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"connectivity module."
15 professional editorial images found
#12685550
28 August 2025
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, including the X82 5G M.2 module and the LGA module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. These components are exhibited in the Qualcomm pavilion during the Mobile World Congress 2025.
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#12685584
28 August 2025
The MEiglink SRM819W module features advanced wireless connectivity technology designed for high-performance applications in IoT and smart devices. It is exhibited in the Qualcomm pavilion during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12685551
28 August 2025
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, the X82 5G LGA Module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. It is exhibited in the Qualcomm pavilion during the Mobile World Congress 2025.
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#12685552
28 August 2025
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, the X82 5G M.2 Module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. It is exhibited in the Qualcomm pavilion during the Mobile World Congress 2025.
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#12685571
28 August 2025
In Barcelona, Spain, on March 5, 2025, a close-up of Fibocom chipset components, including the FG200-NA and FG131-NA modules, highlights advanced 5G connectivity and IoT-ready technology for next-generation smart devices. These components are exhibited in the Qualcomm pavilion during the Mobile World Congress 2025.
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#12685358
28 August 2025
In Barcelona, Spain, on March 5, 2025, a Vslam demonstration, the Visual Simultaneous Location and Mapping technology that allows a robot or other system to simultaneously determine its position in an environment, takes place by the Chinese supplier of cellular modules and solutions MeiG Smart Technology during the Mobile World Congress 2025.
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#12227019
23 May 2025
The Compal RML-NV2 Module chip, a chip by the Taiwanese company Compal and the semiconductor manufacturer MediaTek, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12227015
23 May 2025
The Quectel RG225G, a 5G RedCap MediaTek-based module chip developed by the Taiwanese semiconductor company together with the Canadian Quectel Wireless Solutions, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12227018
23 May 2025
The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed for 5G IoT applications, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397028
22 May 2025
The Compal RML-NV2 Module chip, a chip by the Taiwanese company Compal and the semiconductor manufacturer MediaTek, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397026
22 May 2025
The Quectel RG225G, a 5G RedCap MediaTek-based module chip developed by the Taiwanese semiconductor company together with the Canadian Quectel Wireless Solutions, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397027
22 May 2025
The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed for 5G IoT applications, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12238797
7 April 2025
LAS VEGAS, USA - JANUARY 08: A detailed look at a PC computer equipped with an Intel Core processor, Intel Arc graphics processing units, and CORSAIR Dominator Titanium DDR5 Memory on display at the Consumer Electronics Show (CES) 2025, in Las Vegas, Nevada, USA, on January 8 2025.
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#11115169
2 April 2024
MeiG Smart Technologies is exhibiting its Smart POS Solutions modules at the Mobile World Congress 2024 in Barcelona, Spain, on April 2, 2024. These modules are designed to be integrated into a variety of everyday devices, including points of sale.
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#11115170
2 April 2024
MeiG Smart Technologies is exhibiting its Smart POS Solutions modules at the Mobile World Congress 2024 in Barcelona, Spain, on April 2, 2024. These modules are designed to be integrated into a variety of everyday devices, including points of sale.
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