"HiSilicon"

#13439888

13 March 2026

A close-up of the Samsung Agentic AI branding at the MWC 2026 booth symbolizes a shift from reactive tools to autonomous AI agents that anticipate user intent without explicit commands. The logo is showcased alongside the Galaxy S26 Ultra, which features a 200-megapixel main sensor with wider apertures and the HiSilicon-integrated NPU (or Samsung's proprietary NPU) capable of processing multimodal AI tasks locally. The ''Agentic'' vision is supported by the Snapdragon 8 Elite platform's Hexagon processor, enabling complex decision-making for personalized health insights and proactive device management across the HarmonyOS-integrated (or Android 16-based) Galaxy ecosystem during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13413978

7 March 2026

The Huawei Mate X7 foldable smartphone is presented at the Fira Gran Via, featuring an 8-inch LTPO OLED internal display with 2,500 nits and a 6.49-inch quad-curved cover screen protected by second-generation Kunlun Glass. The device is powered by the HiSilicon Kirin 9030 Pro chipset (6nm) with 16GB of RAM and runs on HarmonyOS 6.0. It highlights its advanced XMAGE triple camera system with a 50-megapixel RYYB main sensor featuring a 10-stop variable aperture (f/1.4-f/4.0), a 50-megapixel periscope telephoto lens with 3.5x optical zoom and macro capabilities, and a 40-megapixel ultra-wide lens. The flagship includes a 5,600mAh silicon-carbon battery and supports dual-mode satellite connectivity for calling and messaging during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413979

7 March 2026

The Huawei Mate X7 foldable smartphone is presented at the Fira Gran Via, featuring an 8-inch LTPO OLED internal display with 2,500 nits and a 6.49-inch quad-curved cover screen protected by second-generation Kunlun Glass. The device is powered by the HiSilicon Kirin 9030 Pro chipset (6nm) with 16GB of RAM and runs on HarmonyOS 6.0. It highlights its advanced XMAGE triple camera system with a 50-megapixel RYYB main sensor featuring a 10-stop variable aperture (f/1.4-f/4.0), a 50-megapixel periscope telephoto lens with 3.5x optical zoom and macro capabilities, and a 40-megapixel ultra-wide lens. The flagship includes a 5,600mAh silicon-carbon battery and supports dual-mode satellite connectivity for calling and messaging during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413980

7 March 2026

The Huawei Mate X7 foldable smartphone is presented at the Fira Gran Via, featuring an 8-inch LTPO OLED internal display with 2,500 nits and a 6.49-inch quad-curved cover screen protected by second-generation Kunlun Glass. The device is powered by the HiSilicon Kirin 9030 Pro chipset (6nm) with 16GB of RAM and runs on HarmonyOS 6.0. It highlights its advanced XMAGE triple camera system with a 50-megapixel RYYB main sensor featuring a 10-stop variable aperture (f/1.4-f/4.0), a 50-megapixel periscope telephoto lens with 3.5x optical zoom and macro capabilities, and a 40-megapixel ultra-wide lens. The flagship includes a 5,600mAh silicon-carbon battery and supports dual-mode satellite connectivity for calling and messaging during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13414082

7 March 2026

The Huawei Mate XT Ultimate Design tri-foldable smartphone is showcased at the Fira Gran Via, featuring a revolutionary 10.2-inch 3K HUAWEI X-True OLED display that transitions through single (6.4''), dual (7.9''), and triple-screen modes with a 3184 x 2232 pixel resolution. The flagship is powered by the HiSilicon Kirin 9010 (7nm) octa-core processor with 16GB of RAM and debuts the Ultra Aperture XMAGE camera system led by a 50-megapixel main sensor with a 10-stop physical variable aperture (f/1.4-f/4.0) and OIS, a 12-megapixel periscope telephoto lens with 5.5x optical zoom, and a 12-megapixel ultra-wide lens. Measuring just 3.6mm thick when fully unfolded, it integrates a 5,600mAh ultra-thin silicon-carbon battery and supports two-way satellite communication during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13414084

7 March 2026

The Huawei Mate XT Ultimate Design tri-foldable smartphone is showcased at the Fira Gran Via, featuring a revolutionary 10.2-inch 3K HUAWEI X-True OLED display that transitions through single (6.4''), dual (7.9''), and triple-screen modes with a 3184 x 2232 pixel resolution. The flagship is powered by the HiSilicon Kirin 9010 (7nm) octa-core processor with 16GB of RAM and debuts the Ultra Aperture XMAGE camera system led by a 50-megapixel main sensor with a 10-stop physical variable aperture (f/1.4-f/4.0) and OIS, a 12-megapixel periscope telephoto lens with 5.5x optical zoom, and a 12-megapixel ultra-wide lens. Measuring just 3.6mm thick when fully unfolded, it integrates a 5,600mAh ultra-thin silicon-carbon battery and supports two-way satellite communication during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13414113

7 March 2026

The Huawei MatePad Edge 2-in-1 tablet is displayed at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring a 14.2-inch Flexible OLED display with a 3.1K (3120 x 2080) resolution, 120Hz refresh rate, and 1,000 nits of peak brightness. The device is powered by the HiSilicon Kirin X90 (or Kirin X90A) processor with up to 16GB of RAM and a built-in dual-fan liquid cooling system for sustained performance. The tablet includes a dual rear camera setup with a 50-megapixel main sensor and an 8-megapixel ultra-wide lens, along with a 32-megapixel front camera, while running on the latest HarmonyOS 6.1, which allows seamless switching between tablet and PC desktop modes during the Mobile World Congress (MWC).

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#13414131

7 March 2026

The Huawei MatePad Edge 2-in-1 tablet is displayed at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring a 14.2-inch Flexible OLED display with a 3.1K (3120 x 2080) resolution, 120Hz refresh rate, and 1,000 nits of peak brightness. The device is powered by the HiSilicon Kirin X90 (or Kirin X90A) processor with up to 16GB of RAM and a built-in dual-fan liquid cooling system for sustained performance. The tablet includes a dual rear camera setup with a 50-megapixel main sensor and an 8-megapixel ultra-wide lens, along with a 32-megapixel front camera, while running on the latest HarmonyOS 6.1, which allows seamless switching between tablet and PC desktop modes during the Mobile World Congress (MWC).

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#13414159

7 March 2026

An ''exploded view'' display of the Huawei Mate XT Ultimate Design tri-foldable smartphone showcases its internal components and engineering at the Fira Gran Via in Barcelona, Spain, on March 5, 2026. The exhibit highlights the complex Tiangong hinge mechanism made of ultra-high strength steel. It features the dissection of the 10.2-inch flexible OLED display panel alongside the HiSilicon Kirin 9010 (7nm) octa-core processor and the layered structure of the 5,600mAh ultra-thin silicon-carbon battery system. Individual modules of the Ultra Aperture XMAGE camera system are visible, including the 50-megapixel main sensor with its 10-stop variable aperture mechanism and the 12-megapixel periscope telephoto lens with 5.5x optical zoom, demonstrating the precise arrangement required to maintain a 3.6mm unfolded thickness during the Mobile World Congress (MWC).

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#13414178

7 March 2026

The Huawei MatePad Mini compact tablet is showcased at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring an 8.8-inch Flexible OLED PaperMatte display with a 2.5K (2560 x 1600) resolution, 120Hz refresh rate, and 1,800 nits peak brightness. The device is powered by the HiSilicon Kirin 9010 (or Kirin 9020) octa-core processor with 12GB of RAM and runs on HarmonyOS 5.1/6.0 with support for the HUAWEI M-Pencil Pro (2ms latency). It features a dual rear camera system with a 50-megapixel main sensor (f/1.8) and an 8-megapixel ultra-wide lens, along with a high-resolution 32-megapixel front camera for professional video conferencing. The tablet includes a 6,400mAh battery with 66W SuperCharge and introduces two-way BeiDou satellite messaging in a slim 5.1mm magnesium alloy body during the Mobile World Congress (MWC).

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#9710906

8 March 2023

The HiSilicon logo is seen in this illustration photo in Warsaw, Poland on 08 March, 2023. HiSilicon is one of the largest silicon semiconductor chipmakers in China.

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