistral AI and Anthropic. As a leader in the ''IQ Era,'' Accenture's presence emphasizes the convergence of 5G-Advanced connectivity with autonomous agentic commerce and AI-ready manufacturing ecosystems during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439924

13 March 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439925

13 March 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439910

13 March 2026

The Intel corporate logo is showcased at the Fira Gran Via booth, highlighting the company's role in the ''AI Everywhere'' era during the Mobile World Congress. The exhibit features the latest Intel Core Ultra 300 (Series 3) processors with integrated NPU 5.0, delivering over 50 TOPS for local generative AI processing. The display highlights the Intel Xeon 6 processors with P-cores and E-cores for optimized telecom workloads and the Intel vPro platform's new security features for AI-ready enterprise fleets. Visitors observe demonstrations of the OpenVINO 2026.0 toolkit for cross-architectural AI deployment and the Intel Gaudi 4 AI accelerator, designed to compete in the large-scale LLM training and inference market for sovereign cloud providers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439911

13 March 2026

The Intel corporate logo is showcased at the Fira Gran Via booth, highlighting the company's role in the ''AI Everywhere'' era during the Mobile World Congress. The exhibit features the latest Intel Core Ultra 300 (Series 3) processors with integrated NPU 5.0, delivering over 50 TOPS for local generative AI processing. The display highlights the Intel Xeon 6 processors with P-cores and E-cores for optimized telecom workloads and the Intel vPro platform's new security features for AI-ready enterprise fleets. Visitors observe demonstrations of the OpenVINO 2026.0 toolkit for cross-architectural AI deployment and the Intel Gaudi 4 AI accelerator, designed to compete in the large-scale LLM training and inference market for sovereign cloud providers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439923

13 March 2026

The MediaTek corporate logo is displayed at the Fira Gran Via booth with the slogan ''Complete End-to-End Solutions,'' highlighting the company's ''AI For Life'' ecosystem during the Mobile World Congress. The exhibit features the flagship Dimensity 9500 processor, built on a 3nm process with an All-Big-Core architecture (Cortex-X925 ultra core at 3.73 GHz) and the NPU 890 for advanced generative AI. The branding emphasizes MediaTek's leadership in connectivity, showcasing the Dimensity Auto MT2739 telematics platform with 3GPP Release 17/18 NR-NTN satellite support and the first wave of Wi-Fi 8 solutions using the Filogic 8000 series chipsets. The display highlights the convergence of edge-to-cloud intelligence, including Sovereign AI for automotive cockpits and RedCap (Reduced Capability) technology for mass-market 5G IoT devices during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439896

13 March 2026

The AI Data Center (AIDC) logo is showcased at the SK Telecom pavilion in Hall 3 of the Fira Gran Via, representing the backbone of the company's ''AI Pyramid Strategy'' during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The exhibit features the latest SAPEON X330 AI semiconductors and NVIDIA H200 Tensor Core GPUs integrated into a high-density server architecture. The display highlights SKT's proprietary Immersion Cooling technology and the AI Cloud Management Platform (CMP) designed to optimize large language model (LLM) workloads like the A.X K1. The infrastructure serves as the foundation for GPU-as-a-Service (GaaS) and sovereign AI solutions, enabling low-latency processing for 5G-Advanced and future 6G network applications.

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#13439897

13 March 2026

The Microsoft Copilot logo is displayed at the Fira Gran Via during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The platform evolves into a proactive Agentic AI ecosystem, and the branding highlights the integration of Work IQ and Agent Mode across Microsoft 365 apps, powered by foundational models like GPT-5 and Azure OpenAI Foundry. The exhibit showcases the synergy between the software and the latest Copilot+ PC hardware, including devices equipped with the Snapdragon X Plus (8-core) processor and the AMD Ryzen AI 400 series, both featuring dedicated Neural Processing Units (NPUs) capable of 45 to 50 TOPS for on-device AI tasks. The display also features the Surface Pro 12-inch, which integrates a 10-megapixel Ultra HD rear camera and a Full HD front-facing Studio Camera with AI-enhanced Windows Studio Effects, all operating under the unified Copilot intelligence layer.

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#13439926

13 March 2026

The UniFi brand logo is showcased at the Ubiquiti booth in Hall 2 of the Fira Gran Via, highlighting the company's ''IT Simplified'' philosophy during the Mobile World Congress. The exhibit features the latest Cloud Gateway Max and Enterprise Fortress Gateway (EFG), powered by an 8-core ARM Cortex-A57 processor at 2.5 GHz, designed to handle 25Gbps routing with full inspection. The display showcases the U7 Pro Max access points, which utilize the 6 GHz band with Wi-Fi 7 technology and Multi-Link Operation (MLO) for ultra-low latency. The branding emphasizes the integration of UniFi Protect AI-driven surveillance, featuring the G5 Pro cameras with 12-megapixel 4K sensors and advanced human/vehicle recognition running locally on the UniFi OS ecosystem without cloud dependence during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439927

13 March 2026

The MediaTek corporate logo features at the Fira Gran Via booth, representing the company's ''AI For Life: From Edge to Cloud'' strategy during the Mobile World Congress. The exhibit showcases the flagship Dimensity 9500 processor, built on TSMC's 3nm (N3P) process and featuring an All Big Core architecture with a Cortex-X925 ultra-core clocked at 3.73 GHz. The display highlights the new NPU 9.0 (Neural Processing Unit) delivering 100 TOPS of computing power for on-device generative video and agentic AI. The branding encompasses the Dimensity Auto MT2739 platform for satellite-connected vehicles and the first commercial Wi-Fi 8 solutions using the Filogic 8000 series, emphasizing MediaTek's leadership in high-speed, low-latency connectivity for smartphones, IoT, and next-generation data centers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439928

13 March 2026

The Cisco corporate logo is seen at the Fira Gran Via, highlighting the company's focus on AI-ready infrastructure and integrated cybersecurity solutions during the Mobile World Congress. The exhibit showcases the Cisco Silicon One G200 and G202 processors, which power high-density Ethernet switches with up to 51.2 Tbps of switching capacity to minimize latency in AI training clusters. The display features the integration of Cisco Hypershield and the Splunk observability platform, utilizing the NVIDIA BlueField-3 DPU for hardware-accelerated security and real-time threat detection. Visitors explore the Cisco UCS (Unified Computing System) servers equipped with Intel Xeon 6 processors, demonstrating liquid-cooling technologies and energy-efficient operations for the next generation of 5G-Advanced core networks during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439930

13 March 2026

The Starlink corporate logo, part of the SpaceX ecosystem, is seen against a clear blue sky at the Fira Gran Via in Barcelona, Spain, on March 5, 2026. It represents the global expansion of the Starlink Gen2 satellite constellation during the Mobile World Congress. The exhibit showcases the new Starlink Standard Kit (V4) and the Flat High Performance terminal, powered by a custom quad-core ARM-based Starlink SoC designed for low-power beamforming and phased-array antenna management. The branding highlights the commercial launch of Direct-to-Cell services, utilizing the LTE/5G-Advanced spectrum to provide emergency messaging and data connectivity directly to unmodified smartphones through eNodeB satellite payloads. Visitors explore the integration of the Starlink Mobility platform with Wi-Fi 7 routers, offering download speeds exceeding 300 Mbps and latencies below 25ms for remote industrial and maritime applications.

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#13439931

13 March 2026

The SpaceX corporate logo is displayed at the Fira Gran Via outdoor exhibit, marking the launch of Starlink Mobile (Direct-to-Cell) services during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The display features the Starlink V2 satellite payloads, which utilize a massive phased array antenna and MIMO technology to deliver 5G speeds of up to 150 Mbps directly to unmodified smartphones. The hardware showcase includes the Starlink Standard V4 terminal, powered by a custom SpaceX-designed quad-core ARM SoC for electronic beamforming, alongside the Gen 3 Tri-band Wi-Fi 6 router supporting up to 235 devices. The exhibit highlights the integration of 3GPP Release-19 NR-NTN standards for seamless handovers between terrestrial and satellite networks, providing critical voice and data connectivity through eNodeB payloads in orbit for emergency services and remote industrial operations.

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#13424870

9 March 2026

The CoreWeave logo appears on a smartphone screen in this photo illustration in Ontario, Canada, on March 9, 2026.

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#13424871

9 March 2026

The CoreWeave logo appears on a smartphone screen in this photo illustration in Ontario, Canada, on March 9, 2026.

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