Search Editorial Photos
"tech disruption."
287 professional editorial images found
#13439902
13 March 2026
A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodynamics flaps designed for the 2026 FIA technical regulations. The challenger, powered by the Mercedes-AMG F1 M17 E Performance V6 Turbo Hybrid unit, features a simplified front wing assembly with movable elements that adjust between Z-mode (high downforce) and X-mode (low drag). The chassis integrates the IndraMind sovereign AI platform to manage real-time sensor data from the front-end telemetry, optimizing the 50/50 power split between the internal combustion engine and the 350kW MGU-K electric motor. The front suspension utilizes a pull-rod configuration to minimize aerodynamic disruption, while the 18-inch wheels feature the new mandatory active rim covers for thermal management during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#13439903
13 March 2026
A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodynamics flaps designed for the 2026 FIA technical regulations. The challenger, powered by the Mercedes-AMG F1 M17 E Performance V6 Turbo Hybrid unit, features a simplified front wing assembly with movable elements that adjust between Z-mode (high downforce) and X-mode (low drag). The chassis integrates the IndraMind sovereign AI platform to manage real-time sensor data from the front-end telemetry, optimizing the 50/50 power split between the internal combustion engine and the 350kW MGU-K electric motor. The front suspension utilizes a pull-rod configuration to minimize aerodynamic disruption, while the 18-inch wheels feature the new mandatory active rim covers for thermal management during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#13439904
13 March 2026
A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodynamics flaps designed for the 2026 FIA technical regulations. The challenger, powered by the Mercedes-AMG F1 M17 E Performance V6 Turbo Hybrid unit, features a simplified front wing assembly with movable elements that adjust between Z-mode (high downforce) and X-mode (low drag). The chassis integrates the IndraMind sovereign AI platform to manage real-time sensor data from the front-end telemetry, optimizing the 50/50 power split between the internal combustion engine and the 350kW MGU-K electric motor. The front suspension utilizes a pull-rod configuration to minimize aerodynamic disruption, while the 18-inch wheels feature the new mandatory active rim covers for thermal management during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#13426903
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#13426905
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#13426908
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#13426910
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#13426912
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#13426913
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#13426914
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#13426915
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#13426916
10 March 2026
The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#13331630
16 February 2026
The Seedance2.0 logo appears on a mobile phone with the company branding visible in the background in this photo illustration in Brussels, Belgium, on February 16, 2026.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#13331631
16 February 2026
The Seedance2.0 logo appears on a mobile phone with the company branding visible in the background in this photo illustration in Brussels, Belgium, on February 16, 2026.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#13331632
16 February 2026
The Seedance2.0 app appears on a mobile phone with the company branding visible in the background in this photo illustration in Brussels, Belgium, on February 16, 2026.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#13331633
16 February 2026
The Seedance2.0 app appears on a mobile phone with the company branding visible in the background in this photo illustration in Brussels, Belgium, on February 16, 2026.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.