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Technology Trade Show

In Barcelona, Spain, on March 5, 2025, a close-up of Fibocom chipset components, including the FG200-NA and FG131-NA modules, highlights advanced 5G connectivity and IoT-ready technology for next-generation smart devices. These components are exhibited in the Qualcomm pavilion during the Mobile World Congress 2025. (Photo by Joan Cros/NurPhoto)

Photo Details

Photo ID	#12685571
Date Taken	5 March 2025
Location	N/A
Photographer	Joan Cros/NurPhoto
Category	Science and Technology
Copyright	© 2026 NurPhoto - Joan Cros/NurPhoto

Related Keywords

Mobile World Congress MWC MWC25 AI Artificial intelligence connectivity telecom telecommunication telecommunications Mobile Event Mobile Fair congress tech technology open AI generative AI AGI generative artificial intelligence Qualcom chip 5G Barcelona Spain March 5 Fibocom chipset components FG200-NA FG131-NA modules advanced 5G connectivity IoT-ready technology next-generation smart devices Qualcom pavilion Mobile World Congress 2025 exhibition Joan Cros NurPhoto telecommunications innovation wireless mobile technology connectivity solutions digital transformation tech industry global event networking technology showcase electronic components wireless communication tech exhibition.

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