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"electronics components"
723 professional editorial images found
#13426903
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426905
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426908
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426910
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426912
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426913
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426914
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426915
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426916
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13414159
7 March 2026
An ''exploded view'' display of the Huawei Mate XT Ultimate Design tri-foldable smartphone showcases its internal components and engineering at the Fira Gran Via in Barcelona, Spain, on March 5, 2026. The exhibit highlights the complex Tiangong hinge mechanism made of ultra-high strength steel. It features the dissection of the 10.2-inch flexible OLED display panel alongside the HiSilicon Kirin 9010 (7nm) octa-core processor and the layered structure of the 5,600mAh ultra-thin silicon-carbon battery system. Individual modules of the Ultra Aperture XMAGE camera system are visible, including the 50-megapixel main sensor with its 10-stop variable aperture mechanism and the 12-megapixel periscope telephoto lens with 5.5x optical zoom, demonstrating the precise arrangement required to maintain a 3.6mm unfolded thickness during the Mobile World Congress (MWC).
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#13406549
6 March 2026
A close-up view of the base unit of the TECNO Modular Magnetic Concept Phone (ATOM Edition) is on display at MWC 2026. The device showcases an industry-leading ultra-slim profile of just 4.9mm, achieved by relocating traditional internal components into external magnetic modules. The rear of the handset features a specialized Magnetic Interconnection surface with exposed contact points, allowing for seamless power and data transfer with various hardware attachments. Its minimalist silver finish and compact form factor represent a radical departure from traditional smartphone architecture, prioritizing a ''thin-and-light'' core that can be expanded on demand during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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#13405039
5 March 2026
A close-up of a printed circuit board (PCB).
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#13405037
5 March 2026
In this photo illustration, a close-up of a printed circuit board (PCB) is seen, while the Tokyo Electron logo is displayed on a screen in the background. Tokyo Electron manufactures equipment used in semiconductor production in Athens, Greece, on March 5, 2026.
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#13405028
5 March 2026
In this photo illustration, a close-up of a printed circuit board (PCB) is seen, while the AMD logo is displayed on a screen in the background. AMD develops CPUs and GPUs for many computing markets in Athens, Greece, on March 5, 2026.
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#13405029
5 March 2026
In this photo illustration, a close-up of a printed circuit board (PCB) is seen, while the Intel logo is displayed on a screen in the background. Intel designs and manufactures CPUs and other chips in Athens, Greece, on March 5, 2026.
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#13405031
5 March 2026
In this photo illustration in Athens, Greece, on March 5, 2026, a close-up of a printed circuit board (PCB) is seen, while the Qualcomm logo is displayed on a screen in the background. Qualcomm is one of the biggest semiconductor companies making chipsets.
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