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"Haridwar"
3,357 professional editorial images found
#13405028
5 March 2026
In this photo illustration, a close-up of a printed circuit board (PCB) is seen, while the AMD logo is displayed on a screen in the background. AMD develops CPUs and GPUs for many computing markets in Athens, Greece, on March 5, 2026.
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#13405029
5 March 2026
In this photo illustration, a close-up of a printed circuit board (PCB) is seen, while the Intel logo is displayed on a screen in the background. Intel designs and manufactures CPUs and other chips in Athens, Greece, on March 5, 2026.
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#13405030
5 March 2026
In this photo illustration, a close-up of a printed circuit board (PCB) is seen, while the NVIDIA logo is displayed on a screen in the background. NVIDIA produces GPUs used for AI and accelerated computing in Athens, Greece, on March 5, 2026.
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#13405031
5 March 2026
In this photo illustration in Athens, Greece, on March 5, 2026, a close-up of a printed circuit board (PCB) is seen, while the Qualcomm logo is displayed on a screen in the background. Qualcomm is one of the biggest semiconductor companies making chipsets.
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#13405032
5 March 2026
In Athens, Greece, on March 5, 2026, a close-up of a printed circuit board (PCB) is seen in this photo illustration, while the Samsung logo is displayed on a screen in the background. Samsung makes semiconductors, including memory chips like DRAM.
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#13405034
5 March 2026
In this photo illustration, a close-up of a printed circuit board (PCB) is seen, while the Applied Materials logo is displayed on a screen in the background. Applied Materials supplies equipment used in semiconductor manufacturing in Athens, Greece, on March 5, 2026.
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#13405036
5 March 2026
In Athens, Greece, on March 5, 2026, a close-up of a printed circuit board (PCB) is seen, while the KLA logo is displayed on a screen in the background. KLA supplies process control tools for chip manufacturing.
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#13405038
5 March 2026
In this photo illustration, a close-up of a printed circuit board (PCB) is seen, while the Broadcom logo is displayed on a screen in the background. Broadcom develops chips for Wi-Fi and wireless connectivity.
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#13405039
5 March 2026
A close-up of a printed circuit board (PCB).
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#13405033
5 March 2026
In this photo illustration in Athens, Greece, on March 5, 2026, a close-up of a printed circuit board (PCB) is seen, while the TSMC logo is displayed on a screen in the background. TSMC manufactures semiconductor chips for many global companies.
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#13404017
5 March 2026
Eurosam SAM missile system by MBDA and Thales Group at Paris Air Show 2025. The Eurosam Future Surface-to-Air Family of missiles or FSAF autonomous guided air shield interceptor system with vertical ground launched system MLT with use of Aster 15 or Aster 30 rockets, multi-function radar MRI and an Engagement Module ME on display during at Le Bourget Airport, near Paris, France on June 18, 2025
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#13404018
5 March 2026
Eurosam SAM missile system by MBDA and Thales Group at Paris Air Show 2025. The Eurosam Future Surface-to-Air Family of missiles or FSAF autonomous guided air shield interceptor system with vertical ground launched system MLT with use of Aster 15 or Aster 30 rockets, multi-function radar MRI and an Engagement Module ME on display during at Le Bourget Airport, near Paris, France on June 18, 2025
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#13404019
5 March 2026
Eurosam SAM missile system by MBDA and Thales Group at Paris Air Show 2025. The Eurosam Future Surface-to-Air Family of missiles or FSAF autonomous guided air shield interceptor system with vertical ground launched system MLT with use of Aster 15 or Aster 30 rockets, multi-function radar MRI and an Engagement Module ME on display during at Le Bourget Airport, near Paris, France on June 18, 2025
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#13404020
5 March 2026
Eurosam SAM missile system by MBDA and Thales Group at Paris Air Show 2025. The Eurosam Future Surface-to-Air Family of missiles or FSAF autonomous guided air shield interceptor system with vertical ground launched system MLT with use of Aster 15 or Aster 30 rockets, multi-function radar MRI and an Engagement Module ME on display during at Le Bourget Airport, near Paris, France on June 18, 2025
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#13404021
5 March 2026
Eurosam SAM missile system by MBDA and Thales Group at Paris Air Show 2025. The Eurosam Future Surface-to-Air Family of missiles or FSAF autonomous guided air shield interceptor system with vertical ground launched system MLT with use of Aster 15 or Aster 30 rockets, multi-function radar MRI and an Engagement Module ME on display during at Le Bourget Airport, near Paris, France on June 18, 2025
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#13404022
5 March 2026
Eurosam SAM missile system by MBDA and Thales Group at Paris Air Show 2025. The Eurosam Future Surface-to-Air Family of missiles or FSAF autonomous guided air shield interceptor system with vertical ground launched system MLT with use of Aster 15 or Aster 30 rockets, multi-function radar MRI and an Engagement Module ME on display during at Le Bourget Airport, near Paris, France on June 18, 2025
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