"image stabilization"

#13457265

16 Mar 2026

A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.

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#13457266

16 Mar 2026

A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.

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#13457267

16 Mar 2026

A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.

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#13413849

7 Mar 2026

The Xiaomi AI Glasses display at the Fira Gran Via, featuring a lightweight 40g D-shaped nylon frame and a 12-megapixel Sony IMX681 high-definition camera capable of recording 2K video at 30 fps with electronic image stabilization (EIS). The wearable is powered by the Qualcomm Snapdragon AR1 low-power platform with 4GB of RAM and 32GB of storage, running on Xiaomi Vela OS and HyperOS for seamless multimodal AI interactions, real-time audio translation, and smart home control via a five-microphone array and dual open-ear speakers during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413890

7 Mar 2026

The Honor Magic V6 foldable smartphone is showcased at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring an ultra-slim 8.75mm chassis and a 7.95-inch LTPO 2.0 AMOLED internal display with a 120Hz refresh rate and 5,000 nits peak brightness. The device is powered by the Qualcomm Snapdragon 8 Elite Gen 5 processor with 16GB of LPDDR5X RAM and debuts the world's first IP68/IP69 dual-rated protection for foldables. The triple camera system includes a 50-megapixel main sensor (f/1.6) with OIS, a 64-megapixel periscope telephoto lens with CIPA 6.5 image stabilization, and a 50-megapixel ultra-wide lens, all supported by a massive 6,660mAh silicon-carbon battery and MagicOS 10 based on Android 16.

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#13413891

7 Mar 2026

The Honor Magic V6 foldable smartphone is showcased at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring an ultra-slim 8.75mm chassis and a 7.95-inch LTPO 2.0 AMOLED internal display with a 120Hz refresh rate and 5,000 nits peak brightness. The device is powered by the Qualcomm Snapdragon 8 Elite Gen 5 processor with 16GB of LPDDR5X RAM and debuts the world's first IP68/IP69 dual-rated protection for foldables. The triple camera system includes a 50-megapixel main sensor (f/1.6) with OIS, a 64-megapixel periscope telephoto lens with CIPA 6.5 image stabilization, and a 50-megapixel ultra-wide lens, all supported by a massive 6,660mAh silicon-carbon battery and MagicOS 10 based on Android 16.

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#13413892

7 Mar 2026

The Honor Magic V6 foldable smartphone is showcased at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring an ultra-slim 8.75mm chassis and a 7.95-inch LTPO 2.0 AMOLED internal display with a 120Hz refresh rate and 5,000 nits peak brightness. The device is powered by the Qualcomm Snapdragon 8 Elite Gen 5 processor with 16GB of LPDDR5X RAM and debuts the world's first IP68/IP69 dual-rated protection for foldables. The triple camera system includes a 50-megapixel main sensor (f/1.6) with OIS, a 64-megapixel periscope telephoto lens with CIPA 6.5 image stabilization, and a 50-megapixel ultra-wide lens, all supported by a massive 6,660mAh silicon-carbon battery and MagicOS 10 based on Android 16.

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#13413893

7 Mar 2026

The Honor Magic V6 foldable smartphone is showcased at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring an ultra-slim 8.75mm chassis and a 7.95-inch LTPO 2.0 AMOLED internal display with a 120Hz refresh rate and 5,000 nits peak brightness. The device is powered by the Qualcomm Snapdragon 8 Elite Gen 5 processor with 16GB of LPDDR5X RAM and debuts the world's first IP68/IP69 dual-rated protection for foldables. The triple camera system includes a 50-megapixel main sensor (f/1.6) with OIS, a 64-megapixel periscope telephoto lens with CIPA 6.5 image stabilization, and a 50-megapixel ultra-wide lens, all supported by a massive 6,660mAh silicon-carbon battery and MagicOS 10 based on Android 16.

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#13413902

7 Mar 2026

The Honor Magic 8 Pro flagship smartphone is showcased at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring a 6.71-inch LTPO OLED display with a 120Hz refresh rate and a peak brightness of 6,000 nits. Powered by the Qualcomm Snapdragon 8 Elite Gen 5 mobile platform with 12GB of RAM, the device debuts the AiMAGE camera system led by a 200-megapixel Samsung ISOCELL HP9 periscope telephoto lens (f/2.6, 1/1.4-inch sensor) with 3.7x optical zoom and CIPA 5.5-level image stabilization. It also includes a 50-megapixel main sensor (f/1.6, 1/1.3-inch) and a 50-megapixel ultra-wide lens, all supported by a high-density 7,200mAh silicon-carbon battery (China/International variant) with 120W wired charging and IP69K water resistance during the Mobile World Congress (MWC).

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#13413907

7 Mar 2026

The Honor Magic 8 Pro flagship smartphone is showcased at the Fira Gran Via, featuring a 6.71-inch LTPO OLED display with a 120Hz refresh rate and a peak brightness of 6,000 nits. Powered by the Qualcomm Snapdragon 8 Elite Gen 5 mobile platform with 12GB of RAM, the device debuts the AiMAGE camera system led by a 200-megapixel Samsung ISOCELL HP9 periscope telephoto lens (f/2.6, 1/1.4-inch sensor) with 3.7x optical zoom and CIPA 5.5-level image stabilization. It also includes a 50-megapixel main sensor (f/1.6, 1/1.3-inch) and a 50-megapixel ultra-wide lens, all supported by a high-density 7,200mAh silicon-carbon battery (China/International variant) with 120W wired charging and IP69K water resistance during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413912

7 Mar 2026

The Honor Magic 8 Pro flagship smartphone is showcased at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring a 6.71-inch LTPO OLED display with a 120Hz refresh rate and a peak brightness of 6,000 nits. Powered by the Qualcomm Snapdragon 8 Elite Gen 5 mobile platform with 12GB of RAM, the device debuts the AiMAGE camera system led by a 200-megapixel Samsung ISOCELL HP9 periscope telephoto lens (f/2.6, 1/1.4-inch sensor) with 3.7x optical zoom and CIPA 5.5-level image stabilization. It also includes a 50-megapixel main sensor (f/1.6, 1/1.3-inch) and a 50-megapixel ultra-wide lens, all supported by a high-density 7,200mAh silicon-carbon battery (China/International variant) with 120W wired charging and IP69K water resistance during the Mobile World Congress (MWC).

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#13398571

4 Mar 2026

The Samsung Galaxy S26 Ultra high-end smartphone by Samsung is shown in close-up to highlight its rear multi-lens camera system, with a banner in the background displaying ''Galaxy AI.'' It features a 200 MP main sensor with advanced AI image processing, a 12 MP ultra-wide lens, a 10 MP periscope telephoto lens with 10x optical zoom, and a 10 MP telephoto lens with 3x optical zoom, all equipped with optical image stabilization (OIS) and computational photography enhancements. This emphasizes innovation in mobile photography, flagship Android device engineering, and intelligent camera technology at the Mobile World Congress (MWC) in Barcelona, Spain, on March 3, 2026.

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#11199136

1 May 2024

The DJI logo is displayed on a smartphone screen and on a computer screen in Athens, Greece, on May 1, 2024.

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#11199137

1 May 2024

The DJI logo is displayed on a smartphone screen and on a computer screen in Athens, Greece, on May 1, 2024.

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#11199138

1 May 2024

The DJI logo is displayed on a smartphone screen and on a computer screen in Athens, Greece, on May 1, 2024.

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#11088281

20 Mar 2024

The camera module on an iPhone 13 Pro Max is seen in this photo illustration in Warsaw, Poland on 20 March, 2024.

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