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"Fibocom"
3 professional editorial images found
#12685571
28 August 2025
In Barcelona, Spain, on March 5, 2025, a close-up of Fibocom chipset components, including the FG200-NA and FG131-NA modules, highlights advanced 5G connectivity and IoT-ready technology for next-generation smart devices. These components are exhibited in the Qualcomm pavilion during the Mobile World Congress 2025.
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#12227018
23 May 2025
The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed for 5G IoT applications, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397027
22 May 2025
The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed for 5G IoT applications, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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