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"semiconductor technology"
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#13439923
13 March 2026
The MediaTek corporate logo is displayed at the Fira Gran Via booth with the slogan ''Complete End-to-End Solutions,'' highlighting the company's ''AI For Life'' ecosystem during the Mobile World Congress. The exhibit features the flagship Dimensity 9500 processor, built on a 3nm process with an All-Big-Core architecture (Cortex-X925 ultra core at 3.73 GHz) and the NPU 890 for advanced generative AI. The branding emphasizes MediaTek's leadership in connectivity, showcasing the Dimensity Auto MT2739 telematics platform with 3GPP Release 17/18 NR-NTN satellite support and the first wave of Wi-Fi 8 solutions using the Filogic 8000 series chipsets. The display highlights the convergence of edge-to-cloud intelligence, including Sovereign AI for automotive cockpits and RedCap (Reduced Capability) technology for mass-market 5G IoT devices during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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#13439908
13 March 2026
The Snapdragon corporate logo is illuminated at the Qualcomm pavilion in Hall 3 of the Fira Gran Via, representing the launch of the Snapdragon 8 Elite Gen 5 (SM8850-AC) mobile platform during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The 3nm architecture processor features the new Oryon V3 CPU and an enhanced Hexagon NPU capable of delivering over 80 TOPS for on-device generative AI. The branding highlights the expansion of the Snapdragon ecosystem into automotive with the Snapdragon Cockpit Elite and computing with the Snapdragon X Elite Gen 2, which powers the latest Windows 11 Copilot+ PCs. The exhibit showcases seamless multimodal AI processing across smartphones, XR glasses, and connected vehicles, emphasizing the Qualcomm AI Stack and ultra-low latency 5G-Advanced connectivity through the Snapdragon X85 Modem-RF System.
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#13439910
13 March 2026
The Intel corporate logo is showcased at the Fira Gran Via booth, highlighting the company's role in the ''AI Everywhere'' era during the Mobile World Congress. The exhibit features the latest Intel Core Ultra 300 (Series 3) processors with integrated NPU 5.0, delivering over 50 TOPS for local generative AI processing. The display highlights the Intel Xeon 6 processors with P-cores and E-cores for optimized telecom workloads and the Intel vPro platform's new security features for AI-ready enterprise fleets. Visitors observe demonstrations of the OpenVINO 2026.0 toolkit for cross-architectural AI deployment and the Intel Gaudi 4 AI accelerator, designed to compete in the large-scale LLM training and inference market for sovereign cloud providers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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#13439911
13 March 2026
The Intel corporate logo is showcased at the Fira Gran Via booth, highlighting the company's role in the ''AI Everywhere'' era during the Mobile World Congress. The exhibit features the latest Intel Core Ultra 300 (Series 3) processors with integrated NPU 5.0, delivering over 50 TOPS for local generative AI processing. The display highlights the Intel Xeon 6 processors with P-cores and E-cores for optimized telecom workloads and the Intel vPro platform's new security features for AI-ready enterprise fleets. Visitors observe demonstrations of the OpenVINO 2026.0 toolkit for cross-architectural AI deployment and the Intel Gaudi 4 AI accelerator, designed to compete in the large-scale LLM training and inference market for sovereign cloud providers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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#13439927
13 March 2026
The MediaTek corporate logo features at the Fira Gran Via booth, representing the company's ''AI For Life: From Edge to Cloud'' strategy during the Mobile World Congress. The exhibit showcases the flagship Dimensity 9500 processor, built on TSMC's 3nm (N3P) process and featuring an All Big Core architecture with a Cortex-X925 ultra-core clocked at 3.73 GHz. The display highlights the new NPU 9.0 (Neural Processing Unit) delivering 100 TOPS of computing power for on-device generative video and agentic AI. The branding encompasses the Dimensity Auto MT2739 platform for satellite-connected vehicles and the first commercial Wi-Fi 8 solutions using the Filogic 8000 series, emphasizing MediaTek's leadership in high-speed, low-latency connectivity for smartphones, IoT, and next-generation data centers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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#13426903
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426905
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426908
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426910
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426912
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426913
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426914
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426915
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13426916
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
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#13424869
9 March 2026
The Navitas Semiconductor logo appears on a smartphone screen in this photo illustration in Ontario, Canada, on March 9, 2026.
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#13413609
7 March 2026
The Qualcomm corporate logo is prominently displayed at Booth 3E10 during the Fira Gran Via exhibition, marking the launch of the Snapdragon Wear Elite platform for personal AI wearables and the Qualcomm X105 5G Modem-RF System, the world's first 3GPP Release 19-ready solution. The showcase features the new FastConnect 8800 connectivity system with Wi-Fi 8 integration and a GigaMIMO 6G prototype demonstrating AI-native air interface sensing and distributed computing capabilities for the next decade of mobile infrastructure during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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