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"XPLORE 6 Pro"
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#13413395
7 March 2026
The Blackview XPLORE 6 Pro, the brand's flagship rugged smartphone powered by the MediaTek Dimensity 9400+ 4nm platform, demonstrates a live thermal imaging feed on a monitor showing a human heat signature. This highlights its integrated 256x192 high-resolution thermal module and its 50-megapixel main camera sensor as the company showcases its ''AI x Rugged'' ecosystem during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413396
7 March 2026
The Blackview XPLORE 6, the world's first rugged flagship smartphone powered by the MediaTek Dimensity 9400+ platform, is pictured partially buried in sand to demonstrate its IP68/IP69K and MIL-STD-810H certifications. It features a 6.73-inch AMOLED display and a professional imaging system with a 50-megapixel periscope telephoto lens during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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Commercial use is not permitted without prior authorization.
Please contact us for more information.